48 results about "Direct liquid cooling" patented technology

Systems and methods are provided for a high density liquid cooling unit to cool electrical components. A replaceable pump unit (RPU) can include a pump configured to provide fluid flow to cool the electrical components (e.g., via direct liquid cooling of the electrical components by the pumped fluid and air-to-liquid cooling of the pumped fluid via a heat exchanger in fluid communication with the RPU). The RPU can be configured to be operated with or satisfy one or more RPU performance characteristics.

A liquid cooling system includes first and second coolant tubes and a coupler to couple the first coolant tube to the second coolant tube. The first coolant tube receives coolant liquid from a first element of the liquid cooling system. The second coolant tube provides the coolant liquid to a second element of the liquid cooling system. The coupler is configured to receive an electrical signal to constrict a flow of the coolant liquid.

A method of controlling a hybrid adiabatic cooling system to cool an interior of a data center includes a step of cooling, by a hybrid adiabatic cooler, a first cooling liquid circulating from a return segment of an outer conduit loop to a feed segment of the outer conduit loop. The method includes a step of exchanging, by a direct liquid cooling unit, heat between a second cooling liquid and the first cooling liquid circulating in the outer conduit loop. The method includes a step of diverting a portion of the first cooling liquid circulating in the outer conduit loop to an inner conduit loop. The method includes a step of exchanging, by a room air handling unit, heat between indoor ambient air and the diverted portion of the first cooling liquid circulating in the inner conduit loop.

The invention provides a direct liquid cooling power chip structure and a manufacturing method thereof, and belongs to the technical field of semiconductor packaging, and the method comprises the following steps: carrying out the surface pretreatment of a metal layer of a packaging substrate, so as to remove surface oxides and organic pollutants; processing a micro-channel structure in the metal layer; and electrically and thermally interconnecting a bottom bonding pad of the power chip with the surface of the metal layer, and covering the power chip on one side of the micro-channel structure to form a sealing cover plate. According to the method, the micro-channel structure is directly processed and formed in the metal layer of the packaging substrate, and the power chip covers one side of the micro-channel structure to form the sealing cover plate, so that the cooling liquid can flow close to the bottom of the power chip, heat generated by the power chip can be more efficiently led out, and the heat dissipation efficiency of the power chip is improved. A heat dissipation path is obviously shortened, interface thermal resistance is reduced, and heat exchange efficiency is improved; the device is compact in overall structure, the integration level is remarkably improved, and the requirements of high power density and miniaturized packaging are met.

The invention relates to an arrangement for a direct liquid cooling system (DLC) of an IT infrastructure, said arrangement having at least one IT rack (1) which has a plurality of plug units (2) which are arranged on top of each other in the vertical direction (z) of the IT rack (1) and are used for a direct liquid cooling system (DLC) and / or a plug device (2.1) of the IT infrastructure, characterized in that the plug units (2) are arranged on top of each other in the vertical direction (z) of the IT rack (1). According to the invention, the direct liquid cooling system (DLC) has at least two different plug-in devices (2.1), each of which is inserted into one of the plug-in units (2).

The invention relates to a direct liquid cooling (DLC) system for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system comprises a coolant distribution unit (CDU) and a coolant distribution channel (7) supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has a coolant inlet (7.5) which is spaced apart from opposite ends of the coolant distribution channel (7).

Systems and methods for detecting coolant leakage in direct liquid cooling systems are disclosed. Liquid coolant is flowed through cold plates that are attached to adjacent processors. Sensor readings of the processors are formed into a differential signal. Distribution of the differential signal is determined. Leakage of the liquid coolant is detected from the distribution of the differential signal.

The invention discloses a spindle cooling structure and a machine tool, and belongs to the technical field of spindles, the spindle cooling structure comprises a machine body, a front bearing seat and a rear bearing seat which are arranged in the machine body, bearings installed in the front bearing seat and the rear bearing seat, and a motor iron core and a motor coil which are arranged in a shell, the cooling water channel comprises a plurality of mutually independent cooling chambers, and the plurality of cooling chambers are respectively and correspondingly arranged at a bearing of the main shaft, a motor iron core and a motor coil; the cooling chambers are sequentially communicated in series through pipeline holes to form a continuous circulating cooling path, so that cooling liquid can sequentially flow through the cooling chambers corresponding to the front bearing, the motor front coil, the motor rear coil, the rear bearing and the motor iron core; according to the invention, the motor coil, which is a core heat source, is incorporated into a direct liquid cooling circulation system, so that the effective heat exchange area is greatly expanded, each heating part of the main shaft can be directly and fully cooled, and the overall heat dissipation efficiency is qualitatively improved.

