Direct cooling heat dissipation substrate and power module thereof

Abstract

The invention provides a direct cooling heat dissipation substrate which realizes the direct liquid cooling without needing the contact between a heat conduction silicone grease layer and an externalradiator. The direct cooling heat dissipation substrate comprises an electrical loop layer, an insulating layer and a heat dissipation layer, the heat dissipation layer comprises a direct cooling layer, and the direct cooling layer can perform air cooling or can be directly connected to an external cooling system to realize the direct cooling. The invention also provides a power module prepared from the direct cooling heat dissipation substrate. According to the direct cooling heat dissipation substrate and the power module thereof, a porous metal foam structure is integrated under a metal layer to access to the external cooling system, and the direct cooling is achieved through the external cooling liquid, so that the number of the thermal interfaces of the internal materials of the module is reduced, the thermal resistance of the module is reduced, the heat dissipation performance and reliability of the power module are improved, the rapid and efficient heat dissipation of the powerIGBT module is achieved, the purpose of reducing the weight and size of the module is achieved, and the direct cooling heat dissipation substrate and the module have the advantages of being low in thermal resistance, light in weight and high in reliability.

Description

technical field [0001] The invention relates to the technical field of power modules, in particular to a heat dissipation substrate capable of direct cooling and a power module thereof. Background technique [0002] The heat dissipation of power semiconductor modules is one of the most concerned issues for designers and users. An efficient heat dissipation design can keep the temperature rise of power devices in a low range and increase the reliability and life of the devices. As the power density of power semiconductor modules continues to increase, the thermal management requirements for modules and systems are also gradually increasing, especially for high power density, high transient power consumption, and applications with high ambient temperature and high cooling medium temperature. For systems, such as electric vehicles, multi-electric aircraft, etc., effective heat dissipation is even more important. [0003] The traditional power module heat dissipation structure ...

AI Technical Summary

Problems solved by technology

However, this structure generally adopts copper material with high thermal conductivity, which has a large volume and weight, which is not conducive to systems such as electric vehicles and multi-electric aircraft that require high requirements in these two aspects.

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