723results about "Instrumental cooling apparatus" patented technology

The present invention provides arrangements for electroluminescent displays 10 comprising a packaged semiconductor light emitting element 12 that has a light emitting display side 16. A heat sink 22 is disposed in the region of a rear side of the light-emitting element 12 opposite to the display side. Electrical connections 28 from the light emitting element 12 pass through said heat sink 22. Drive circuitry 30 for the light emitting element 12 is connected thereto by the electrical connections 28 and spaced apart from the heat sink 22 in such a manner that at least one cooling channel 34 is defined between the heat sink 22 and the drive circuitry 30 for the passage in use of a cooling fluid.

The present invention provides arrangements for electroluminescent displays 10 comprising a packaged semiconductor light emitting element 12 that has a light emitting display side 16. A heat sink 22 is disposed in the region of a rear side of the light-emitting element 12 opposite to the display side. Electrical connections 28 from the light emitting element 12 pass through said heat sink 22. Drive circuitry 30 for the light emitting element 12 is connected thereto by the electrical connections 28 and spaced apart from the heat sink 22 in such a manner that at least one cooling channel 34 is defined between the heat sink 22 and the drive circuitry 30 for the passage in use of a cooling fluid.

A heat spreader for an emissive display device, such as a plasma display panel or a light emitting diode, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell facing the back surface of the device.

The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

The present invention relates to a heat sinking tab for dissipating heat directly from an optical sub-assembly (OSA) to a transceiver housing, within which the optical sub-assembly is located. The heat sinking tab includes a mounting plate for mounting on the rear end of a transistor outline (TO) can, and a finger for extending into contact or close proximity to the transceiver housing. The mounting plate also provides a stiffening plate for flexible conductors used to connect the OSA leads to a transceiver printed circuit board (PCB).

The temperature control system includes heat elimination air flue including air inlet and air outlet, and reflow dual flue including first air inlet and first air outlet. The first air inlet and first air outlet of reflow dual flue are connected to the air outlet and air inlet of the heat elimination air flue. Heat elimination fan system is setup in the heat elimination air flue. Circulating fan system is setup in the reflow dual flue. Under environment in normal temperature, the invention does not need of using additional heating unit. Using heat consumption of equipment self, the invention carries out heating to reduce relative humidity in cabinet, inhibit corrosion, save energy, and guarantee reliable heat elimination for equipment.

This invention relates to one plate effective circuit heating tube device in conduction and electronic cooling field, which is characterized by the following: providing one plate circuit integration vapor and compensation structure; the first liquid absorptive chip acting as industry substances vapor, the second chips acts to enlarge the system capillary abstracting function with its holes structure easy to arrive the first absorptive chip and acts to reduce the system heat leakage; the first liquid absorptive chip comprises level groove and vertical groove.

A device having an improved heat dissipation includes: a panel assembly, a chassis base to support the panel assembly, a circuit substrate coupled to the chassis base, a flexible printed cable, respective ends of which are connected to electrode terminals of the panel assembly and a connector of the circuit substrate, the flexible printed cable transmitting electrical signals therebetween, and a heat radiator to dissipate heat generated by an IC and mounted on the chassis base on which the IC of the flexible printed cable is attached. The device can rapidly dissipate heat generated by an IC during operation since a heat radiator is disposed on one end of the chassis base corresponding to the IC of the flexible printed cable. Accordingly, an operating temperature of the IC can be maintained at an appropriate level, thereby improving the reliability of the IC.

To provide a display device with high reliability, which is capable of supporting a display panel well even when the display panel is enlarged, and capable of radiating the heat generated in the display panel well. A display device 100 of the present invention has an organic EL panel (display panel) 150 and a reinforcing structure 160 provided on the backside of the display panel 150. The reinforcing structure 160 comprises a base plate 161 forming a part adhered to a back face of the organic EL panel 150, and a heat radiation member 170 provided on the base plate 161.

