Composite electronic chip cooling and boiling heat transfer enhancement experiment device

Abstract

The invention relates to a composite electronic chip cooling and boiling heat transfer enhancement experiment device, which comprises a peripheral pump, wherein the outlet of the peripheral pump is connected with a total flow meter inlet; a total flow meter outlet is divided into two paths, one path passes through a jet branch to enter the flow jet segment of a composite boiling experiment box, and the other path is further divided into two paths; one path passes through a transverse flow branch to enter the flow jet segment of the composite boiling experiment box, and the outlet of the flow jet segment of the composite boiling experiment box is connected with the boiling segment of the composite boiling experiment box; the other path directly enters the boiling segment of the composite boiling experiment box, and the outlet of the boiling segment of the composite boiling experiment box is connected with the inlet of a heat transfer device; the outlet of the heat transfer device is connected with the peripheral pump; and a circle is completed. The device combines the advantages of pool boiling, pure flow boiling, pure jet impact boiling and flow jet composite boiling heat transfer, and has the advantages of flexibility in operation, simplicity in control, small occupied area and short experimental period.

Description

technical field [0001] The invention relates to the technical field of electronic chip cooling and boiling enhanced heat transfer, in particular to a composite electronic chip cooling and boiling enhanced heat transfer experimental device. Background technique [0002] With the high integration and high frequency of electronic components, traditional air cooling and other cooling technologies can no longer meet the requirements of high heat dissipation rate of chips. Direct liquid cooling of chips by using boiling phase transfer heat is an effective cooling method , the usual practice is to directly immerse the chip in a non-conductive liquid for boiling heat exchange, but there are problems such as high boiling initial temperature, which is not conducive to the start-up of electronic devices, so it is necessary to adopt strengthening measures to effectively reduce the boiling initial wall overheating. Heat, increase the critical heat flux, ensure that the critical wall temp...

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Problems solved by technology

Placing the chip in the flow channel, relying on the scouring effect of the fluid on the surface of the chip can achieve the purpose of enhancing heat transfer, but it is necessary to provide an additional power system and control system. In addition, it is found through the photos taken by high-speed cameras that, in the critical state, the fluid The damage to the steam film along the flow direction is small, and the surface of the chip is covered by a layer of steam film, which hinders the replenishment of cold fluid, while jet impingement cooling has a high impact force, and it is expected to impact the heat exchange surface, crush or Destroy the steam film, quickly take away the heat on the heat exchange surface, thereby ensuring the supplement of cold fluid, maintaining the normal heat exchange of the chip under high heat flux, and further increasing the critical heat flux value, but the jet impingement cooling range is small, which is more suitable for Localized cooling, and cooling of individual chips is currently not possible

In most of the literature, the experimental research is conducted on one of pool boiling, flow boiling, and jet impingement boiling. The experimental system is large in size, part of the power supply and control operation equipment and the operation process are repeated, and the experimental period is long, which makes it strengthen heat transfer. advantage is limited

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