Heat radiator

A heat dissipation device and base technology, which is applied in the field of heat conduction, can solve the problems of increasing process complexity, difficulty in adapting to lightweight, and increasing the weight of heat dissipation devices, and achieve the effects of improving heat transfer efficiency, good temperature uniformity, and weight reduction

Inactive Publication Date: 2007-02-07
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the flat heat conduction area at the bottom of this heat pipe is relatively limited, which cannot improve the heat dissipation efficiency of the entire heat sink. Moreover, such a combination not only increases the complexity of the process, but also increases the weight of the heat sink, so it is difficult to adapt to current electronic products (such as notebook computers) ) focus on lightweight requirements

Method used

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  • Heat radiator
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Embodiment Construction

[0022] The technical solution will be described in further detail below in conjunction with the accompanying drawings.

[0023] see figure 1 , is a heat dissipation device 1 provided by an embodiment of the technical solution, which includes: a base 10 and a plurality of fins 20 connected to the base 10 . Wherein the base 10 has a first cavity 12, the plurality of fins 20 has a second cavity 22 respectively, the second cavities 22 of the plurality of fins 20 are respectively connected with the first cavity of the base 10 12 communicate with each other, so that the base 10 and the plurality of fins 20 form a hollow sealed cavity 30 . The hollow sealed cavity 30 is filled with a working fluid 40 .

[0024] The base 10 further includes a housing 11 , an opening 14 defined on the housing 11 opposite to the plurality of fins 20 , and a cover 16 sealingly fitted with the opening 14 . The shell 11 and the cover 16 of the base 10 can be made of different materials according to diff...

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Abstract

The invention relates to a heat radiator, which comprises a base and several wings connected to the base, wherein said base has the first chamber; said wings both have one second chamber; the second chambers are through to the first chamber, to make the base and the wings form one hollow sealing chamber filled with working fluid. The invention arranges chambers in the base and wings, with better temperature uniform property, high heat adsorption amount and lower weight, to improve the heat emission efficiency.

Description

【Technical field】 [0001] The invention relates to the field of heat conduction, in particular to a heat dissipation device. 【Background technique】 [0002] The heat dissipation and cooling of electronic devices usually adopts a heat dissipation device. The traditional heat sink is an extruded aluminum heat sink. The preparation technology of the heat sink is mature, and the aluminum metal itself is relatively soft, easy to process, and low in cost. However, this traditional cooling device only uses metal heat conduction to dissipate heat. With the rapid development of electronic technology, the high frequency and high speed of electronic devices, the density and miniaturization of integrated circuits, the heat generated by electronic devices per unit area has increased sharply, making Traditional heat sinks that rely solely on metal heat conduction are becoming less and less suitable for current heat dissipation needs. [0003] In order to change the pure metal heat dissip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20H01L23/36G12B15/00
Inventor 张俊毅
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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