83 results about "Direct liquid cooling" patented technology

The invention relates to an arrangement for supplying electrical energy to a direct liquid cooling (DLC) system, wherein the arrangement comprises at least one IT rack (1) with a plurality of vertically arranged (z) slots (2) for plug-in devices (2.1) of a direct liquid cooling (DLC) system and / or an IT infrastructure, characterized in that the IT rack (1) has a DC power supply (3) for plug-in devices (2.1) received in the slots (2), with a rectifier (PSU) and a busbar (5) which runs along a rear side (R) of the IT rack (1) in the vertical direction (z) of the IT rack (1) and is supplied with a DC voltage by the rectifier (PSU), wherein at least one plug-in device (2.1) of a direct liquid cooling (DLC) system is received in one of the slots (2) and is electrically contacted with the busbar (5).

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The invention relates to a direct liquid cooling (DLC) system for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system comprises a coolant distribution unit (CDU) and a coolant distribution channel (7) which is supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has at least one sensor with which at least one physical measurement quantity is determined with respect to the liquid in the coolant distribution channel (7).

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

Systems and methods are provided for a high density liquid cooling unit to cool electrical components. A replaceable pump unit (RPU) can include a pump configured to provide fluid flow to cool the electrical components (e.g., via direct liquid cooling of the electrical components by the pumped fluid and air-to-liquid cooling of the pumped fluid via a heat exchanger in fluid communication with the RPU). The RPU can be configured to be operated with or satisfy one or more RPU performance characteristics.

The invention relates to an arrangement for direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one housing or an IT rack (1) with a plurality of plug-in units (2) for plug-in devices (2.1) of a direct liquid cooling (DLC) and / or an IT infrastructure, said plug-in units being arranged one above the other in the vertical direction (z) of the housing or the IT rack (1), characterized in that one of the plug-in units (2.1) is a control module which is inserted into one of the plug-in units (2) and is configured to control at least one second plug-in device (2.1) of the direct liquid cooling (DLC) which is inserted into another of the plug-in units (2).

A liquid cooling system includes first and second coolant tubes and a coupler to couple the first coolant tube to the second coolant tube. The first coolant tube receives coolant liquid from a first element of the liquid cooling system. The second coolant tube provides the coolant liquid to a second element of the liquid cooling system. The coupler is configured to receive an electrical signal to constrict a flow of the coolant liquid.

The invention relates to an arrangement for the direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) with a plurality of slots (2) arranged one above the other in the vertical direction (z) of the IT rack (1) for slot-in devices (2.1) of a direct liquid cooling (DLC) and / or an IT infrastructure, characterized in that the direct liquid cooling (DLC) comprises at least two different slot-in devices (2.1), each of which is inserted into one of the slots (2).

A method of controlling a hybrid adiabatic cooling system to cool an interior of a data center includes a step of cooling, by a hybrid adiabatic cooler, a first cooling liquid circulating from a return segment of an outer conduit loop to a feed segment of the outer conduit loop. The method includes a step of exchanging, by a direct liquid cooling unit, heat between a second cooling liquid and the first cooling liquid circulating in the outer conduit loop. The method includes a step of diverting a portion of the first cooling liquid circulating in the outer conduit loop to an inner conduit loop. The method includes a step of exchanging, by a room air handling unit, heat between indoor ambient air and the diverted portion of the first cooling liquid circulating in the inner conduit loop.

The invention relates to a direct liquid cooling system (DLC) for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system has a coolant distribution unit (CDU) or reservoir and pump unit (RPU) supplied with cooled liquid and at least one coolant distribution channel (7) which is supplied with cooled liquid from the coolant distribution unit (CDU) or the reservoir and pump unit (RPU) and has a plurality of liquid outlets for supplying cooled liquid to at least one component (2) requiring cooling, wherein the coolant distribution unit (CDU) or the reservoir and pump unit (RPU) of the direct liquid cooling system (DLC) has a housing (13) and at least one sensor (300) with which at least one physical measured variable is determined with regard to the liquid in the coolant distribution unit (CDU) or the reservoir and pump unit (RPU).The housing (13) has a fluidic transition (310) between a liquid-conducting element (320) inside the housing (13) and an outer side (18) of the housing (13), wherein the sensor (300) is connected to the fluidic transition (310) on an outer side (18) of the housing (13). A further aspect of the invention relates to a coolant distribution unit (CDU) or reservoir and pump unit (RPU) for direct liquid cooling (DLC), preferably for direct liquid cooling (DLC) according to the invention.