The invention discloses a ceramic-substrate-free direct liquid cooling insulation packaging power module and a preparation method thereof, and belongs to the technical field of power semiconductor packaging. The module comprises a semiconductor power chip, a metal block, a plurality of connecting layers, a plurality of metal structural members, an insulation sealing structure and a sealing liquid cooling device. An electrode on the lower surface of the chip is connected with a metal block through a first connecting layer, the metal block is in direct contact with insulating cooling liquid, efficient heat dissipation is achieved, meanwhile, the cooling liquid serves as an insulating medium, and the electrical insulating function is ensured; electrodes on the upper surface of the chip are respectively led out through leads and the second connecting layer; the insulation sealing structure wraps the chip and the internal connection area, thereby further guaranteeing the insulation and sealing performance of the module. A traditional ceramic substrate is abandoned, the structural design is combined with a liquid cooling system, the thermal resistance is remarkably reduced, the heat dissipation efficiency is improved, meanwhile, the problem of insulation failure caused by bubbles is avoided, and the device is suitable for high-power-density application scenes and has the advantages of being low in cost, high in reliability, easy to expand and the like.

The invention relates to an arrangement for direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) having a plurality of plug-in modules (2) for plug-in units (2.1) of a direct liquid cooling (DLC) system and / or IT infrastructure, wherein the arrangement comprises a bus system (40) which has a control unit (9) and a bus (41) having a plurality of data interfaces (42) for the connection of plug-in units (2.1) of a direct liquid cooling (DLC) system, characterised in that the bus system (40) has a self-addressing function for plug-in units (2.1) of a direct liquid cooling (DLC) system, which plug-in units can be connected to the bus (41).

This invention discloses a method and system for correcting the opening degree of a one-way valve, relating to the field of liquid cooling pipeline control. The invention collects full operational data of the one-way valve, constructs an initial benchmark opening degree parameter set through correlation fitting and benchmark mapping, and performs equivalent opening degree extrapolation to obtain preliminary equivalent opening degree calculation results. It then integrates the residual pressure and flow rate of the liquid circuit with the residual heat exchange of the branch circuit to perform thermo-liquid coupling residual correction. Through deviation feature decomposition, fault cause matching, and safety situation assessment, it completes deviation source tracing and backflow risk assessment. Through adaptation screening, interval correction, and closed-loop convergence verification, it outputs the final opening degree correction result. This invention also configures a correction system composed of corresponding functional units, which can correct one-way valve opening degree drift online, automatically trace fault causes, and quantify backflow risk, improving the control accuracy and operating efficiency of the liquid cooling system, reducing maintenance costs, and adapting to the stable operation requirements of direct liquid cooling pipelines in AI data centers.

This application relates to a power domain controller, electronic device, and vehicle. The power domain controller includes a housing and a power integration module. The housing has an open heat dissipation channel, through which coolant is disposed and forms a heat dissipation cycle. The power integration module is fixed to the housing and has its opening closed, with at least a portion of the module in contact with the coolant, which carries away heat from the module. Based on this configuration, when the heat dissipation cycle is activated, the coolant directly contacts the power integration module, thereby directly carrying away its heat. In other words, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Furthermore, this design reduces the amount of thermally conductive gel used for heat conduction, thereby reducing the overall cost and weight of the power domain controller.

A liquid cooling system includes first and second coolant tubes and a coupler to couple the first coolant tube to the second coolant tube. The first coolant tube receives coolant liquid from a first element of the liquid cooling system. The second coolant tube provides the coolant liquid to a second element of the liquid cooling system. The coupler is configured to receive an electrical signal to constrict a flow of the coolant liquid.

The invention relates to an arrangement for the direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) with a plurality of slots (2) for plug-in devices (2.1) of a direct liquid cooling (DLC) and / or an IT infrastructure, wherein the arrangement comprises a bus system (40) with a control unit (9) which has a bus (41) with a plurality of data interfaces (42) for connecting plug-in devices (2.1) of a direct liquid cooling (DLC), characterized in that the bus system (40) has self-addressing for plug-in devices (2.1) of a direct liquid cooling (DLC) that can be connected to the bus (41).

