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Heat dissipation device of mobile cabinet level server system and thermal management method of heat dissipation device

A technology of server system and heat dissipation device, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment construction parts, etc., which can solve the problems of large initial investment in data centers, large impact on office environment, and low resource utilization. To achieve the effect of improving reliability, low cost and high safety factor

Pending Publication Date: 2017-11-24
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional data center has a large initial investment and low resource utilization. Therefore, the application of the mobile rack-level server system is born. It can flexibly provide cloud platform solutions and is widely used in production, life, education, medical care, network security, etc.
However, at present, the system is restricted by heat dissipation, and it will generate a large amount of heat when it is working. The traditional heat dissipation device and heat dissipation method is to directly use the fan to supply air, and the air flows to exchange heat for heat dissipation. The heat dissipation effect is poor, and the server is in danger of downtime. The reliability is low, and at the same time, in a quiet office environment, the noise is relatively large, which has a relatively large impact on the office environment

Method used

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  • Heat dissipation device of mobile cabinet level server system and thermal management method of heat dissipation device
  • Heat dissipation device of mobile cabinet level server system and thermal management method of heat dissipation device
  • Heat dissipation device of mobile cabinet level server system and thermal management method of heat dissipation device

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Experimental program
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Effect test

Embodiment 1

[0036] Such as Figure 1 to Figure 6 As shown, a heat dissipation device for a mobile cabinet-level server system includes water-cooled heat pipes installed in the mobile cabinet 1 to dissipate heat from UPS power supplies, switches, routers, firewall servers, CPUs, memory, north bridges, hard disks, and power supplies. Module 3, pipeline system 4, rear door heat dissipation device 5 and control system, each electronic device 2 in the mobile cabinet 1 that needs heat dissipation corresponds to a water-cooled heat pipe heat dissipation module 3, and the water-cooled heat pipe heat dissipation module 3 is used from The electronic equipment 2 absorbs heat, and several water-cooled heat pipe cooling modules 3 are connected to the rear door cooling device 5 through the pipeline system 4. The rear door cooling device 5 includes a water pump 52, a cold row 54 and a fan arranged on the cabinet door of the mobile cabinet 1. 55, the fan 55 is aligned with the cold row 54, and the water ...

Embodiment 2

[0046] The basic structure of this embodiment is the same as that of Embodiment 1, and its similarity with Embodiment 1 will not be repeated here. The difference between it and Embodiment 1 is:

[0047] In embodiment 2, only water pump 52 part is different from embodiment 1, and other parts are all the same, as Figure 7 As shown, in Embodiment 2, the dual water pumps 52 are connected in series, and the dual water pumps 52 are connected in series to drive the entire cycle operation. When the double water pumps 52 are connected in series, the water tank 51 and the water pump 52 adopt an integrated design. At the same time, when the double water pumps 52 are connected in series, there is only one inlet and one outlet. The interface is connected.

Embodiment 3

[0049] The basic structure of this embodiment is the same as that of Embodiment 1, and its similarity with Embodiment 1 will not be repeated here. The difference between it and Embodiment 1 is:

[0050] A cooling device for a mobile rack-level server system, the control system includes a temperature control system and an industrial control system, the temperature control system includes a temperature sensing device, the temperature sensing device is used to sense the temperature of liquid refrigerant, and the temperature control system sends a signal to the industrial control system according to the temperature system, the industrial control system controls the flow regulating device to adjust the flow rate of the refrigerant and the speed of the fan 55 .

[0051] A heat management method for a cooling device of a mobile cabinet-level server system. The temperature control system is controlled by feedback. When the temperature of the liquid refrigerant in the circulation system...

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Abstract

The invention relates to a heat dissipation device of a mobile cabinet level server system. The heat dissipation device comprises a plurality of water-cooling hot pipe heat dissipation modules, a pipeline system, a rear door heat dissipation device and a control system, wherein the plurality of water-cooling hot pipe heat dissipation modules are arranged in a mobile cabinet, each electronic equipment needed to be cooled in the mobile cabinet is corresponding to one of the water-cooling hot pipe heat dissipation modules, accurate heat dissipation of a heating part can be achieved, and the heat dissipation efficiency is substantially improved; compared liquid cooling with traditional air cooling, a medium of liquid cooling is relatively large in specific heat capacity, more heat can be taken away, meanwhile, the heat dissipation device is relatively quite during running, and noise can be reduced very well; a hot pipe is good hot conductor, is high in safety coefficient and low in cost and is widely used in the field of heat dissipation, the problem of heat dissipation of a high-flux density component in the field of heat dissipation can be solved very well by combining water cooling and the hot pipe, and the reliability of the component is improved; compared with air cooling, the noise of the hot pipe can be reduced; and a liquid cooling system is low in power during normal working, and more energy is saved.

Description

technical field [0001] The invention relates to the field of server heat dissipation, in particular to a heat dissipation device and a heat management method for a mobile cabinet-level server system. Background technique [0002] In recent years, cloud computing has become the third revolution of IT industry after personal computer and Internet revolution. The revolution brought about by cloud computing is to transform IT infrastructure into basic social public facilities like water and electricity. This is of great significance for effectively helping the majority of small and medium-sized enterprises to strengthen independent innovation, reduce operating costs, shorten R&D cycles, and control technological risks. In the global market, the cloud computing industry has entered a growth stage, and the scale of my country's cloud computing market exceeds 117.3 billion yuan. [0003] The traditional data center has a large initial investment and low resource utilization. Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20772H05K7/20809
Inventor 李勇刘嵩周文杰何柏林黄光文陈韩荫陈创新
Owner SOUTH CHINA UNIV OF TECH
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