The invention discloses a novel three-dimensional packaging
structure based on a flexible substrate and a
chip heat dissipation method, particularly relates to the technical field of micro three-dimensional
integrated circuit packaging structures, and solves the problems that in the prior art, a
chip packaging structure is low in integration level and poor in heat dissipation performance, and the manufacturing process of a
silicon through hole technology in advanced packaging is complex; in the prior art, a
silicon chip needs to be drilled and filled with a conductive material, so that the production cost is increased, the drilling and filling process has extremely high requirements on precision and control, and secondly,
signal interference is caused, and a series of
signal distortion and
crosstalk problems can be caused in the field of high-frequency signals due to the fact that a TSV is vertical; according to the technical scheme, a rigid-flexible combined packaging structure, a rigid
metal stable three-dimensional packaging structure and a flexible substrate are adopted, and expensive technologies such as through
silicon vias are not used; according to the three-dimensional packaging structure, essence of the rigid substrate and essence of the flexible substrate are respectively taken, dregs are removed, and the rigid substrate and the flexible substrate make up for each other.