5 results about "Flow boiling" patented technology

This invention discloses an experimental apparatus and its fabrication and experimental method for studying the effects of local deformation in a narrow rectangular flow channel. The apparatus includes an experimental chamber formed by the detachable and sealed connection of upper and lower pressure-bearing shells, independent chambers connected at both ends, and replaceable deformable insert components. The insert body is integrally machined onto the surface of a heating plate and fixed to a placement slot in the lower pressure-bearing shell using thermally conductive adhesive. The apparatus integrates electrode components, multi-point fiber optic temperature measurement, and a liquid film sensor, and is equipped with wide and narrow viewing windows for observing bubble behavior and liquid film dynamics, respectively. The viewing windows utilize a window gasket + pressure plate + bolt structure for reliable sealing. During fabrication, each component is machined separately, then the heating plate, electrodes, and sensors are installed sequentially, and finally the upper pressure-bearing shell is closed and the viewing windows are assembled. This apparatus features a compact structure, reliable sealing, high visualization, and supports rapid replacement of deformable inserts with different geometric parameters, making it suitable for high-precision thermo-hydraulic experimental research on flow boiling and heat transfer deterioration.

This application provides a targeted immersion phase change heat sink, relating to the field of electronic device heat dissipation technology, to address the problems of large coolant consumption and potential safety hazards. It includes a housing and a microchannel heat dissipation structure. The housing is equipped with cooling medium pipelines and vapor pipelines. The microchannel heat dissipation structure is disposed within the housing, with its cooling medium inlet connected to the cooling medium pipelines. The cooling medium is introduced into the microchannel heat dissipation structure, where it undergoes flow and boiling. The resulting two-phase fluid, after absorbing heat, exits from the cooling medium outlet of the microchannel heat dissipation structure into the immersion chamber of the housing. Vapor enters the gas phase space and exits through the vapor pipeline, while liquid remains in the liquid phase space of the immersion chamber and flows over the outer surface of the microchannel heat dissipation structure, which has a porous layer. By concentrating two-phase immersion cooling and flow boiling cooling within a single housing, only localized cooling of the chip is achieved, reducing coolant consumption and providing a stable and reliable thermal management environment.

The application discloses a micro-channel super-high heat flow boiling experiment chip integrated with heating and temperature measurement and a manufacturing method thereof, belongs to the technical field of boiling heat exchange experiment equipment, and can be applied to boiling mechanism research and performance test. The application aims to solve the problems of separation of heating and temperature measurement, low measurement precision, poor working condition matching, and low system integration of the existing super-high heat flow boiling experiment device. The experiment chip adopts a layered integrated structure and comprises a substrate unit, a heating unit, a temperature measurement unit, a micro-flow channel unit and a packaging matching unit. The heating and temperature measurement units are co-planarly integrated on the surface of the substrate, and the temperature measurement unit is distributed around the effective heating area of the heating unit and the periphery. The micro-flow channel unit covers the effective heating area and the temperature measurement unit and is sealed and bonded with the substrate. The packaging matching unit realizes electrical and fluid communication between the chip and an external system. The application has high integration and compact structure, and can realize in-situ, synchronous and distributed high-precision measurement of the wall temperature field of super-high heat flow boiling.

The present application relates to a kind of plate heat exchanger refrigerant flow boiling heat flow simulation method and the prediction system of the method is executed, by based on nucleation point approximation Poisson distribution and dryout region wall heat flow partition model, nucleation point distribution and its influence on heat transfer are characterized, while through the wall surface partition design of space-time two dimensions, wall heat flow partition model covering full boiling condition is built, in combination with the multi-item coupling calculation of total heat flow and the fine modeling of dryout region, the prediction interval of boiling heat transfer is effectively widened, can realize nucleate boiling, critical heat flow and the accurate calculation of wall heat flow of transition boiling full working condition.