Heat radiator

A heat dissipation device and base technology, which is applied in the field of heat conduction, can solve the problems of increasing process complexity, difficulty in adapting to lightweight, and increasing the weight of heat dissipation devices, and achieve the effects of improving heat transfer efficiency, good temperature uniformity, and weight reduction
CN1909771AInactive Publication Date: 2007-02-07HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Publication Date
2007-02-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a heat radiator, which comprises a base and several wings connected to the base, wherein said base has the first chamber; said wings both have one second chamber; the second chambers are through to the first chamber, to make the base and the wings form one hollow sealing chamber filled with working fluid. The invention arranges chambers in the base and wings, with better temperature uniform property, high heat adsorption amount and lower weight, to improve the heat emission efficiency.
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Description

【Technical field】

[0001] The invention relates to the field of heat conduction, in particular to a heat dissipation device. 【Background technique】

[0002] The heat dissipation and cooling of electronic devices usually adopts a heat dissipation device. The traditional heat sink is an extruded aluminum heat sink. The preparation technology of the heat sink is mature, and the aluminum metal itself is relatively soft, easy to process, and low in cost. However, this traditional cooling device only uses metal heat conduction to dissipate heat. With the rapid development of electronic technology, the high frequency and high speed of electronic devices, the density and miniaturization of integrated circuits, the heat generated by electronic devices per unit area has increased sharply, making Traditional heat sinks that rely solely on metal heat conduction are becoming less and less suitable for current heat dissipation needs.

[0003] In order to change the pure metal heat dissip...

Claims

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