A server liquid cooling plate and liquid cooling plate assembly

Abstract

This invention relates to a server liquid cooling plate and a liquid cooling plate assembly. The server liquid cooling plate includes: a substrate having a chip heating area; a foamed metal filler layer located on the chip heating area; a metal jet equalizing frame located on the foamed metal filler layer, configured to isolate the jet fluid from the return fluid after passing through the foamed metal filler layer; and a metal enclosure cavity fixedly connected to the substrate and surrounding the foamed metal filler layer and the metal jet equalizing frame, with a gap between the metal enclosure cavity and the foamed metal filler layer and the metal jet equalizing frame forming a return cavity. The liquid cooling plate of this invention significantly improves heat exchange efficiency and solves the problem of localized hot spots in traditional cooling plates.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and more particularly to a server liquid cooling plate and liquid cooling plate assembly. Background Technology

[0002] With the rapid development of information technology, server performance has continued to improve, and its integration and power density have increased significantly. High-power-density servers generate a lot of heat during operation. If heat dissipation is not timely, the equipment temperature will become too high, which will affect operating performance, system stability and reliability, and even shorten the service life of the equipment.

[0003] Traditional air cooling methods are no longer sufficient to meet the heat dissipation requirements of high-power-density servers. Liquid cooling technology, due to its high efficiency, is gradually becoming the mainstream development direction. Currently, mainstream server liquid cooling technologies can be mainly divided into the following two categories: First, there's direct-contact liquid cooling, which carries the risk of coolant leakage and requires extremely high insulation performance, leading to higher application costs and maintenance difficulties. Second, there's indirect-contact liquid cooling, which has relatively low heat exchange efficiency and is difficult to match the heat dissipation requirements of high-power chips. Furthermore, existing liquid cooling plates mostly use a single-channel structure, resulting in uneven coolant flow and easily creating localized hot spots in high-heat areas such as CPUs and GPUs.

[0004] To address the aforementioned technical shortcomings, there is an urgent need to provide a novel liquid-cooled cold plate structure that combines high heat exchange efficiency, low leakage risk, and good operational stability in order to solve the heat dissipation bottleneck problem of high power density servers. Summary of the Invention

[0005] To address at least some of the problems mentioned above in the prior art, the present invention provides a server liquid cooling plate, comprising: The substrate has the chip's heat-generating area; A foamed metal filler layer is located on the heat-generating area of ​​the chip; A metal jet equalizing frame, located on the foamed metal packing layer, is configured to isolate the jet fluid from the return fluid after passing through the foamed metal packing layer; and A metal enclosure cavity is fixedly connected to the substrate and surrounds the foam metal filler layer and the metal jet equalization frame, and a gap exists between the metal enclosure cavity and the foam metal filler layer and the metal jet equalization frame to form a return cavity.

[0006] Furthermore, it also includes: The liquid inlet metal static pressure chamber is located at the top of the metal enclosure chamber and is connected to the space enclosed by the metal jet equalization frame; The liquid outlet metal static pressure chamber is located at the top of the metal enclosure chamber and is connected to the return chamber.

[0007] Furthermore, it also includes: The inlet connector is welded to the inlet metal hydrostatic chamber; and The liquid outlet connector is connected to the liquid outlet metal static pressure chamber by welding.

[0008] Furthermore, the metal enclosure cavity is connected to the substrate and the metal jet equalization frame by welding; The height of the metal enclosure cavity is less than or equal to the sum of the heights of the foam metal filler layer and the metal jet equalization frame; The length and width of the metal enclosure cavity are both greater than the length and width of the foamed metal filler layer and the metal jet equalizing frame; The metal jet equalizing frame presses against the foam metal filler layer.

[0009] Furthermore, the foamed metal filler layer is fixed to the chip heating area of ​​the substrate by welding.

[0010] Furthermore, the foamed metal filler layer comprises: The upper foam metal layer has a porosity of 0.75-0.95. The lower layer of foamed metal has a porosity of 0.5-0.75.

[0011] Furthermore, the metal jet equalization frame is a rectangular metal frame, the length and width of which are less than or equal to the length and width of the foam metal filler layer.

[0012] Furthermore, the inlet and outlet connectors are pagoda connectors.

