63 results about "Direct liquid cooling" patented technology

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

Systems and methods are provided for a high density liquid cooling unit to cool electrical components. A replaceable pump unit (RPU) can include a pump configured to provide fluid flow to cool the electrical components (e.g., via direct liquid cooling of the electrical components by the pumped fluid and air-to-liquid cooling of the pumped fluid via a heat exchanger in fluid communication with the RPU). The RPU can be configured to be operated with or satisfy one or more RPU performance characteristics.

A liquid cooling system includes first and second coolant tubes and a coupler to couple the first coolant tube to the second coolant tube. The first coolant tube receives coolant liquid from a first element of the liquid cooling system. The second coolant tube provides the coolant liquid to a second element of the liquid cooling system. The coupler is configured to receive an electrical signal to constrict a flow of the coolant liquid.

A method of controlling a hybrid adiabatic cooling system to cool an interior of a data center includes a step of cooling, by a hybrid adiabatic cooler, a first cooling liquid circulating from a return segment of an outer conduit loop to a feed segment of the outer conduit loop. The method includes a step of exchanging, by a direct liquid cooling unit, heat between a second cooling liquid and the first cooling liquid circulating in the outer conduit loop. The method includes a step of diverting a portion of the first cooling liquid circulating in the outer conduit loop to an inner conduit loop. The method includes a step of exchanging, by a room air handling unit, heat between indoor ambient air and the diverted portion of the first cooling liquid circulating in the inner conduit loop.

The invention provides a direct liquid cooling power chip structure and a manufacturing method thereof, and belongs to the technical field of semiconductor packaging, and the method comprises the following steps: carrying out the surface pretreatment of a metal layer of a packaging substrate, so as to remove surface oxides and organic pollutants; processing a micro-channel structure in the metal layer; and electrically and thermally interconnecting a bottom bonding pad of the power chip with the surface of the metal layer, and covering the power chip on one side of the micro-channel structure to form a sealing cover plate. According to the method, the micro-channel structure is directly processed and formed in the metal layer of the packaging substrate, and the power chip covers one side of the micro-channel structure to form the sealing cover plate, so that the cooling liquid can flow close to the bottom of the power chip, heat generated by the power chip can be more efficiently led out, and the heat dissipation efficiency of the power chip is improved. A heat dissipation path is obviously shortened, interface thermal resistance is reduced, and heat exchange efficiency is improved; the device is compact in overall structure, the integration level is remarkably improved, and the requirements of high power density and miniaturized packaging are met.

The invention relates to an arrangement for a direct liquid cooling system (DLC) of an IT infrastructure, said arrangement having at least one IT rack (1) which has a plurality of plug units (2) which are arranged on top of each other in the vertical direction (z) of the IT rack (1) and are used for a direct liquid cooling system (DLC) and / or a plug device (2.1) of the IT infrastructure, characterized in that the plug units (2) are arranged on top of each other in the vertical direction (z) of the IT rack (1). According to the invention, the direct liquid cooling system (DLC) has at least two different plug-in devices (2.1), each of which is inserted into one of the plug-in units (2).

An integrated liquid and air cooling unit is described that has a framework constructed to contain and support a weight of one or more air-based cooling modules and one or more direct liquid cooling modules, in a same real estate space, to supply air-based cooling and direct liquid cooling to Information Technology (IT) computing equipment housed in a datacenter.

A hybrid adiabatic cooling system for a data center includes an outer conduit loop including a feed segment and a return segment and an inner conduit loop fluidly coupled to the feed and return segments of the outer conduit loop. The hybrid adiabatic cooling system includes a hybrid adiabatic cooler fluidly coupled to the outer conduit loop to cool a first cooling liquid circulating from the return segment to the feed segment of the outer conduit loop. The hybrid adiabatic cooling system includes a direct liquid cooling unit fluidly coupled to the outer conduit loop and an air handling unit fluidly coupled to the inner conduit loop. The hybrid adiabatic cooling system operates in a free cooling mode when the outdoor air temperature is less than a first threshold temperature and a chiller mode when the outdoor air temperature is greater than the first threshold temperature.

