The invention discloses a preparation method and application of a
plasma etching resistant
coating, and relates to the technical field of coatings. Comprising the steps that a
yttrium oxide layer is prepared through a low-pressure
plasma spraying method, the
yttrium oxide layer comprises a relative
porous layer (the
porosity is 1%-3%) and a compact layer (the
porosity is smaller than 1%) which are sequentially stacked, and the relative
porous layer is used for making contact with a base body. By adopting low-pressure
plasma spraying, the
yttrium oxide layer with controllable
coating morphology and thickness can be obtained, and the
thermal expansion coefficient mismatch between the substrate and the compact layer can be effectively relieved through the relative
porous layer close to the substrate; the compact layer on the surface is uniform in structure, low in
porosity, excellent in cohesion strength and excellent in
plasma etching resistance, plasma and a matrix can be isolated, and generation of particles in the
etching process is avoided. The compact layer and the relatively
porous coating are both prepared on the basis of the same
powder material and by adopting the same
coating deposition equipment, so that the production efficiency can be improved, and the production cost and the
pollution risk caused by transfer between production steps can be reduced.