The heat sink includes following parts: cabinet; insertion frame for equipment setup at central area of the cabinet; both of first air inlet and first air outlet positioned at first side of the cabinet; being setup at gap between first side of the cabinet and insertion frame for equipment, the shield plate is in use for obstructing connection at the gap between first air inlet and first air outlet; being connecting first air inlet and first air outlet, first air channel is formed from gaps between other three side surfaces of the cabinet and insertion frame for equipment. The invention also discloses method for controlling the heat sink in type of conduction through. Features are: reasonable overall arrangement for air channel, and no reversed-flow region.

This invention discloses a temperature-control device, a process device and a system of a cabinet and a method, in which, the temperature-control system includes a radiation wind channel with inlet and outlet and a reflux mixed channel with circulation wind inlet and outlet and a cabinet temperature-control device, the inlet and outlet of the reflux mixed wind channel are connected with the outlet and inlet of the radiation gas channel and circular fans or environmental fans are set in the reflux mixed wind channel, the temperature-control process device is used in controlling the system temperature and the relative humidity in the allowed sphere of ordinary work.

A mobile terminal device comprises a first case including display unit, and a second case arranged so as to slide with respect to the first case and including input unit. The mobile terminal device further comprises a heat radiation member for radiating heat generated in the first case or in the second case. The heat radiation member has a surface area exposed outside which is changed in connection to the slide operation of the first and the second case.

The disclosed thin heat dispersion device comprises: a fan-wheel rotor arranged on base, at least two location elements with magnetic flux effect on base away the axis. This invention can avoid rotor flying out, draws the rotor to stop on optimal active angle and prevents on the active dead point to reduce the power consumption for activation.

The system comprises: a chip of electron device; a micro jet-stream appliance, a liquid reserve tank with a cooling unit, and a micro pump. It features the following: the cooling media uses liquid or gas, and is cycled to form a closed cooling system; on the top of the liquid reserve tank there is a fan and a heat-sink installed; the liquid reserve tank is connected to the micro pump and micro jet-stream appliance; there are multi chambers set in the jet-stream appliance; between the chambers there are separators; the chip of electron device is mounted on the micro jet-stream appliance.

The present invention discloses methods, materials and devices for facilitating electromagnetic / radiofrequency interference (EMI / RFI) shielding and thermal management in packaging circuits. More specifically, a method of packaging integrated circuits with improved thermal and EMI management, a process of treating a compound for use as a thermal interface and / or an EMI shield, and an EMI shielding and thermal management apparatus. More specifically, the present invention divulges methods and apparatuses for adjusting viscosity of a thermally and / or electrically conductive (or thermally conductive and / or electrically insulative), form-in-place, fully cured compound thereby rendering the compound dispensable. Further, a process of treating a compound for use as a thermal interface or / and an EMI shield is disclosed. The compound is an admixture of a particulate filler component and a pre-cured gel component. The process includes applying a shearing force on the compound, thereby rendering the compound dispensable.

The loop heat conducting equipment includes vaporizer and condenser connected to each other through circle pipe so as to constitute circulation loop of liquid working medium. The vaporizer possesses core body of capillary structure (CBCS) inside. Multiple tunnels are formed in CBCS. One end of tunnels is converged to vapor chamber, which is connected to one end of the circle pipe to form the output end of gas state working medium. After through the condenser, the other end of the circle pipe as the input end of formed liquid working medium is connected to the vaporizer. Extending into and contacting with inner CBCS, end of the circle pipe forms compensated chamber of liquid working medium on up portion of CBCS. Using gas and liquid separated circulation loop, the invention reaches optimal efficiency of heat elimination. Features are: simple structure, and easy of measure yield.

In a shelter comprising an enclosure for delimiting an air-conditionable enclosure interior and a container that is externally mounted to the enclosure and has a container space for receiving a cooling installation, a superior protection against detrimental exterior influences shall be provided so that a reliable and energy-efficient cooling of the enclosure interior is ensured.To solve this problem it is suggested that the enclosure comprises at least one passage for heat recirculation from the enclosure interior to the container space.

