Submerged jet micro-injection direct liquid cooling heat dissipating device

Abstract

The invention belongs to the field of heat dissipation of electronic devices, and discloses a submerged jet micro-injection direct liquid cooling heat dissipating device, wherein the bottom of the heat dissipating device is provided with a first groove to form a sealed space with the circuit board of an object to be cooled, a second groove is arranged in the first groove for placing the object tobe cooled, the coolant enters from the inlet pipe to the nozzle through the liquid separation cavity, and the coolant sprays from the nozzle on the surface of the object to be cooled; the coolant enters from the liquid pumping hole into the outlet pipe through the collecting cavity, and then flows out from the outlet pipe, thereby realizing the collection of the cooling liquid; a plurality of nozzles and a liquid pumping hole are disposed on each surface of the second groove, the liquid pumping hole is arranged on a center line extension line of the connection of the two nozzles, and the liquid pumping hole is higher than the nozzles to avoid interference on the coolant sprayed from adjacent nozzles. Through the invention, the heat dissipation area of the chip is effectively improved, thetemperature of the chip is lowered, and the uniformity of the temperature of the chip is improved.

Description

technical field [0001] The invention belongs to the field of heat dissipation of electronic devices, and more specifically relates to a submerged jet micro-spray direct liquid cooling heat dissipation device. Background technique [0002] High temperature will cause great harm to the performance and reliability of electronic devices, and the failure rate of electronic devices will increase exponentially with the increase of temperature. A large amount of heat generated by electronic devices must be evacuated in time to ensure that the devices can work normally, efficiently and safely. [0003] With the rapid development of semiconductor technology and electronic technology, the integration level of electronic devices has increased exponentially, followed by increasing heat generation. For example, billions of heat-generating transistors and connecting wires are integrated in a millimeter-sized chip. Since the iterative development of heat dissipation technology is far behi...

AI Technical Summary

Problems solved by technology

On the other hand, the existing cooling methods only cool one heat source surface of electronic components such as chips, and waste the space of other heat source surfaces of electronic components.

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