The invention discloses a
wafer clamping and rotating device. The
wafer clamping and rotating device comprises a clamping mechanism and a driving mechanism, the clamping mechanism comprises a
side arm and a clamping jaw; the clamping jaw is installed on the
side arm through a crumple structure, the crumple structure comprises an installation groove formed in the inner side face of the
side arm, a connecting block connected with the clamping jaw is arranged in the installation groove, a gap is formed between the connecting block and the installation groove to form a buffer area, a supporting shaft is connected in the clamping jaw, and a first penetrating hole and a second penetrating hole which are communicated are formed in the connecting block and the side arm. The second penetrating hole is divided into a
thick section part and a
thin section part, a pressure spring arranged on the supporting shaft in a sleeving mode is arranged in the
thick section part, a guide shaft is connected into the connecting block, a through hole is formed in the side arm, the free end of the guide shaft penetrates through the through hole, and a
contact sensor is arranged on the outer side face of the side arm. Thus, through the pressure spring and the buffer area, part of clamping
impact force transmitted by the clamping jaw can be effectively counteracted, rigid
contact force between the clamping jaw and the
wafer is converted into flexible buffer force, and breakage caused by direct
extrusion of the wafer due to too large clamping force is avoided.