[0013] The present invention provides a liquid cooling plate assembly, comprising at least two server liquid cooling plates connected in series.

[0014] Furthermore, it includes a first server liquid cooling plate and a second server liquid cooling plate connected in series, wherein: The inlet end of the liquid cooling plate of the first server is connected to the inlet coolant pipeline, and the outlet end of the liquid cooling plate of the second server is connected to the outlet coolant pipeline. The liquid outlet of the first server liquid cooling plate and the liquid inlet of the second server liquid cooling plate are connected in series via a pipeline.

[0015] The present invention has at least the following beneficial effects: The liquid cooling plate of this invention combines jet impact and foam metal filler, which greatly improves heat exchange efficiency and can be used for heat dissipation of chips with high heat flux density of 300W or more, extending the service life of chips and servers.

[0016] The liquid-cooled cold plate of the present invention uses a metal static pressure chamber and a metal jet pressure equalization frame to perform static pressure and uniform distribution of coolant, ensuring uniform distribution of coolant in the heat-generating area and solving the problem of local hot spots in traditional cold plates.

[0017] The liquid-cooled cold plate of the present invention is made of metal, and multiple components are fixed by welding to achieve full enclosure, so that the risk of leakage is close to zero.

[0018] The pagoda-shaped connector simplifies pipe connections with its sealing design. Attached Figure Description

[0019] To further illustrate the above and other advantages and features of the various embodiments of the present invention, a more specific description of the embodiments of the invention will be presented with reference to the accompanying drawings. It is to be understood that these drawings depict only typical embodiments of the invention and are therefore not intended to limit its scope. In the drawings, identical or corresponding parts will be indicated by identical or similar reference numerals for clarity.

[0020] Figure 1 An exploded view of the structure of a server liquid cooling plate according to an embodiment of the present invention is shown.

[0021] Figure 2 A cross-sectional structural diagram of a server liquid cooling plate according to an embodiment of the present invention is shown.

[0022] Figure 3 A perspective view of a server liquid cooling plate according to an embodiment of the present invention is shown.

[0023] Figure 4 A front view of a server liquid cooling plate according to an embodiment of the present invention is shown.

[0024] Figure 5 A top view of a server liquid cooling plate according to an embodiment of the present invention is shown.

[0025] Figure 6 A schematic diagram of a liquid-cooled cold plate assembly according to an embodiment of the present invention is shown.

[0026] Reference numerals: 1. Substrate; 3. Foamed metal filler layer; 4. Metal jet equalization frame; 5. Metal enclosure cavity; 51. Return cavity; 61. Inlet metal static pressure cavity; 62. Outlet metal static pressure cavity; 71. Inlet connector; 72. Outlet connector; 100. First server liquid cooling plate; 200. Second server liquid cooling plate; 301. Inlet coolant pipeline; 302. Outlet coolant pipeline; 303. Series pipeline. Detailed Implementation

[0027] It should be noted that the components in the accompanying drawings may be shown exaggerated for illustrative purposes and may not be to scale.

[0028] In this invention, the various embodiments are merely intended to illustrate the solutions of the invention and should not be construed as limiting.

[0029] In this invention, unless otherwise specified, the quantifiers “a” and “one” do not exclude scenarios involving multiple elements.

[0030] It should also be noted that, in the embodiments of the present invention, only a portion of the parts or components may be shown for clarity and simplicity. However, those skilled in the art will understand that, under the teachings of the present invention, the required parts or components can be added as needed for specific scenarios.

[0031] It should also be noted that within the scope of this invention, the terms "same", "equal", and "equal to" do not mean that the two values ​​are absolutely equal, but allow for a certain reasonable error. In other words, the terms also cover "substantially the same", "substantially equal", and "substantially equal to".

[0032] It should also be noted that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not explicitly or implicitly suggest that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] Furthermore, the embodiments of the present invention describe the process steps in a specific order. However, this is only for the convenience of distinguishing each step, and is not a limitation on the order of each step. In different embodiments of the present invention, the order of each step can be adjusted according to the process.

