Base plate with integrated heat tubes and module device thereof
A technology for integrating heat pipes and bottom plates, which is applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of reducing heat dissipation efficiency and inapplicable thermal resistance, and achieve improved heat dissipation efficiency, efficient and reliable heat dissipation, and reduced system The effect of thermal resistance
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[0028] The core idea of the present invention is to provide a bottom plate with an integrated heat pipe and a module device thereof, which can realize efficient and reliable heat dissipation of a power module in an electric vehicle motor drive system.
[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0030] The first bottom plate with integrated heat pipes provided by the embodiment of the present application, such as figure 2 as shown, figure 2 A schematic diagram of a bottom plate with integrated hea...
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