The invention relates to a direct liquid cooling (DLC) system for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system comprises a coolant distribution unit (CDU) and a coolant distribution channel (7) supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has a coolant inlet (7.5) which is spaced apart from opposite ends of the coolant distribution channel (7).

Systems and methods for detecting coolant leakage in direct liquid cooling systems are disclosed. Liquid coolant is flowed through cold plates that are attached to adjacent processors. Sensor readings of the processors are formed into a differential signal. Distribution of the differential signal is determined. Leakage of the liquid coolant is detected from the distribution of the differential signal.

The invention discloses a spindle cooling structure and a machine tool, and belongs to the technical field of spindles, the spindle cooling structure comprises a machine body, a front bearing seat and a rear bearing seat which are arranged in the machine body, bearings installed in the front bearing seat and the rear bearing seat, and a motor iron core and a motor coil which are arranged in a shell, the cooling water channel comprises a plurality of mutually independent cooling chambers, and the plurality of cooling chambers are respectively and correspondingly arranged at a bearing of the main shaft, a motor iron core and a motor coil; the cooling chambers are sequentially communicated in series through pipeline holes to form a continuous circulating cooling path, so that cooling liquid can sequentially flow through the cooling chambers corresponding to the front bearing, the motor front coil, the motor rear coil, the rear bearing and the motor iron core; according to the invention, the motor coil, which is a core heat source, is incorporated into a direct liquid cooling circulation system, so that the effective heat exchange area is greatly expanded, each heating part of the main shaft can be directly and fully cooled, and the overall heat dissipation efficiency is qualitatively improved.

The invention discloses a ceramic-substrate-free direct liquid cooling insulation packaging power module and a preparation method thereof, and belongs to the technical field of power semiconductor packaging. The module comprises a semiconductor power chip, a metal block, a plurality of connecting layers, a plurality of metal structural members, an insulation sealing structure and a sealing liquid cooling device. An electrode on the lower surface of the chip is connected with a metal block through a first connecting layer, the metal block is in direct contact with insulating cooling liquid, efficient heat dissipation is achieved, meanwhile, the cooling liquid serves as an insulating medium, and the electrical insulating function is ensured; electrodes on the upper surface of the chip are respectively led out through leads and the second connecting layer; the insulation sealing structure wraps the chip and the internal connection area, thereby further guaranteeing the insulation and sealing performance of the module. A traditional ceramic substrate is abandoned, the structural design is combined with a liquid cooling system, the thermal resistance is remarkably reduced, the heat dissipation efficiency is improved, meanwhile, the problem of insulation failure caused by bubbles is avoided, and the device is suitable for high-power-density application scenes and has the advantages of being low in cost, high in reliability, easy to expand and the like.

The invention relates to an arrangement for direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) having a plurality of plug-in modules (2) for plug-in units (2.1) of a direct liquid cooling (DLC) system and / or IT infrastructure, wherein the arrangement comprises a bus system (40) which has a control unit (9) and a bus (41) having a plurality of data interfaces (42) for the connection of plug-in units (2.1) of a direct liquid cooling (DLC) system, characterised in that the bus system (40) has a self-addressing function for plug-in units (2.1) of a direct liquid cooling (DLC) system, which plug-in units can be connected to the bus (41).

A system and associated method for direct liquid cooling of a semiconductor device. The system includes at least one semiconductor device positioned on a chip substrate and at least one cold plate disposed within the chip substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and is configured to at least partially dissipate heat from the semiconductor device using a coolant during operation of the semiconductor device.

A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.