[0034] Figure 1 An exploded view of the structure of a server liquid cooling plate according to an embodiment of the present invention is shown. Figure 2 A cross-sectional structural diagram of a server liquid cooling plate according to an embodiment of the present invention is shown. Figure 3 A perspective view of a server liquid cooling plate according to an embodiment of the present invention is shown. Figure 4 A front view of a server liquid cooling plate according to an embodiment of the present invention is shown. Figure 5 A top view of a server liquid cooling plate according to an embodiment of the present invention is shown.

[0035] like Figures 1 to 5As shown in the figure, a server liquid cooling plate includes: a substrate 1, a foamed metal filler layer 3, a metal jet pressure equalization frame 4, a metal enclosure cavity 5, an inlet metal static pressure cavity 61, an outlet metal static pressure cavity 62, an inlet connector 71, and an outlet connector 72.

[0036] The substrate 1 has a chip heating area 2 (the chip can be a CPU or a GPU).

[0037] The substrate 1 can be made of metals such as copper, aluminum, or stainless steel. The substrate 1 is used to support the chip and heat dissipation components and conduct basic heat. The chip is placed on one side of the substrate 1, and heat dissipation components (foam metal filler layer, metal jet pressure equalization frame, metal enclosure cavity, etc.) are placed on the other side.

[0038] The thickness of substrate 1 is 5-12mm. Substrate 1 has multiple mounting holes with a diameter of 5-7mm. These mounting holes are used to secure substrate 1 to the PCB board using bolts, pins, or other fasteners. The PCB board is connected to the chip.

[0039] The foamed metal filler layer 3 is located on the chip heating area 2 of the substrate 1. Further, the foamed metal filler layer 3 is fixed to the chip heating area 2 of the substrate 1 by soldering (200-300℃).

[0040] The material of the foam metal filler layer 3 can be copper foam, aluminum foam, or nickel foam. The thickness of the foam metal filler layer 3 is 5 mm-15 mm, the porosity is 0.5-0.95, and the size is 45×45 mm or 50×50 mm (matching CPU / GPU).

[0041] The foamed metal filler layer 3 comprises an upper foamed metal layer and a lower foamed metal layer. The upper foamed metal layer has a thickness of 3 mm to 7.5 mm and a porosity of 0.75 to 0.95. The lower foamed metal layer has a thickness of 3 mm to 7.5 mm and a porosity of 0.5 to 0.75.

[0042] The foamed metal packing layer can adopt a multi-layer structure, with a lower layer having low porosity (enhancing thermal conductivity) and an upper layer having high porosity (optimizing fluid flow), thus balancing heat transfer efficiency and flow resistance.

[0043] The metal jet equalizing frame 4 is located on the foam metal packing layer 3. The lower surface of the metal jet equalizing frame 4 presses against the foam metal packing layer 3. The metal jet equalizing frame 4 isolates the jet fluid and the return fluid, with the jet fluid located inside the metal jet equalizing frame 4 and the return fluid located outside the metal jet equalizing frame 4.

[0044] The metal jet equalizing frame 4 is a rectangular metal frame, the length and width of which are less than or equal to the length and width of the foam metal filler layer 3. The material of the metal jet equalizing frame 4 is copper or aluminum sheet. The thickness of the metal jet equalizing frame 4 is 0.8 mm - 1.5 mm, and the height is 5 mm - 15 mm. The function of the metal jet equalizing frame is to form a static pressure cavity in the space above the foam metal filler layer 3, allowing the coolant to pass evenly through the foam metal filler layer 3 and preventing the formation of localized hot spots in the chip heating area 2.

[0045] The metal enclosure 5 is mounted on the foam metal filler layer 3 and the metal jet equalizing frame 4. The metal enclosure 5 is connected to the substrate 1 and the metal jet equalizing frame 4 by welding. For example, it is fixed by brazing (hard brazing or tin soldering).

[0046] The top of the metal enclosure 5 has an inlet and an outlet.

[0047] The metal enclosure 5 is made of copper or aluminum, with a wall thickness of 0.8 mm to 1.5 mm. The metal enclosure 5 forms a closed fluid cavity to ensure coolant circulation.

[0048] The height of the metal enclosure cavity 5 is less than or equal to the sum of the heights of the foam metal packing layer 3 and the metal jet equalizing frame. The length and width of the metal enclosure cavity 5 are both greater than the length and width of the foam metal packing layer 3 and the metal jet equalizing frame 4, resulting in a gap between the metal enclosure cavity 5 and the foam metal packing layer 3 and the metal jet equalizing frame 4, forming a return cavity 51.

