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Liquid-cooled radiating system

A heat dissipation system and liquid cooling technology, applied in the field of heat transfer, can solve the problems of reducing heat dissipation efficiency, large thermal resistance, and small thermal conductivity of pure liquid, and achieve the effect of improving heat transfer coefficient, heat dissipation efficiency, and heat transfer

Inactive Publication Date: 2007-03-28
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditional liquid-cooled heat dissipation systems generally use pure liquid as the working fluid, but the thermal conductivity of pure liquid is generally small, and the thermal resistance between it and the heat-absorbing unit, heat dissipation unit, and the pipe wall of the connecting pipe is large, resulting in the working fluid of the liquid-cooled heat dissipation system It cannot quickly absorb heat from the heat-absorbing unit and dissipate heat to the heat-dissipating unit, thereby affecting the heat transfer of the liquid-cooled heat dissipation system and reducing the heat dissipation efficiency

Method used

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  • Liquid-cooled radiating system
  • Liquid-cooled radiating system
  • Liquid-cooled radiating system

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Embodiment Construction

[0012] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0013] Referring to FIG. 1 , the liquid-cooled heat dissipation system 10 provided in the first embodiment of the present invention includes: a heat absorption unit 20 ; a heat dissipation unit 30 ; a connecting conduit connecting the heat absorption unit 20 and the heat dissipation unit 30 40; and the working fluid 50 flowing in the heat absorption unit 20 and the connecting conduit 40, wherein the working fluid 50 includes a liquid medium and magnetic powder dispersed in the liquid medium, and the connecting conduit 40 passes through In the heat dissipation unit 30 .

[0014] The liquid medium in the working fluid 50 includes one or more of water, alcohols and ketones, and the alcohols can be methanol, ethanol, propanol, n-butanol, n-pentanol, n-hexanol, A mixture of one or more of n-heptanol, n-octanol and ethylene glycol, the ketones can be acetone, and ...

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Abstract

This invention provides a liquid-cooling system, which includes: an endothermic unit; a cooling unit; the joint pipe which links the stated endothermic unit and passes through the cooling unit; the work liquid which flows in the stated endothermic unit and the joint pipe. The work liquid includes the liquid medium and magnetic powder which disperse in liquid medium. The liquid-cooling system at least includes magnetic field devices to generate the magnetic field, the endothermic unit and the cooling unit are located in this magnetic field. The liquid-cooling system of this invention controls the magnetic powder's flow of work liquid and makes the work liquid on disorderly condition, it increases work liquid's thermal conductivity and improves cooling effect of liquid-cooling system.

Description

【Technical field】 [0001] The invention relates to the field of heat transfer, in particular to a liquid-cooled heat dissipation system. 【Background technique】 [0002] In recent years, with the rapid development of electronic technology, the operating frequency and speed of electronic components have been continuously improved. However, at the same time, the electronic components generate more and more heat and the temperature is getting higher and higher, which seriously threatens the performance and stability of the electronic components during operation. In order to ensure the normal operation of the electronic components, it is necessary to effectively dissipate heat from the electronic components. At present, the air-cooled heat dissipation system is widely used in the heat dissipation of electronic components. It generally conducts the heat generated by the heating element through the heat dissipation fins, and then uses the fan to force the air convection to take away...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G12B15/00
CPCF25B2321/0021F25B21/00Y02B30/66Y02B30/00
Inventor 李欣和
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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