Liquid-cooling type panel aluminum heat pipe radiator and manufacturing method thereof

Abstract

The invention relates to a liquid-cooling type panel aluminum heat pipe radiator. The liquid-cooling type panel aluminum heat pipe radiator comprises a liquid cooling plate and a panel aluminum heat pipe, wherein the liquid cooling plate comprises a liquid cooling plate body, a cover body and an accommodating space, wherein the accommodating space is formed by enclosure of the liquid cooling platebody and the cover body, a plurality of separation fins are arranged in the accommodating space, a liquid inlet and a liquid outlet are formed in the liquid cooling plate body, the space between theliquid inlet and the liquid outlet is separated into a plurality of main runners by the separation fins, and the main runners are connected in series in an S manner; and the accommodating space is filled with a cold medium; and insertion holes are formed in a plane side of the liquid cooling plate body. According to the liquid-cooling type panel aluminum heat pipe radiator disclosed by the invention, the accurate heat radiation of heating electronic elements is realized, and the heat radiation efficiency is substantially improved; compared with a direct liquid-cooling type heat radiation manner, the radiator has the advantages that by utilizing an indirect water cooling heat radiation manner, the liquid cooling plate and the panel aluminum heat pipe are respectively sealed, so that the sealing effect is good, the cold medium is unlikely to be leaked, and the stability is good; and compared with a heat radiation structure of a copper water heat pipe type heat exchanging device, the light and convenient panel aluminum heat pipe is adopted.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic products, in particular to a liquid-cooled flat aluminum heat pipe radiator and a manufacturing method thereof. Background technique [0002] With the development of manufacturing technology, the integration of semiconductors is getting higher and higher, and the performance of chips is getting stronger and stronger. With the improvement of performance, it is accompanied by the problem of heat dissipation of electronic equipment. Traditional air-cooled radiators can no longer meet the heat dissipation requirements of current high-density heat flow servers. [0003] Some electronic equipment began to use direct water cooling and heat dissipation. Direct water cooling means that the liquid-cooled refrigerant is directly introduced from the outside to the position of the electronic components that need heat dissipation through the pipeline, and the heat exchange with the electronic compo...

AI Technical Summary

Problems solved by technology

Traditional air-cooled radiators can no longer meet the cooling requirements of current high-density heat flow servers

[0003] Some electronic equipment began to use direct water cooling and heat dissipation. Direct water cooling means that the liquid cooling refrigerant is directly introduced from the outside to the position of the electronic components that need to be dissipated through the pipeline, and the electronic components are directly exchanged with the electronic components to take away the electronic components. Although its advantages are very obvious, that is, the heat dissipation performance is greatly improved, its disadvantages are also very obvious, such as easy leakage, difficult maintenance, easy corrosion, and potential safety hazards

[0004] There are also heat dissipation methods that use indirect water cooling. In the prior art, the indirect water cooling heat dissipation mainly adopts the heat dissipation structure of copper water heat pipe plus heat exchange device. The copper water heat pipe absorbs heat from electronic components and exchanges heat with the heat exchange device to dissipate heat. However, the copper water heat pipe has a relatively small contact area with both the heat exchange device and the electronic components. At the same time, its manufacturing process is relatively complicated and its weight is relatively heavy. It has a certain pressure on the main board and may damage the main board.

Images