Winding carved heat equalizing plate with metal net micro structure and its producing method

Abstract

A heat soaking board and method, which contains 1, providing metal piece upper cover and lower cover, 2, diffuse bonding metal net on inner surface of upper and lower cover to form capillary structure, 3, holding reinforced piece between upper and lower cover, 4, diffuse bonding upper, lower cover and reinforced piece to form a cavity, 5, vacuuming said cavity, 6, filling work fluid in the vacuumed cavity, 7, sealing said cavity. Said invention has low cost and less deformation.

Description

【Technical Field】 [0001] The invention relates to a soaking plate and a method for making the same, in particular to a flexible soaking plate with a microstructure of a metal mesh (such as a copper mesh) and a method for making the same. 【Background technique】 [0002] In today's various electronic equipment (such as personal computers, communication equipment, TFT-LCD, etc.), many electronic devices that generate heat during operation are used. Especially when high-speed computing is increasingly required, these electronic devices will inevitably produce More heat than previous devices. Therefore, how to prevent electronic devices from overheating and degrading performance is more important today, and various cooling devices and methods for electronic devices have also been developed accordingly. [0003] For example, the industry has proposed a cooler with a heat pipe attached to a copper sheet. However, because this kind of tubular heat pipe cannot be used alone, another flat-...

AI Technical Summary

Problems solved by technology

However, it is not easy to process capillary-level micro-grooves on copper sheets. Although it is easier to form capillary structures by sintering copper powder, it is difficult to control the final sintering quality in the manufacturing process, so the defective rate of products and manufacturing costs may be higher

In addition, if the vapor chamber shell needs to be bent to conform to the shape of the device to be dissipated, the capillary structure formed by sintering copper powder will be easily damaged due to bending

[0006] In addition, the conventional vapor chamber seals the two halves of the shell into an airtight shell by, for example, welding or welding, so it is easy to cause the shell to be deformed by heat during manufacture; and the known vapor chamber structure, for example, in A supportable plate heat pipe structure disclosed in Taiwan New Patent Announcement No. 577538, which fixes the support body in the housing by welding, but this method can only weld one end of the support body (the other end is in the shell) After the body is formed, it will not be welded), and it also makes the shell easily deformed by heat during processing

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