Micro jet flow cooling system for electronic device

A technology for electronic devices and cooling systems, applied in the cooling of instruments, electrical solid devices, electrical components, etc., can solve the problem that the cooling method of large heat flux cannot reach the ideal, and achieve the effect of high heat transfer coefficient and flexible control
CN101005745AInactive Publication Date: 2007-07-25ๅˆ˜่ƒœ
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
ๅˆ˜่ƒœ
Publication Date
2007-07-25
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The system comprises: a chip of electron device; a micro jet-stream appliance, a liquid reserve tank with a cooling unit, and a micro pump. It features the following: the cooling media uses liquid or gas, and is cycled to form a closed cooling system; on the top of the liquid reserve tank there is a fan and a heat-sink installed; the liquid reserve tank is connected to the micro pump and micro jet-stream appliance; there are multi chambers set in the jet-stream appliance; between the chambers there are separators; the chip of electron device is mounted on the micro jet-stream appliance.
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Description

technical field

[0001] The invention relates to a cooling system for electronic devices, in particular to a micro jet cooling system for electronic devices. technical background

[0002] The essence of the working process of any electronic device is the energy conversion process, which is always accompanied by heat generation. The root cause of heat generation is that any energy conversion process cannot be 100% efficient, and all or most of the energy that is less than 100% becomes heat. Existing electronic devices are developing in the direction of smaller, higher speed, and higher power density, which means greater heat flux density. Supercomputers are mainly composed of high-power density electronic components such as microprocessors and control circuits. The density is very high, on the order of 100W / cm 2 around or higher. Due to volume limitations, high-performance servers and notebooks also have a very high heat flux density. In order to maintain normal work, their...

Claims

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