The invention provides a rapid cooling structure of a motor for an unmanned aerial vehicle, and belongs to the technical field of aircrafts. The motor shell is sleeved with the cooling sleeve of the liquid cooling assembly, direct liquid cooling of the motor is achieved through the cooling sleeve, the cooling sleeve is sleeved with the sleeve of the air cooling assembly, the end, provided with the air passing opening, of the motor shell abuts against the inner sleeve, and the inner sleeve is coaxially sleeved with the inner cylinder connected to one end of the sleeve. An N-shaped air channel of a guide part in the air cooling assembly communicates with a sleeve and an inner sleeve, so that airflow generated by operation of blades of the unmanned aerial vehicle can be guided into the sleeve and the inner sleeve through the air channel, the cooling sleeve and the interior of the motor are cooled through the airflow in the sleeve and the inner sleeve, direct air cooling of the interior of the motor can be achieved, and the cooling effect of the motor is improved. The liquid cooling assembly can be cooled in an auxiliary mode, the coupling effect of air cooling and liquid cooling is achieved, the cooling efficiency is higher, the problem that the cooling efficiency is low due to the fact that an intermediate structure needs to be arranged for conducting heat is solved, and performance output of the motor is facilitated.

A system and associated method for direct liquid cooling of semiconductor devices. The system includes at least one semiconductor device is positioned on a die substrate and at least one cold plate disposed within the die substrate and containing a cooling liquid. The cold plate is positioned proximate to the semiconductor device and configured to at least partially dissipate heat using the cooling liquid from the semiconductor device during operation of the semiconductor device.

This invention discloses a method and system for correcting the opening degree of a one-way valve, relating to the field of liquid cooling pipeline control. The invention collects full operational data of the one-way valve, constructs an initial benchmark opening degree parameter set through correlation fitting and benchmark mapping, and performs equivalent opening degree extrapolation to obtain preliminary equivalent opening degree calculation results. It then integrates the residual pressure and flow rate of the liquid circuit with the residual heat exchange of the branch circuit to perform thermo-liquid coupling residual correction. Through deviation feature decomposition, fault cause matching, and safety situation assessment, it completes deviation source tracing and backflow risk assessment. Through adaptation screening, interval correction, and closed-loop convergence verification, it outputs the final opening degree correction result. This invention also configures a correction system composed of corresponding functional units, which can correct one-way valve opening degree drift online, automatically trace fault causes, and quantify backflow risk, improving the control accuracy and operating efficiency of the liquid cooling system, reducing maintenance costs, and adapting to the stable operation requirements of direct liquid cooling pipelines in AI data centers.

This application relates to a power domain controller, electronic device, and vehicle. The power domain controller includes a housing and a power integration module. The housing has an open heat dissipation channel, through which coolant is disposed and forms a heat dissipation cycle. The power integration module is fixed to the housing and has its opening closed, with at least a portion of the module in contact with the coolant, which carries away heat from the module. Based on this configuration, when the heat dissipation cycle is activated, the coolant directly contacts the power integration module, thereby directly carrying away its heat. In other words, the heat dissipation method of this application is direct liquid cooling, which provides better heat dissipation compared to previous heat conduction methods. Furthermore, this design reduces the amount of thermally conductive gel used for heat conduction, thereby reducing the overall cost and weight of the power domain controller.

Presented are direct liquid cooling systems for regulating magnet temperature of electric machines, methods for making / using such systems, and motor vehicles equipped with traction motors having magnets cooled by such systems. An electric machine includes a stator assembly that is located inside a protective outer housing. The stator assembly includes one or more electromagnetic windings mounted onto a stator core. A rotor assembly is rotatably attached to the housing, coaxial with and spaced from the stator assembly. The rotor assembly includes one or more permanent magnets mounted to a rotor core. The rotor core includes one or more radially elongated feed grooves that are fluidly connected to one or more axially elongated feed channels. The rotor feed groove(s) fluidly connect to a direct liquid cooling system to receive therefrom a liquid coolant. Each rotor feed channel transports the liquid coolant into direct contact with a target surface of a magnet.

A liquid cooling system includes first and second coolant tubes and a coupler to couple the first coolant tube to the second coolant tube. The first coolant tube receives coolant liquid from a first element of the liquid cooling system. The second coolant tube provides the coolant liquid to a second element of the liquid cooling system. The coupler is configured to receive an electrical signal to constrict a flow of the coolant liquid.