The invention provides a direct liquid cooling power chip structure and a manufacturing method thereof, and belongs to the technical field of semiconductor packaging, and the method comprises the following steps: carrying out the surface pretreatment of a metal layer of a packaging substrate, so as to remove surface oxides and organic pollutants; processing a micro-channel structure in the metal layer; and electrically and thermally interconnecting a bottom bonding pad of the power chip with the surface of the metal layer, and covering the power chip on one side of the micro-channel structure to form a sealing cover plate. According to the method, the micro-channel structure is directly processed and formed in the metal layer of the packaging substrate, and the power chip covers one side of the micro-channel structure to form the sealing cover plate, so that the cooling liquid can flow close to the bottom of the power chip, heat generated by the power chip can be more efficiently led out, and the heat dissipation efficiency of the power chip is improved. A heat dissipation path is obviously shortened, interface thermal resistance is reduced, and heat exchange efficiency is improved; the device is compact in overall structure, the integration level is remarkably improved, and the requirements of high power density and miniaturized packaging are met.

The invention relates to an arrangement for the direct liquid cooling (DLC) system of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) having a plurality of slots (2), arranged one above the other in the vertical direction (z) of the IT rack (1), for slot-in units (2.1) of a direct liquid cooling (DLC) system and / or of an IT infrastructure, characterised in that the direct liquid cooling (DLC) system has at least two different slot-in units (2.1), each of which is inserted in one of the slots (2).

The invention relates to an arrangement for a direct liquid cooling system (DLC) of an IT infrastructure, said arrangement having at least one IT rack (1) which has a plurality of plug units (2) which are arranged on top of each other in the vertical direction (z) of the IT rack (1) and are used for a direct liquid cooling system (DLC) and / or a plug device (2.1) of the IT infrastructure, characterized in that the plug units (2) are arranged on top of each other in the vertical direction (z) of the IT rack (1). According to the invention, the direct liquid cooling system (DLC) has at least two different plug-in devices (2.1), each of which is inserted into one of the plug-in units (2).

An integrated liquid and air cooling unit is described that has a framework constructed to contain and support a weight of one or more air-based cooling modules and one or more direct liquid cooling modules, in a same real estate space, to supply air-based cooling and direct liquid cooling to Information Technology (IT) computing equipment housed in a datacenter.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The invention relates to a direct liquid cooling (DLC) system for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system comprises a coolant distribution unit (CDU) and a coolant distribution channel (7) supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has a coolant inlet (7.5) which is spaced apart from opposite ends of the coolant distribution channel (7).

Systems and methods for detecting coolant leakage in direct liquid cooling systems are disclosed. Liquid coolant is flowed through cold plates that are attached to adjacent processors. Sensor readings of the processors are formed into a differential signal. Distribution of the differential signal is determined. Leakage of the liquid coolant is detected from the distribution of the differential signal.

The invention discloses a spindle cooling structure and a machine tool, and belongs to the technical field of spindles, the spindle cooling structure comprises a machine body, a front bearing seat and a rear bearing seat which are arranged in the machine body, bearings installed in the front bearing seat and the rear bearing seat, and a motor iron core and a motor coil which are arranged in a shell, the cooling water channel comprises a plurality of mutually independent cooling chambers, and the plurality of cooling chambers are respectively and correspondingly arranged at a bearing of the main shaft, a motor iron core and a motor coil; the cooling chambers are sequentially communicated in series through pipeline holes to form a continuous circulating cooling path, so that cooling liquid can sequentially flow through the cooling chambers corresponding to the front bearing, the motor front coil, the motor rear coil, the rear bearing and the motor iron core; according to the invention, the motor coil, which is a core heat source, is incorporated into a direct liquid cooling circulation system, so that the effective heat exchange area is greatly expanded, each heating part of the main shaft can be directly and fully cooled, and the overall heat dissipation efficiency is qualitatively improved.

The invention discloses a ceramic-substrate-free direct liquid cooling insulation packaging power module and a preparation method thereof, and belongs to the technical field of power semiconductor packaging. The module comprises a semiconductor power chip, a metal block, a plurality of connecting layers, a plurality of metal structural members, an insulation sealing structure and a sealing liquid cooling device. An electrode on the lower surface of the chip is connected with a metal block through a first connecting layer, the metal block is in direct contact with insulating cooling liquid, efficient heat dissipation is achieved, meanwhile, the cooling liquid serves as an insulating medium, and the electrical insulating function is ensured; electrodes on the upper surface of the chip are respectively led out through leads and the second connecting layer; the insulation sealing structure wraps the chip and the internal connection area, thereby further guaranteeing the insulation and sealing performance of the module. A traditional ceramic substrate is abandoned, the structural design is combined with a liquid cooling system, the thermal resistance is remarkably reduced, the heat dissipation efficiency is improved, meanwhile, the problem of insulation failure caused by bubbles is avoided, and the device is suitable for high-power-density application scenes and has the advantages of being low in cost, high in reliability, easy to expand and the like.

The invention relates to an arrangement for direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) having a plurality of plug-in modules (2) for plug-in units (2.1) of a direct liquid cooling (DLC) system and / or IT infrastructure, wherein the arrangement comprises a bus system (40) which has a control unit (9) and a bus (41) having a plurality of data interfaces (42) for the connection of plug-in units (2.1) of a direct liquid cooling (DLC) system, characterised in that the bus system (40) has a self-addressing function for plug-in units (2.1) of a direct liquid cooling (DLC) system, which plug-in units can be connected to the bus (41).

