Flowing boiling micro-miniature heat exchanger

Abstract

The invention discloses a flowing boiling micro-miniature heat exchanger, which comprises a heat exchanger casing, a heat exchange structure passage, an inlet passage and an outlet passage, wherein the heat exchange structure passage is arranged in the heat exchanger casing; and the inlet passage and the outlet passage are arranged at the two ends of the heat exchange structure passage. The flowing boiling micro-miniature heat exchanger is characterized in that the inlet passage consists of a condensing medium input opening, a flow storage pool and an inlet flow division passage; the flow storage pool is connected between the condensing medium input opening and the inlet flow division passage; the outlet passage consists of a condensing medium output opening and an outlet flow division passage; a micro rib column group and support columns are arranged in the heat exchange structure passage; the micro rib column group consists of micro rib columns; the cross section dimension of the micro rib columns conforms to the fractal Brownian motion features; the micro rib columns are in planar distribution; the height of the micro rib columns meets the normal distribution; and the support columns are distributed in the center of the micro rib column group in an array mode. The flowing boiling micro-miniature heat exchanger has the advantages that the heat transfer efficiency is high; the flowing resistance loss is small; the surface temperature of the heat exchanger is uniform; the work is stable; and the service life is long.

Description

technical field [0001] The invention relates to a heat exchange device, in particular to a flow boiling heat exchanger with a porous structure with random fractal characteristics designed to enhance the heat exchange performance of high heat flow. Background technique [0002] With the continuous development of microelectronics technology, all kinds of electronic devices are developing in the direction of miniaturization, integration and high frequency and high speed. The heat flux of electronic devices has increased sharply, which makes the stability and service life of electronic devices face great challenges. , Seriously restricting the further development of microelectronics technology applications. Therefore, optimizing the heat transfer performance of the heat sink for electronic components and effectively reducing the temperature of electronic components in a timely manner, so that electronic components can work stably and safely, has become an urgent problem to be so...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the deficiencies in the design of existing flow boiling heat exchangers and the problem that the combination of economic benefits and heat transfer efficiency cannot be maximized, the present invention provides a flow boiling heat exchanger with high heat exchange efficiency and easy miniaturization and miniaturization. heater

Images