The utility model provides a laser pumping source based on direct liquid cooling contact, which comprises a pumping light source assembly and a cooling plate, the side end face of the cooling plate is provided with a liquid inlet and a liquid outlet, a liquid conveying channel is distributed in the cooling plate, one end of the liquid conveying channel extends to the liquid inlet, and the other end of the liquid conveying channel extends to the liquid outlet. The other end of the liquid conveying channel extends to the liquid outlet; a liquid opening is formed in the upper end of the cooling plate, and a liquid conveying channel in a preset area in the cooling plate is exposed to the outside through the liquid opening; the pump light source assembly is arranged at the upper end of the liquid opening, and when cooling liquid is input into the liquid conveying channel, the lower end of the pump light source assembly makes contact with the cooling liquid in the liquid conveying channel in the preset area, so that cooling of the pump light source assembly is achieved; the lower end of the pump light source assembly is in direct contact with the cooling liquid in the cooling plate, so that the heat dissipation efficiency of the pump light source assembly is improved.

The invention discloses a cold plate type direct-cooling liquid-cooling circulation system, which is characterized in that an internal pipeline of a liquid-cooling cold plate is directly connected with an external radiating pipeline, indirect heat exchange structures such as a heat exchanger are omitted, the cooling effect can be guaranteed and the energy efficiency can be improved only by using a single cooling liquid, redundant pumping capacity is provided, and the reliability is good. The system mainly comprises an indoor server system, an outdoor unit system and a circulating system. The outdoor unit system comprises an outdoor liquid inlet path, an air cooler, an air cooling liquid inlet path, an air cooling liquid outlet path and an outdoor liquid outlet path; the indoor server system comprises a water inlet branch water device, a water outlet branch water device, a plurality of servers and a plurality of liquid cooling plates, the water inlet branch water device comprises a water inlet vertical main pipe and a plurality of water inlet branch pipes, the water outlet branch water device comprises a water outlet vertical main pipe and a plurality of water outlet branch pipes, and the circulating system comprises a circulating liquid inlet path, a circulating liquid outlet path and two circulating pump paths. And a circulating front-end ball valve, a liquid cooling circulating pump, a circulating liquid inlet check valve and a circulating rear-end ball valve are arranged on the circulating pump path.

The invention relates to a direct liquid cooling (DLC) system for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system comprises a coolant distribution unit (CDU) and a coolant distribution channel (7) supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has a coolant inlet (7.5) which is spaced apart from opposite ends of the coolant distribution channel (7).

The invention relates to an arrangement for direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one coolant circuit (15) with a coolant distribution unit (CDU) for providing cooled liquid, wherein an expansion vessel (10) is fluidically connected to the coolant circuit (15) via a leak-free quick coupling (50).

Systems and methods for detecting coolant leaks in a direct liquid cooling system are disclosed. Liquid coolant flows through a cold plate attached to an adjacent processor. Sensor readings of the processor are formed into a differential signal. A distribution of the differential signals is determined. Leaks of the liquid coolant are detected from the distribution of the differential signal.

The invention relates to an arrangement for the direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement has at least one coolant circuit (15) with a coolant distribution unit (CDU) for providing cooled liquid, wherein an expansion vessel (10) is fluidically connected to the coolant circuit (15) via a leak-free quick coupling (50).

The utility model discloses a liquid cooling system which comprises a direct liquid cooling loop, a system board and a cooling distribution unit. The direct liquid cooling loop comprises a flexible pipe section, a near-end connector, a far-end connector and a cold plate. The proximal connection end of the flexible tube section is coupled to the proximal joint engagement end of the proximal joint by a proximal lap joint. The distal connection end of the flexible tube section is coupled to the distal joint engagement end of the distal joint through a distal lap joint. The flexible tube section is in fluid communication with at least one of the inlet and the outlet of the cold plate. A first integrated circuit element of the system board passes through the cold plate entity and is thermally coupled to the direct liquid cooling loop. The cooling distribution unit is in fluid communication with the direct liquid cooling circuit to provide working fluid to the direct liquid cooling circuit.

The utility model discloses a mechanical switching device of a liquid crystal display (LCD) light valve, the LCD light valve comprises an upper glass substrate, a lower glass substrate and a liquid crystal box clamped between the upper glass substrate and the lower glass substrate, and light enters from the upper glass substrate and exits from the lower glass substrate after passing through the liquid crystal box. The mechanical switching device comprises a glass plate, and the glass plate is attached to the incident surface of the upper glass substrate; the glass plate is longer than the upper glass substrate; the width of the glass plate is greater than that of the upper glass substrate; the thickness of the glass plate is greater than or equal to 0.4 mm; and the glass plate is made of optical glass with an amorphous structure. According to the utility model, the loss of the LCD light valve in the projector assembling process can be reduced to zero at a certain probability, and raw materials and workpiece replacement time are saved. Meanwhile, the direct liquid cooling technology is adopted to cool the LCD light valve, the practical problem of how to simply and efficiently assemble the LCD light valve with peripheral materials can be effectively solved, and the direct liquid cooling technology can really and effectively generate value on domestic projectors.