A system and associated method for direct liquid cooling of a semiconductor device. The system includes at least one semiconductor device positioned on a chip substrate and at least one cold plate disposed within the chip substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and is configured to at least partially dissipate heat from the semiconductor device using a coolant during operation of the semiconductor device.

A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.

The invention provides a rapid cooling structure of a motor for an unmanned aerial vehicle, and belongs to the technical field of aircrafts. The motor shell is sleeved with the cooling sleeve of the liquid cooling assembly, direct liquid cooling of the motor is achieved through the cooling sleeve, the cooling sleeve is sleeved with the sleeve of the air cooling assembly, the end, provided with the air passing opening, of the motor shell abuts against the inner sleeve, and the inner sleeve is coaxially sleeved with the inner cylinder connected to one end of the sleeve. An N-shaped air channel of a guide part in the air cooling assembly communicates with a sleeve and an inner sleeve, so that airflow generated by operation of blades of the unmanned aerial vehicle can be guided into the sleeve and the inner sleeve through the air channel, the cooling sleeve and the interior of the motor are cooled through the airflow in the sleeve and the inner sleeve, direct air cooling of the interior of the motor can be achieved, and the cooling effect of the motor is improved. The liquid cooling assembly can be cooled in an auxiliary mode, the coupling effect of air cooling and liquid cooling is achieved, the cooling efficiency is higher, the problem that the cooling efficiency is low due to the fact that an intermediate structure needs to be arranged for conducting heat is solved, and performance output of the motor is facilitated.

A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.

This invention discloses a method and system for correcting the opening degree of a one-way valve, relating to the field of liquid cooling pipeline control. The invention collects full operational data of the one-way valve, constructs an initial benchmark opening degree parameter set through correlation fitting and benchmark mapping, and performs equivalent opening degree extrapolation to obtain preliminary equivalent opening degree calculation results. It then integrates the residual pressure and flow rate of the liquid circuit with the residual heat exchange of the branch circuit to perform thermo-liquid coupling residual correction. Through deviation feature decomposition, fault cause matching, and safety situation assessment, it completes deviation source tracing and backflow risk assessment. Through adaptation screening, interval correction, and closed-loop convergence verification, it outputs the final opening degree correction result. This invention also configures a correction system composed of corresponding functional units, which can correct one-way valve opening degree drift online, automatically trace fault causes, and quantify backflow risk, improving the control accuracy and operating efficiency of the liquid cooling system, reducing maintenance costs, and adapting to the stable operation requirements of direct liquid cooling pipelines in AI data centers.

This application relates to a power domain controller, electronic device, and vehicle. The power domain controller includes a housing and a power integration module. The housing has an open heat dissipation channel, through which coolant is disposed and forms a heat dissipation cycle. The power integration module is fixed to the housing and has its opening closed, with at least a portion of the module in contact with the coolant, which carries away heat from the module. Based on this configuration, when the heat dissipation cycle is activated, the coolant directly contacts the power integration module, thereby directly carrying away its heat. In other words, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Furthermore, this design reduces the amount of thermally conductive gel used for heat conduction, thereby reducing the overall cost and weight of the power domain controller.

Presented are direct liquid cooling systems for regulating magnet temperature of electric machines, methods for making / using such systems, and motor vehicles equipped with traction motors having magnets cooled by such systems. An electric machine includes a stator assembly that is located inside a protective outer housing. The stator assembly includes one or more electromagnetic windings mounted onto a stator core. A rotor assembly is rotatably attached to the housing, coaxial with and spaced from the stator assembly. The rotor assembly includes one or more permanent magnets mounted to a rotor core. The rotor core includes one or more radially elongated feed grooves that are fluidly connected to one or more axially elongated feed channels. The rotor feed groove(s) fluidly connect to a direct liquid cooling system to receive therefrom a liquid coolant. Each rotor feed channel transports the liquid coolant into direct contact with a target surface of a magnet.

A liquid cooling system includes first and second coolant tubes and a coupler to couple the first coolant tube to the second coolant tube. The first coolant tube receives coolant liquid from a first element of the liquid cooling system. The second coolant tube provides the coolant liquid to a second element of the liquid cooling system. The coupler is configured to receive an electrical signal to constrict a flow of the coolant liquid.

The invention relates to an arrangement for the direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) with a plurality of slots (2) for plug-in devices (2.1) of a direct liquid cooling (DLC) and / or an IT infrastructure, wherein the arrangement comprises a bus system (40) with a control unit (9) which has a bus (41) with a plurality of data interfaces (42) for connecting plug-in devices (2.1) of a direct liquid cooling (DLC), characterized in that the bus system (40) has self-addressing for plug-in devices (2.1) of a direct liquid cooling (DLC) that can be connected to the bus (41).