3results about How to "Avoid hotspots" patented technology

This invention provides a diode structure, comprising: a substrate; multiple filling trenches disposed on the substrate, extending along the length or width direction of the substrate and spaced apart along the length or width direction of the substrate; an epitaxial filling layer disposed within each filling trench; a first metal layer connected to at least one epitaxial filling layer within the multiple filling trenches to form a first ohmic contact; and a second metal layer disposed on the substrate and forming a Schottky contact with the substrate. This application solves the problem of low high-voltage withstand capability in existing SiC diodes.

This invention relates to a server liquid cooling plate and a liquid cooling plate assembly. The server liquid cooling plate includes: a substrate having a chip heating area; a foamed metal filler layer located on the chip heating area; a metal jet equalizing frame located on the foamed metal filler layer, configured to isolate the jet fluid from the return fluid after passing through the foamed metal filler layer; and a metal enclosure cavity fixedly connected to the substrate and surrounding the foamed metal filler layer and the metal jet equalizing frame, with a gap between the metal enclosure cavity and the foamed metal filler layer and the metal jet equalizing frame forming a return cavity. The liquid cooling plate of this invention significantly improves heat exchange efficiency and solves the problem of localized hot spots in traditional cooling plates.

The application discloses a resistance adjusting jig for adjusting resistance value of a bent resistor. The resistance adjusting jig comprises a base, a positioning table upwardly protruding on the base, a probe assembly, two groups of test pins of the probe assembly being arranged at two ends of the positioning table in the transverse direction and used for contacting a pin area of the bent resistor, and a pressing mechanism, a driving assembly of the pressing mechanism being capable of driving a pressing block to move in the up-down direction above the positioning table, and a material hardness of at least a lower end portion of the pressing block being greater than that of a flat plate portion of the bent resistor. In the resistance adjusting process, the flat plate portion is clamped between the pressing block and the positioning table, and locally plastically deformed under the pressure in the up-down direction, and according to the strain gauge effect, the deformation makes the effective conductive length of the flat plate portion slightly increase and the cross-sectional area slightly decrease, so that the resistance value is increased. The resistance adjusting is realized by the pure physical mechanical compression mode, the material discontinuity problem caused by the existing cutting or corrosion process is avoided, and the stability and reliability of the resistor after the resistance adjusting are effectively improved.