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Micro-needle rib cluster array micro-channel micro heat exchanger

A technology of microchannel and heat exchanger, applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve the problems of high boiling starting point, low critical heat flux density, boiling instability, etc., to reduce Boiling starting point, increasing critical heat flux, eliminating the effect of fluid boiling instability

Pending Publication Date: 2019-02-22
NORTH CHINA ELECTRIC POWER UNIV (BAODING) +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the design of microchannel heat exchangers currently used for boiling heat transfer has the following limitations: first, the large pressure drop caused by small-scale flow boiling; Nano-scale, fewer suitable size nucleation holes lead to higher boiling initiation point and lower critical heat flux; third, it is easier to generate boiling instability

Method used

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  • Micro-needle rib cluster array micro-channel micro heat exchanger
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  • Micro-needle rib cluster array micro-channel micro heat exchanger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The micro-needle-fin cluster array micro-channel micro-heat exchanger consists of an encapsulation sheet 1 and a micro-channel substrate 2 . The packaging sheet is made of 7740 heat-resistant glass, the substrate is made of silicon, and the working fluid is made of acetone. Because the cost of high-power chips is very expensive, this embodiment uses simulated heat sources instead of chips for performance testing experiments. The simulated heat source adopts Pt platinum metal serpentine heating film. After design optimization, the heating film can generate heat evenly, simulating the heat generation of high-power chips. The input voltage of the platinum heating film can be determined according to the heat generated by the chip.

[0040] Such as image 3 As shown, a uniform serpentine Pt platinum metal film with a thickness of 100 nanometers is plated on the back of the silicon substrate through the coating technology, and the heat generated after power-on simulates th...

Embodiment 2

[0042] The micro-needle-fin cluster array micro-channel micro-heat exchanger consists of an encapsulation sheet 1 and a micro-channel substrate 2 . The packaging sheet is made of 7740 heat-resistant glass, the substrate is made of silicon, and the working fluid is made of acetone. Because the cost of high-power chips is very expensive, this embodiment uses simulated heat sources instead of chips for performance testing experiments. The simulated heat source adopts Pt platinum metal serpentine heating film. After design optimization, the heating film can generate heat evenly, simulating the heat generation of high-power chips. The input voltage of the platinum heating film can be determined according to the heat generated by the chip.

[0043] Such as image 3 As shown, a uniform serpentine Pt platinum metal film with a thickness of 100 nanometers is plated on the back of the silicon substrate through the coating technology, and the heat generated after power-on simulates th...

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Abstract

A micro-needle rib cluster array micro-channel micro heat exchanger belongs to the field of enhanced heat transfer of microelectronic technology. The micro-needle rib cluster array micro-channel microheat exchanger comprises a packaging sheet (1) and a substrate (2) which are successively stacked and packaged together. A fluid inlet (3) and a fluid outlet (4) connected to an external pipeline aredisposed on the packaging sheet (1). A micro-needle rib cluster array micro-channel (5), an inlet reservoir (6) and an outlet reservoir (7) are processed on the front side of the substrate. The micro-needle rib cluster elements in a micro-needle rib cluster array are arranged successively. The X-direction spacing L, the Y-direction spacing Lb, and the X-direction structure size La and Y-directionstructure size H of the micro-needle rib cluster unit all can be optimized according to actual needs and achieved by MEMS processing technology. Compared with a general micro-channel micro heat exchanger, the micro-needle rib cluster array micro-channel micro heat exchanger can meet the heat dissipation of a large-power electronic chip, has the advantages of low boiling initial point wall temperature, low flow boiling pressure drop, and high temperature distribution uniformity on the chip. A high thermal flow electronic device enables efficient thermal management.

Description

technical field [0001] The invention belongs to the technical field of enhanced heat exchange, and relates to a micro-needle-fin array micro-channel micro-heat exchanger. Background technique [0002] With the continuous development of functional and compact microelectronic devices, advanced micro-energy and microelectronic systems such as concentrated solar photovoltaic panels, radars, and laser weapon electromagnetic guns are highly modularized and miniaturized, and the number of electronic components in a limited volume is rapidly increasing. increasing, the packaging density continues to increase, and the heat flux density continues to increase, resulting in the problem of excessive local temperature of microelectronic devices becoming increasingly prominent. According to incomplete statistics, 55% of the failure rate of electronic equipment is caused by the temperature exceeding the specified value of electronic components. The working reliability of devices is very se...

Claims

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Application Information

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IPC IPC(8): H01L23/427
CPCH01L23/427
Inventor 宗露香夏国栋汤宇轩马丹丹
Owner NORTH CHINA ELECTRIC POWER UNIV (BAODING)
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