The invention relates to a direct liquid cooling system (DLC) for IT infrastructure having at least one component (2) requiring cooling, the direct liquid cooling system comprising a coolant distribution unit (CDU) and a coolant distribution channel (7) which is supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has a coolant inlet (7.5) which is arranged at a distance from opposite ends of the coolant distribution channel (7).

An information handling system includes a liquid cooling distribution system with a supply line and a return line. The information handling system determines a first amount of current needed to create a first differential temperature value within the supply line. The information handling system further determines a second amount of current needed to create a second differential temperature value with the return line. Based on the first amount of current, the information handling system determines a first cooling liquid flow rate through the supply line. Based on the second amount of current, the information handling system determines a second cooling liquid flow rate through the return line. In response to the first cooling liquid flow rate not being equal to the second cooling liquid flow rate, the system provides a leak detection signal.

A semiconductor structure (100a, 100b) comprising: a power module (110) for power conversion, the power module (110) comprising a first module side (111a) and a second module side (111b) opposite the first module side (111a), wherein a first mold body (113) is arranged between the first module side (111a) and the second module side (111b); the first module side (111a) comprises an upper metal layer (114a); a second mold body (120) at least partially encapsulating the power module (110), wherein a portion of the upper metal layer (114a) forming an upper heat dissipation area (115a) of the power module (110) is not covered by the second mold body (120); in a transition area (131a) between the upper heat dissipation area (115a) and the second mold body (120), the upper heat dissipation area (115a) and the second mold body (120) are covered by an upper metal sealing element (130a) to seal the power module (110) against coolant flow through the upper heat dissipation area (115a).

A liquid cooling system including a direct liquid cooling loop, system board, and cooling distribution unit is provided. The direct cooling loop includes a flexible tubing section, proximal fitting, distal fitting, and cold plate. A proximal connection end of the flexible tubing section is coupled to a proximal fitting attachment end of the proximal fitting via a proximal lap joint. A distal connection end of the flexible tubing section is coupled to a distal fitting attachment end of the distal fitting via a distal lap joint. The flexible tubing section is fluidly in communication with at least one of an inlet and outlet of the cold plate. A first integrated circuit component of the system board is physically and thermally coupled to the direct liquid cooling loop via the cold plate. The cooling distribution unit is fluidly in communication with the direct liquid cooling loop, providing a working fluid thereto.

The application discloses a main shaft cooling structure and a machine tool, and belongs to the technical field of main shafts. The main shaft cooling structure comprises a machine body, a front bearing seat and a rear bearing seat arranged in the machine body, bearings installed in the front bearing seat and the rear bearing seat, and a motor iron core and a motor coil arranged in the shell. The machine body is internally provided with cooling water channels. The cooling water channels comprise a plurality of independent cooling chambers. The plurality of cooling chambers are respectively arranged at positions corresponding to the bearings, the motor iron core and the motor coil of the main shaft. The cooling chambers are sequentially connected in series through pipeline holes, thereby forming a continuous circulating cooling path. The cooling liquid can sequentially flow through the cooling chambers corresponding to the front bearing, the front motor coil, the rear motor coil, the rear bearing and the motor iron core. The application incorporates the core heat source, i.e. the motor coil, into a direct liquid cooling circulating system, greatly expands the effective heat exchange area, and enables each heating part of the main shaft to be directly and fully cooled, thereby improving the overall heat dissipation efficiency.

The invention relates to a device for supplying direct liquid cooling (DLC) with electrical energy, where the device comprises at least one IT rack (1) having a plurality of slide-in units (2) arranged one above the other in the height direction (z) of the IT rack (1) for direct liquid cooling and / or a slide-in device (2.1) of an IT infrastructure, characterized in that the IT rack (1) comprises a DC voltage source (3), the invention relates to a direct liquid cooling (DLC) system for accommodating slide-in devices (2.1) in slide-in units (2), comprising a rectifier (PSU) and a bus bar (5), which extends along the rear side (R) of the IT rack (1) in the height direction (z) of the IT rack (1) and is supplied with a DC voltage by the rectifier (PSU), at least one slide-in device (2.1) of the direct liquid cooling (DLC) system being accommodated in one of the slide-in units (2) and being in electrical contact with the bus bar (5).

A liquid cooling system for cooling a component of an information handling system includes a coolant liquid loop and a carbon dioxide (CO2) injector. The coolant liquid loop circulates coolant liquid to the component. The injector injects CO2 into the coolant liquid.