The invention relates to an arrangement for the direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one IT rack (1) with a plurality of slots (2) for plug-in devices (2.1) of a direct liquid cooling (DLC) and / or an IT infrastructure, wherein the arrangement comprises a bus system (40) with a control unit (9) which has a bus (41) with a plurality of data interfaces (42) for connecting plug-in devices (2.1) of a direct liquid cooling (DLC), characterized in that the bus system (40) has self-addressing for plug-in devices (2.1) of a direct liquid cooling (DLC) that can be connected to the bus (41).

The utility model provides a laser pumping source based on direct liquid cooling contact, which comprises a pumping light source assembly and a cooling plate, the side end face of the cooling plate is provided with a liquid inlet and a liquid outlet, a liquid conveying channel is distributed in the cooling plate, one end of the liquid conveying channel extends to the liquid inlet, and the other end of the liquid conveying channel extends to the liquid outlet. The other end of the liquid conveying channel extends to the liquid outlet; a liquid opening is formed in the upper end of the cooling plate, and a liquid conveying channel in a preset area in the cooling plate is exposed to the outside through the liquid opening; the pump light source assembly is arranged at the upper end of the liquid opening, and when cooling liquid is input into the liquid conveying channel, the lower end of the pump light source assembly makes contact with the cooling liquid in the liquid conveying channel in the preset area, so that cooling of the pump light source assembly is achieved; the lower end of the pump light source assembly is in direct contact with the cooling liquid in the cooling plate, so that the heat dissipation efficiency of the pump light source assembly is improved.

The invention discloses a cold plate type direct-cooling liquid-cooling circulation system, which is characterized in that an internal pipeline of a liquid-cooling cold plate is directly connected with an external radiating pipeline, indirect heat exchange structures such as a heat exchanger are omitted, the cooling effect can be guaranteed and the energy efficiency can be improved only by using a single cooling liquid, redundant pumping capacity is provided, and the reliability is good. The system mainly comprises an indoor server system, an outdoor unit system and a circulating system. The outdoor unit system comprises an outdoor liquid inlet path, an air cooler, an air cooling liquid inlet path, an air cooling liquid outlet path and an outdoor liquid outlet path; the indoor server system comprises a water inlet branch water device, a water outlet branch water device, a plurality of servers and a plurality of liquid cooling plates, the water inlet branch water device comprises a water inlet vertical main pipe and a plurality of water inlet branch pipes, the water outlet branch water device comprises a water outlet vertical main pipe and a plurality of water outlet branch pipes, and the circulating system comprises a circulating liquid inlet path, a circulating liquid outlet path and two circulating pump paths. And a circulating front-end ball valve, a liquid cooling circulating pump, a circulating liquid inlet check valve and a circulating rear-end ball valve are arranged on the circulating pump path.

A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

The invention relates to a direct liquid cooling (DLC) system for an IT infrastructure with at least one component (2) requiring cooling, wherein the direct liquid cooling system comprises a coolant distribution unit (CDU) and a coolant distribution channel (7) supplied with cooled liquid by the coolant distribution unit (CDU), characterized in that the coolant distribution channel (7) has a coolant inlet (7.5) which is spaced apart from opposite ends of the coolant distribution channel (7).

The invention relates to an arrangement for direct liquid cooling (DLC) of an IT infrastructure, wherein the arrangement comprises at least one coolant circuit (15) with a coolant distribution unit (CDU) for providing cooled liquid, wherein an expansion vessel (10) is fluidically connected to the coolant circuit (15) via a leak-free quick coupling (50).

Systems and methods for detecting coolant leaks in a direct liquid cooling system are disclosed. Liquid coolant flows through a cold plate attached to an adjacent processor. Sensor readings of the processor are formed into a differential signal. A distribution of the differential signals is determined. Leaks of the liquid coolant are detected from the distribution of the differential signal.