A multifunctional electronic chip cooling and boiling enhanced heat transfer experimental device

Abstract

A multifunctional electronic chip cooling and boiling enhanced heat exchange experimental device, comprising a vortex pump, the outlet of the vortex pump is connected to the inlet of a heater, the outlet of the heater is connected to the inlet of a total flowmeter, and the outlet of the total flowmeter is divided into two paths, one of which passes through a cross-flow branch. The back of the road enters the pure flow section, and the other road enters the pure flow section after passing through the injection branch. The outlet of the pure flow section is connected to the inlet of the boiling section of the pool. The outlet of the boiling section of the pool is divided into two paths. The inlet of the condenser is connected to the inlet of the vortex pump, and the outlet of the condenser is connected to the inlet of the vortex pump to complete a cycle, which combines the advantages of pool boiling, pure flow boiling and jet impingement boiling heat transfer, and removes some repetitive equipment and operation processes. Advantages of small land area.

Description

technical field [0001] The invention relates to the technical field of electronic chip cooling and boiling enhanced heat transfer, in particular to a multifunctional electronic chip cooling and boiling enhanced heat transfer experimental device. Background technique [0002] With the high integration and high frequency of electronic components, traditional air cooling and other cooling technologies can no longer meet the requirements of high heat dissipation rate of chips. Direct liquid cooling of chips by using boiling phase transfer heat is an effective cooling method , the usual practice is to directly immerse the chip in a non-conductive liquid for boiling heat exchange, but there are problems such as high boiling initial temperature, which is not conducive to the start-up of electronic devices, so it is necessary to adopt strengthening measures to effectively reduce the boiling initial wall overheating. Heat, increase the critical heat flux, ensure that the critical wal...

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Problems solved by technology

Placing the chip in the flow channel, relying on the scouring effect of the fluid on the surface of the chip can achieve the purpose of enhancing heat transfer, but it is necessary to provide an additional power system and control system. In addition, it is found through the photos taken by high-speed cameras that, in the critical state, the fluid The damage to the steam film along the flow direction is small, and the surface of the chip is covered by a layer of steam film, which hinders the replenishment of cold fluid, while jet impingement cooling has a high impact force, and it is expected to impact the heat exchange surface, crush or Destroy the steam film, quickly take away the heat on the heat exchange surface, thereby ensuring the supplement of cold fluid, maintaining the normal heat exchange of the chip under high heat flux, and further increasing the critical heat flux value, but the jet impingement cooling range is small, which is more suitable for Localized cooling, and cooling of individual chips is currently not possible

In most of the literature, the experimental research is conducted on one of pool boiling, flow boiling, and jet impingement boiling. The experimental system is large in size, part of the power supply and control operation equipment and the operation process are repeated, and the experimental period is long, which makes it strengthen heat transfer. advantage is limited

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