Base plate with integrated heat tubes and module device thereof

A technology for integrating heat pipes and bottom plates, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of reducing heat dissipation efficiency and inapplicable thermal resistance, and achieve improved heat dissipation efficiency, efficient and reliable heat dissipation, and reduced system The effect of thermal resistance

Active Publication Date: 2016-09-21
ZHUZHOU CRRC TIMES SEMICON CO LTD
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal resistance of this layer of silicone grease accounts for about half of the total thermal resistance from the device to the heat sink. The larger thermal resistance is not suitable for high-power and small-sized packaging structures, and the higher working environment temperature of electric vehicle modules will be greatly reduced. Its heat dissipation efficiency, with the improvement of the performance of electric vehicles, the requirements for power density, thermal management, operating temperature and power conversion efficiency of IGBT modules are also increasing, which requires the use of more efficient structures and materials for module packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Base plate with integrated heat tubes and module device thereof
  • Base plate with integrated heat tubes and module device thereof
  • Base plate with integrated heat tubes and module device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The core idea of ​​the present invention is to provide a bottom plate with an integrated heat pipe and a module device thereof, which can realize efficient and reliable heat dissipation of a power module in an electric vehicle motor drive system.

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] The first bottom plate with integrated heat pipes provided by the embodiment of the present application, such as figure 2 as shown, figure 2 A schematic diagram of a bottom plate with integrated hea...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a base plate with integrated heat tubes and a module device thereof, wherein the base plate with the integrated heat tubes comprises a base plate main body, direct liquid cooling fins and the integrated heat tubes, the direct liquid cooling fins are arranged at the lower surface of the metal base plate, the base plate main body and the direct liquid cooling fins both are internally provided with the integrated heat tubes, and the integrated heat tubes are internally provided with a low-temperature phase change liquid medium for quickly conducting heat. The base plate with the integrated heat tubes and the module device thereof, provided by the invention, have the integrated heat tubes with high heat dissipation efficiency and the direct liquid cooling fins, perform heat dissipation through the low-temperature phase change liquid medium and an external cooling medium, consequently can eliminate heat conduction silicone grease in a conventional power module, and can realize high-efficiency and reliable heat dissipation for a power module of an electric car.

Description

technical field [0001] The invention belongs to the technical field of power electronic devices for electric vehicles, in particular to a bottom plate with integrated heat pipes and a module device thereof. Background technique [0002] At present, in order to alleviate the global fossil energy crisis and environmental degradation, human beings are working hard to develop renewable and clean energy. The power system applying new clean energy is one of the hot research and development areas in the power electronics industry. Hybrid electric vehicles and pure electric vehicles are systems driven partially or completely by electricity. They have become one of the most important products for replacing fossil energy and reducing carbon dioxide emissions and noise pollution. Among them, the inverter system with the power IGBT (Insulated Gate Bipolar Transistor) module as the core component is responsible for converting the DC power provided by the battery into the AC power driven ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
CPCH01L23/367H01L2924/181H01L2224/32225H01L2224/48137H01L2224/48227H01L2224/73265H01L2924/00H01L2924/00012
Inventor 戴小平吴义伯刘国友
Owner ZHUZHOU CRRC TIMES SEMICON CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products