Evaporator for cooling chip and manufacture method thereof

Abstract

The invention relates to an evaporator for cooling a chip and a manufacture method thereof. The evaporator combines a micro-porous surface coat with a plurality of small-scale passageways. An evaporator main body consists of an upper cover plate and a lower base plate. The two ends of the upper cover plate of the evaporator are provided with a cooling liquid inlet and a cooling liquid outlet. The two ends of the lower base plate of the evaporator are respectively provided with an empty cavity; and the lower base plate is machined with a plurality of parallel ribs to form into the plurality of parallel small-scale passageways for flowing cooling liquid. The bottom surface of each small-scale passageway is coated with a layer of micro-porous surface coat for greatly intensifying the boiling phase-change heat transmission of the cooling liquid. The evaporator is glued with a heating electronic chip through a layer of heat-conductive silicone grease, heats up the cooling liquid which flows the passageways therein, absorbs the dissipated power of the electronic chip in the form of flowing boiling heat transmission, has the characteristics of small flow resistance, compact structure and low cost, has strong cooling performance, and is applied to cooling the electronic chip with high dissipated power.

Description

technical field [0001] The invention relates to an evaporator for chip cooling, in particular to an evaporator combining a microporous surface coating with a small-scale channel, which is used as the core component of an electronic chip cooling loop device to cool the central Electronic chips such as processors. Background technique [0002] The application of electronic chips pervades all aspects of daily life, production and even national security, and plays an extremely important role in modern civilization. The trend of chip development is to further increase integration, reduce chip size and increase clock frequency. In 2010, the number of transistors on a chip exceeded 2 billion. Accompanied by the rapid increase in the integration level of transistors, the power dissipation and heat flux density of chips have also increased sharply. The resulting excessive temperature will reduce the working stability and reliability of the chip, increase the error rate, and affect...

AI Technical Summary

Problems solved by technology

However, this strengthening effect is limited to the condition of low heat flux, and the strengthening effect is not obvious or even deteriorates at high heat flux

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