A heat soaking board and method, which contains 1, providing metal piece upper cover and lower cover, 2, diffuse bonding metal net on inner surface of upper and lower cover to form capillary structure, 3, holding reinforced piece between upper and lower cover, 4, diffuse bonding upper, lower cover and reinforced piece to form a cavity, 5, vacuuming said cavity, 6, filling work fluid in the vacuumed cavity, 7, sealing said cavity. Said invention has low cost and less deformation.

Carrying out heat exchange with heat source, the disclosed liquid cooling type heat sink includes a fan for heat elimination, a pump, a fluid tube, a motor, and a heat elimination block. The motor is in use for driving the fan for heat elimination and the pump. Two ends of fluid tube are connected to the pump to form loop of fluid. The fluid tube is contacted to the heat elimination block, which is setup on the heat source. Being positioned at the path of out air, a curvature of fluid tube is formed on section, where the heat elimination block is left from the fluid tube. The fan for heat elimination cools the said curvature of fluid tube by wind power, increases speed for dropping temperature, and raises efficiency of heat elimination of the fluid tube.

A planar capillary core evaporator with fin for CPL consists of base , top cover being fixed and sealed with base , isolation plate for isolation top cover to be liquid collection cavity and steam collection cavity , liquid collection cavity formed by horizontal and longitudinal grooves cross arranged and opened with liquid return inlet on it , steam collection cavity opened with vapor outlet on it , fin set on outer surface of top cover ,longitudinal steam channel connected to steam cavity on base and capillary core set between liquid collection cavity and steam channel .

The invention discloses an air-cooled heat radiating method of CT device and apparatus, which is characterized by the following: entering cold air into bay from inlet port; heat-exchanging with the heating element in the bay; discharging out of the bay through outlet port; separating the bay as mutual independence first section and second section; placing the heating element in the first section; entering the cold air into the first section from the inlet port; heat-exchanging with the heating element; discharging the hot air to the second section; discharging out of the bay from the outlet port. This invention optimizes cool approach of air-cooled heat radiation effectively.

One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separately from the heat pipe and bonded to the heat pipe via solder. The contact surface portion between the heat pipe and the solder and the contact surface portion between the heat sink and the solder are made of a wettable material having a wettablility such that the contacting angle with respect to the solder is 90 degrees or less.

This invention provides a liquid-cooling system, which includes: an endothermic unit; a cooling unit; the joint pipe which links the stated endothermic unit and passes through the cooling unit; the work liquid which flows in the stated endothermic unit and the joint pipe. The work liquid includes the liquid medium and magnetic powder which disperse in liquid medium. The liquid-cooling system at least includes magnetic field devices to generate the magnetic field, the endothermic unit and the cooling unit are located in this magnetic field. The liquid-cooling system of this invention controls the magnetic powder's flow of work liquid and makes the work liquid on disorderly condition, it increases work liquid's thermal conductivity and improves cooling effect of liquid-cooling system.

A heat dissipater employing inner liquid circulation mainly includes a heat sink, a heat dissipater, cooling liquid, a fan and a liquid driver; and is characterized in that a chamber is arranged in the heat dissipater; the heat sink and the liquid driver are arranged in the chamber; the cooling liquid forms enclosed inner circulation system in the heat dissipater chamber under action of the liquid driver; the heat dissipater is made of highly heat-conductive material; the heat sink and the fan are arranged on four walls or two walls of the heat dissipater, and a plurality of heat dissipating passages are arranged on inner wall of the heat dissipater. The invention has the advantages of adopting enclosed inner circulation cooling system, no requirement for pipeline connection, no leakage, convenient process, good cooling efficiency as well as high reliability.

The invention relates to a heat radiator, which comprises a base and several wings connected to the base, wherein said base has the first chamber; said wings both have one second chamber; the second chambers are through to the first chamber, to make the base and the wings form one hollow sealing chamber filled with working fluid. The invention arranges chambers in the base and wings, with better temperature uniform property, high heat adsorption amount and lower weight, to improve the heat emission efficiency.