Heat dissipation device

A technology of a heat dissipation device and a heat dissipation module, applied in the electronic field, can solve the problems of weak heat dissipation effect of the heat dissipation device and the like

Active Publication Date: 2020-12-01
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the embodiment of the present application is to provide a heat dissipation device, w

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0021] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequences other than those illustrated or described herein, and that references to "first," "second," et...

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Abstract

The invention discloses a heat dissipation device, and belongs to the field of electronics. The heat dissipation device comprises a shell, a heat conduction module and a heat dissipation module; the shell is connected with electronic equipment; the heat conduction module is connected with the shell and located on the side, close to the electronic equipment, of the shell; the heat dissipation module is connected with the shell and located on the side, away from the electronic equipment, of the shell; the shell and the electronic equipment are matched to form a heat conduction channel; the heatconduction module is located in the heat conduction channel; the heat dissipation module is communicated with the heat conduction channel; the heat conduction module comprises a plurality of flexibleheat conduction units, each flexible heat conduction unit comprises a base, a flexible heat conduction piece and an elastic piece; the bases are detachably connected with the shell; the flexible heatconduction pieces abut against the electronic equipment; the first ends of the elastic pieces are connected with the bases; and the second ends of the elastic pieces are connected with the flexible heat conduction pieces. The heat dissipation device provided by the embodiments of the invention has the advantage of making the heat dissipation of the electronic equipment quicker and more accurate.

Description

technical field [0001] The present application belongs to the field of electronics, and in particular relates to a heat dissipation device. Background technique [0002] As intelligent electronic devices become more powerful, the power consumption of electronic devices is also greater. Taking a mobile phone as an example, it is not only a tool for calls and text messages, but also an important device for entertainment in leisure time, such as taking pictures, games, videos and other functions. Such more functions also mean greater power consumption. When a mobile phone is running a large-scale mobile game, in order to protect the mobile phone from heat, many mobile phones are equipped with protective measures to reduce the frequency of the mobile phone CPU and reduce power consumption. The situation of Caton reduces the user experience, which is painful for many game enthusiasts. [0003] In the prior art, the mobile phone itself does not have a heat dissipation function, ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20445H05K7/20454
Inventor 周旭东
Owner VIVO MOBILE COMM CO LTD
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