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Flowing boiling micro-miniature heat exchanger

A heat exchanger, micro-miniature technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems that the combination of economic benefits and heat transfer efficiency cannot be maximized, so as to improve the service life , reduce operating costs, reduce the effect of resistance loss

Active Publication Date: 2016-10-26
SOUTHEAST UNIV
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  • Application Information

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Problems solved by technology

[0004] In order to solve the deficiencies in the design of existing flow boiling heat exchangers and the problem that the combination of economic benefits and heat transfer efficiency cannot be maximized, the present invention provides a flow boiling heat exchanger with high heat exchange efficiency and easy miniaturization and miniaturization. heater

Method used

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  • Flowing boiling micro-miniature heat exchanger
  • Flowing boiling micro-miniature heat exchanger
  • Flowing boiling micro-miniature heat exchanger

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Embodiment Construction

[0020] The present invention will be further described in conjunction with accompanying drawing:

[0021] The structure of the flow boiling miniature heat exchanger proposed by the present invention is as follows: figure 1 As shown, the flow boiling miniature heat exchanger mainly includes an upper cover plate 2, a heat conducting base plate 3 and a boiling heat exchanger main body 1, and the combination of the upper cover plate 2 and the heat conducting base plate 3 forms a closed confined space. The inner surface of the thermally conductive substrate forms a layer of nanomaterials with a three-dimensional network structure through the sol-gel method. The surface water contact angle of this material is between 95° and 160°, and the hydrophobicity is extremely strong. The core of gasification, and at the same time, it will not cause a large resistance loss to the condensing medium.

[0022] figure 2 It is the front view of the flow boiling micro heat exchanger. In order to ...

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Abstract

The invention discloses a flowing boiling micro-miniature heat exchanger, which comprises a heat exchanger casing, a heat exchange structure passage, an inlet passage and an outlet passage, wherein the heat exchange structure passage is arranged in the heat exchanger casing; and the inlet passage and the outlet passage are arranged at the two ends of the heat exchange structure passage. The flowing boiling micro-miniature heat exchanger is characterized in that the inlet passage consists of a condensing medium input opening, a flow storage pool and an inlet flow division passage; the flow storage pool is connected between the condensing medium input opening and the inlet flow division passage; the outlet passage consists of a condensing medium output opening and an outlet flow division passage; a micro rib column group and support columns are arranged in the heat exchange structure passage; the micro rib column group consists of micro rib columns; the cross section dimension of the micro rib columns conforms to the fractal Brownian motion features; the micro rib columns are in planar distribution; the height of the micro rib columns meets the normal distribution; and the support columns are distributed in the center of the micro rib column group in an array mode. The flowing boiling micro-miniature heat exchanger has the advantages that the heat transfer efficiency is high; the flowing resistance loss is small; the surface temperature of the heat exchanger is uniform; the work is stable; and the service life is long.

Description

technical field [0001] The invention relates to a heat exchange device, in particular to a flow boiling heat exchanger with a porous structure with random fractal characteristics designed to enhance the heat exchange performance of high heat flow. Background technique [0002] With the continuous development of microelectronics technology, all kinds of electronic devices are developing in the direction of miniaturization, integration and high frequency and high speed. The heat flux of electronic devices has increased sharply, which makes the stability and service life of electronic devices face great challenges. , Seriously restricting the further development of microelectronics technology applications. Therefore, optimizing the heat transfer performance of the heat sink for electronic components and effectively reducing the temperature of electronic components in a timely manner, so that electronic components can work stably and safely, has become an urgent problem to be so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 张程宾陈永平黄永平
Owner SOUTHEAST UNIV
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