2results about How to "Avoid hotspots" patented technology

This invention provides a diode structure, comprising: a substrate; multiple filling trenches disposed on the substrate, extending along the length or width direction of the substrate and spaced apart along the length or width direction of the substrate; an epitaxial filling layer disposed within each filling trench; a first metal layer connected to at least one epitaxial filling layer within the multiple filling trenches to form a first ohmic contact; and a second metal layer disposed on the substrate and forming a Schottky contact with the substrate. This application solves the problem of low high-voltage withstand capability in existing SiC diodes.

This invention relates to a server liquid cooling plate and a liquid cooling plate assembly. The server liquid cooling plate includes: a substrate having a chip heating area; a foamed metal filler layer located on the chip heating area; a metal jet equalizing frame located on the foamed metal filler layer, configured to isolate the jet fluid from the return fluid after passing through the foamed metal filler layer; and a metal enclosure cavity fixedly connected to the substrate and surrounding the foamed metal filler layer and the metal jet equalizing frame, with a gap between the metal enclosure cavity and the foamed metal filler layer and the metal jet equalizing frame forming a return cavity. The liquid cooling plate of this invention significantly improves heat exchange efficiency and solves the problem of localized hot spots in traditional cooling plates.