[0049] The inlet metal static pressure chamber 61 and the outlet metal static pressure chamber 62 are located at the top of the metal enclosure chamber 5. The inlet metal static pressure chamber 61 and the outlet metal static pressure chamber 62 are connected to the metal enclosure chamber 5 by welding. The inlet metal static pressure chamber 61 is in communication with the space enclosed by the metal jet equalization frame 4. The outlet metal static pressure chamber 62 is in communication with the return chamber 51.

[0050] The cross-sectional dimensions of the inlet metal static pressure chamber 61 and the outlet metal static pressure chamber 62 are larger than the diameter of the coolant pipeline.

[0051] The materials of the inlet metal static pressure chamber 61 and the outlet metal static pressure chamber 62 are copper or aluminum, with a wall thickness of 0.8 mm to 1.5 mm.

[0052] The liquid inlet metal static pressure chamber of the present invention works in conjunction with the jet pressure equalization frame to perform static pressure and uniform distribution of coolant, so as to achieve first stabilize the pressure of coolant and then distribute it evenly, resulting in a more uniform temperature distribution. It can control the temperature difference on the chip surface within 5°C and avoid local hot spots caused by uneven coolant flow.

[0053] The inlet connector 71 is connected to the inlet metal static pressure chamber 61 by welding, and the outlet connector 72 is connected to the outlet metal static pressure chamber 62 by welding, for example, by brazing.

[0054] Both the inlet metal static pressure chamber 61 and the outlet metal static pressure chamber 62 have inlets and outlets. The inlet of the inlet metal static pressure chamber 61 is connected to the inlet connector 71, and the outlet is connected to the metal enclosure chamber 5. The inlet of the outlet metal static pressure chamber 62 is connected to the metal enclosure chamber 5, and the outlet is connected to the outlet connector 72.

[0055] The inlet connector 71 and outlet connector 72 are connected to the coolant lines, such as hoses. The inlet connector 71 and outlet connector 72 are pagoda connectors with 2-4 threads, and their outer diameter is 3mm larger than that of the coolant lines. The materials are copper or aluminum.

[0056] The sealing design of the pagoda connector simplifies pipeline connections. It undergoes a pressure test (≥10 Bar) before leaving the factory to ensure the long-term operational stability of the cold plate and reduce maintenance frequency and costs.

[0057] like Figure 2 As shown, the coolant jet enters the inlet metal static pressure chamber 61 from the inlet connector 71, then enters the metal jet equalization frame 4, and then passes through the foam metal packing layer 3 to enter the return chamber 51. The coolant entering the return chamber 51 is the return fluid.

[0058] The reflux fluid enters the outlet metal static pressure chamber 62 and then flows out through the outlet connector 72.

[0059] The chip is located on the other side of the substrate 1. The chip generates heat, which is transferred through the substrate 1 to the foamed metal filler layer 3. Coolant flows through the foamed metal filler layer 3. Due to the large specific surface area of ​​the foamed metal and its good thermal conductivity, heat is transferred from the surface of the filler to the coolant via convection. The heated coolant flows into the return cavity 51 and is finally discharged from the cold plate.

[0060] The coolant flowing out from the inlet connector 71 is a jet fluid. The foamed metal has a certain porosity, which is equivalent to reducing the fluid surface area, and high-speed fluid can also be formed inside the foamed metal.

[0061] This invention combines jet impingement heat transfer with porous foam metal heat transfer, enhancing fluid turbulence through jet flow and increasing specific surface area using foam metal, thus doubly improving heat transfer efficiency. The jet impingement technology significantly increases the heat transfer coefficient of the chip's heating zone, while the foam metal filler layer expands the heat transfer area by 3-5 times, improving overall heat dissipation capacity by over 40%, making it suitable for chips with high heat flux densities of 300W and above.

[0062] The liquid cooling plate of this invention features a variety of material and size designs for its components to match the installation requirements of different CPU / GPU models and PCB boards.

[0063] Figure 6 A schematic diagram of a liquid-cooled cold plate assembly according to an embodiment of the present invention is shown.

