The present invention provides a two-phase
jet cooling radiator for high-
power density chips, belonging to the technical field of
chip cooling and heat dissipation. The cooling radiator includes a
coolant cavity housing, a jet manifold layer, a
jet flow channel plate, and a
porous medium layer; a liquid distribution cavity is formed in the
coolant cavity housing; a jet cavity is formed in the jet manifold layer, and jet holes are uniformly distributed on the jet cavity; the
jet flow channel plates are all installed in the jet cavity, and their
jet flow channels are all arranged vertically, and one end of each jet flow channel is connected to the corresponding jet hole; the gaps between the jet flow channel plates in the lower space of the jet cavity are filled with the
porous medium layer. The present invention utilizes the influence of the small-aperture
porous medium layer on bubble dynamics, improves the
critical heat flux density in the heat dissipation process, increases the heat dissipation per unit area, prolongs the
working life of the
chip, improves the working stability of the
chip, and plays an important role in ensuring the stable operation of the chip under the working conditions of
high heat flux density and high integration.