Method for preparing reinforced heat transfer surface of direct liquid cooling chip

An enhanced heat transfer and direct technology, applied in the field of enhanced boiling heat transfer surface preparation, can solve the problems of failing to effectively improve the boiling heat transfer performance in the high heat flux density area, limited heat dissipation capacity, increased noise, etc. The effect of fewer process steps and simple process

Inactive Publication Date: 2010-12-15
INST OF MECHANICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2 noise rise;
[0006] 3 limited cooling capacity
However, none of these microstructures can effectively improve ...

Method used

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  • Method for preparing reinforced heat transfer surface of direct liquid cooling chip
  • Method for preparing reinforced heat transfer surface of direct liquid cooling chip
  • Method for preparing reinforced heat transfer surface of direct liquid cooling chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1 Preparation of Single-Layer Membrane Enhanced Boiling Heat Exchange Surface

[0031] Specific steps are as follows:

[0032] The first is the preparation of single-layer colloidal microspheres: the particle size of the colloidal microspheres used is 90nm-10μm, and the substrate used is a silicon wafer.

[0033] Method 1, spin coating method: the aqueous solution of colloidal microspheres, with a concentration of 0.5%-20% by volume, is prepared with ethanol at an appropriate volume ratio of 1:1-1:20, and then this solution is dropped on the substrate , at an appropriate rotational speed: 100-3000 revolutions per minute, a regularly arranged single-layer film of colloidal microspheres can be produced; or

[0034] Method 2, self-assembly method: prepare the colloidal microsphere aqueous solution with a volume percentage concentration of 0.5%-20%, and ethanol according to an appropriate volume ratio in the range of 1:1-1:20, and then add the solution dropwise In...

Embodiment 2

[0041] Example 2 Preparation of Multilayer Film Enhanced Boiling Heat Exchange Surface

[0042] Specific steps are as follows:

[0043] 1) Preparation of multilayer colloidal microspheres: firstly, the preparation of single-layer colloidal microspheres: the particle size of the colloidal microspheres used is 90 nm-10 μm, and the substrate used is a silicon wafer.

[0044] Method 1, spin coating method: the same as method 1 in Example 1, except that the single-layer preparation method needs to be repeated repeatedly to prepare multilayer colloidal microspheres, and the number of repetitions is proportional to the number of layers; or

[0045] Method 2, self-assembly method: fill a certain volume percentage of colloidal microsphere aqueous solution or ethanol in a certain container; the volume percentage concentration is 0.01%-10%, then place the substrate vertically in the solution, and place the entire container at a constant temperature In a constant humidity environment, th...

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Abstract

The invention discloses a method for preparing a reinforced boiling heat transfer surface of a direct liquid cooling chip, which comprises the following steps of: forming monolayer or multilayer colloid crystal membranes which are arranged regularly with colloid microspheres by an LB membrane method, a self-assembly method or a spin coating method, and taking the membranes as a template; filling the template by utilizing a sol-gel method; and finally removing the template by utilizing a method of calcining or dissolution to prepare the two-dimensional or three-dimensional reinforced boiling heat transfer surface on the surface of the substrate. The reinforced boiling heat transfer surface has the excellent boiling heat transfer performance in a pipeline type natural circulation cooling system, and has the advantages of simple preparation method and low cost.

Description

technical field [0001] The invention relates to the preparation of an enhanced boiling heat transfer surface of a direct liquid cooling chip, in particular to a preparation method and technology of an enhanced boiling heat transfer surface capable of reducing costs. Background technique [0002] With the rapid development of microelectronics technology, the densification of large-scale integrated circuits on chips and the miniaturization of electronic devices have become the mainstream trend in the development of modern electronic equipment. This will directly lead to a rapid increase in the heat dissipation of the chip. If the performance of the chip continues to develop at the current high speed, power consumption and heat dissipation will become the biggest stumbling block on its way forward. Whether these two problems can be solved will become a life-threatening problem for the entire information industry and even the global economy. The research on high-efficiency chi...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L23/373
Inventor 王育人曹鹤
Owner INST OF MECHANICS - CHINESE ACAD OF SCI
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