[0064] The liquid cooling plate assembly consists of at least two server liquid cooling plates connected in series.

[0065] like Figure 6 As shown, a liquid-cooled cold plate assembly includes a first server liquid-cooled cold plate 100 and a second server liquid-cooled cold plate 200 connected in series. The liquid inlet end of the first server liquid-cooled cold plate 100 is connected to a liquid inlet coolant pipe 301, and the liquid outlet end of the second server liquid-cooled cold plate 200 is connected to a liquid outlet coolant pipe 302. The liquid outlet end of the first server liquid-cooled cold plate 100 and the liquid inlet end of the second server liquid-cooled cold plate 200 are connected by a series pipe 303.

[0066] The liquid cooling plate 100 of the first server has a liquid inlet connector at the liquid inlet end and a liquid outlet connector at the liquid outlet end. The liquid cooling plate 200 of the second server has a liquid inlet connector at the liquid inlet end and a liquid outlet connector at the liquid outlet end.

[0067] While some embodiments of the present invention have been described in this application, those skilled in the art will understand that these embodiments are merely illustrative. Numerous variations, alternatives, and improvements will arise in those skilled in the art under the teachings of this invention without departing from its scope. The appended claims are intended to define the scope of the invention and thereby cover methods and structures within the scope of the claims themselves and their equivalents.

Claims

1. A server liquid-cooled cold plate, comprising: include: The substrate has the chip's heat-generating area; A foamed metal filler layer is located on the heat-generating area of ​​the chip; A metal jet equalizing frame, located on the foam metal packing layer, is configured to isolate the jet fluid from the return fluid after passing through the foam metal packing layer; as well as A metal enclosure cavity is fixedly connected to the substrate and surrounds the foam metal filler layer and the metal jet equalization frame, and a gap exists between the metal enclosure cavity and the foam metal filler layer and the metal jet equalization frame to form a return cavity.

2. The server liquid cooling plate according to claim 1, characterized in that, Also includes: The liquid inlet metal static pressure chamber is located at the top of the metal enclosure chamber and is connected to the space enclosed by the metal jet equalization frame; The liquid outlet metal static pressure chamber is located at the top of the metal enclosure chamber and is connected to the return chamber.

3. The server liquid cooling plate according to claim 2, characterized in that, Also includes: The inlet connector is welded to the inlet metal hydrostatic chamber; and The liquid outlet connector is connected to the liquid outlet metal static pressure chamber by welding.

4. The server liquid cooling plate according to claim 1, characterized in that, The metal enclosure cavity is connected to the substrate and the metal jet pressure equalization frame by welding. The height of the metal enclosure cavity is less than or equal to the sum of the heights of the foam metal filler layer and the metal jet equalization frame; The length and width of the metal enclosure cavity are both greater than the length and width of the foamed metal filler layer and the metal jet equalizing frame; The metal jet equalizing frame presses against the foam metal filler layer.

5. The server liquid cooling plate according to claim 1, characterized in that, The foamed metal filler layer is fixed to the chip heating area of ​​the substrate by welding.

6. The server liquid cooling plate according to claim 1, characterized in that, The foamed metal filler layer includes: The upper foam metal layer has a porosity of 0.75-0.

95. The lower layer of foamed metal has a porosity of 0.5-0.

75.

7. The server liquid cooling plate according to claim 1, characterized in that, The metal jet equalization frame is a rectangular metal frame, the length and width of which are less than or equal to the length and width of the foam metal filler layer.

8. The server liquid cooling plate according to claim 3, characterized in that, The inlet and outlet connectors are pagoda connectors.

9. A liquid-cooled cold plate assembly, characterized in that, Includes at least two server liquid cooling plates as described in any one of claims 1 to 8, connected in series.

10. The liquid-cooled cold plate assembly according to claim 9, characterized in that, Includes a first server liquid cooling plate and a second server liquid cooling plate connected in series, wherein: The inlet end of the liquid cooling plate of the first server is connected to the inlet coolant pipeline, and the outlet end of the liquid cooling plate of the second server is connected to the outlet coolant pipeline. The liquid outlet of the first server liquid cooling plate and the liquid inlet of the second server liquid cooling plate are connected in series via a pipeline.

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