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Machine case capable of dissipating heat through method of liquid cooling

A liquid cooling, chassis technology, applied in the direction of cooling/ventilation/heating transformation, can solve the problem of low heat dissipation efficiency of chassis equipment, and achieve the effect of solving low heat dissipation efficiency

Inactive Publication Date: 2015-01-21
CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a liquid-cooled heat-dissipating chassis to solve the problem of low heat dissipation efficiency of existing chassis equipment by realizing direct liquid cooling of electrical components in the chassis

Method used

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  • Machine case capable of dissipating heat through method of liquid cooling
  • Machine case capable of dissipating heat through method of liquid cooling
  • Machine case capable of dissipating heat through method of liquid cooling

Examples

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Embodiment Construction

[0018] Examples of liquid cooled thermal enclosures, such as Figure 1-5 As shown, the liquid cooling heat dissipation chassis includes a box body, and electrical components are installed in the box body.

[0019] The box body is a closed box body, which includes a box body frame 11 and a panel assembled on the box body frame, wherein the front panel 12, the rear panel 13 and other panels are split structures, and the two are respectively connected to the box body frame 11. Gasket 14 is arranged to ensure the airtightness of the casing. The upper panel of the box body is provided with a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is provided with an inlet fluid connector 15, and the outlet is provided with an outlet fluid connector 16, and the refrigerant inlet is connected with an atomizing nozzle 17, which is located in the box. In this embodiment, in this embodiment, the atomizing nozzles 17 are divided into two groups, and the two groups of atomizing...

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Abstract

The invention relates to the field of electrical cabinets, in particular to a machine case capable of dissipating heat through a method of liquid cooling. The machine case capable of dissipating heat through the method of liquid cooling comprises a case body, wherein electrical elements are installed inside the case body, the case body is airtight and is provided with a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is connected with atomizers, and the atomizers are located inside the case body. When the machine case capable of dissipating heat through the method of liquid cooling is used, cooling liquid entering the case body from the refrigerant inlet is firstly atomized before arriving at the electrical elements, the atomized liquid is still poured on the heating electrical elements as small liquid drops, when making contact with the heating electrical elements, the small liquid drops are instantaneously gasified, and therefore heat dissipated by the electrical elements is taken away. The machine case capable of dissipating heat through the method of liquid cooling realizes direct liquid cooling of the electrical elements, and solves the problem of low heat dissipation efficiency of high heating flux electronic equipment based on the phase change principle.

Description

technical field [0001] The invention relates to the field of electrical cabinets, in particular to a liquid cooling and heat dissipation cabinet. Background technique [0002] At present, all kinds of electronic and electrical equipment are developing towards high frequency, high power and miniaturization. In the process of development, heat dissipation has always been one of the most critical issues. The heat dissipation performance directly affects the performance of the corresponding electrical equipment. [0003] There are three main ways to cool electronic and electrical devices, namely gas cooling, liquid cooling and heat pipe conduction cooling. Gas cooling includes natural convection cooling and forced exhaust cooling, and the gas cooling device has a simple structure and low cost. However, due to the low cooling heat flux density, it is difficult to obtain a high cooling heat flux density even with helium forced exhaust cooling, and the heat dissipation effect is...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 黄胜利叶亚鹏
Owner CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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