Flowing boiling immersion type liquid cooling device

Abstract

The invention discloses a flowing boiling immersion type liquid cooling device, and relates to the technical field of server hardware equipment. The device comprises a cooling unit, the cooling unit comprises a square box body, and the box body is filled with cooling liquid capable of generating phase change. A mainboard is fixedly arranged on a left side plate and / or a right side plate of the boxbody, and the mainboard is immersed in the cooling liquid. An air return port, an overflow port and a liquid inlet pipe are sequentially arranged on a front side plate of the box body from top to bottom, wherein the air return port is connected with an inlet of an air-cooled condenser, an outlet of the air-cooled condenser is connected with a first inlet of the liquid storage tank, the overflow port is connected with a second inlet of the liquid storage tank, an outlet of the liquid storage tank is connected with the liquid inlet pipe through a liquid inlet pipeline, and a first circulating pump is arranged on the liquid inlet pipeline. According to the system, the use amount of cooling liquid is effectively reduced, the size of the whole equipment is reduced, the fluidity of the coolingliquid is improved, and then the heat dissipation effect is improved.

Description

technical field [0001] The invention relates to the technical field of server hardware equipment, in particular to a flowing boiling submerged liquid cooling device. Background technique [0002] With the acceleration of technological innovation in my country's data center industry, the localization level of data centers and servers has been continuously improved, and more and more products have emerged. According to Moore's Law, the power consumption of server chips is increasing year by year. In the next two years, the power consumption of CPU chips will exceed 300W, and the power consumption of GPU chips will exceed 500W. Excessive chip power consumption leads to the use of air-cooled cooling methods, and it is difficult to completely dissipate the heat of the chip, which is easy to generate local hot spots, causing the server chip temperature to be too high, causing downtime and other hazards. Therefore, new cooling methods for servers and chips have become an important...

AI Technical Summary

Problems solved by technology

The disadvantage is that usually, when designing this type of cooling, a huge cooling box is designed, and multiple groups of servers are placed in the box for centralized cooling.

Due to the large size of the cabinet, the flow rate of the server liquid through the server is slow, and the convective heat transfer coefficient is small. For areas with high power density such as chips, the heat transfer capacity is limited, and local hot spots are still prone to occur. At the same time, an oversized cabinet will carry Too much coolant will cause excessive use of coolant, and at the same time, it will also cause the coolant to be easily volatilized and wasted

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