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213 results about "Micro-loop heat pipe" patented technology

A micro-loop heat pipe or MLHP is a miniature loop heat pipe in which the radius of curvature of the liquid meniscus in the evaporator is in the same order of magnitude of the micro grooves' dimensions; or a miniature loop heat pipe which has been fabricated using microfabrication techniques.

Solar medium-high-temperature loop heat pipe steam generator

The invention relates to a solar medium-high-temperature loop heat pipe steam generator which is composed of a loop heat pipe (1), a straight-through all-glass vacuum pipe (2), a steam pocket (3) and a sealing ring (4). The loop heat pipe (1) is a closed loop formed by an evaporation section (5), a condensation section (6), a first heat insulation section (7(A)) and a second heat insulation section (7(B)), the first heat insulation section (7(A)) is a steam ascending pipe, the second heat insulation section (7(B)) is formed by a condensing liquid descending pipe (12) and a U-shaped liquid storage pipe (13), the straight-through all-glass vacuum pipe (2) and the evaporation section (5) are placed coaxially to form an annular non-vacuum space (20), two ends of the annular non-vacuum space (20) are sealed by adopting sealing rings (4), and the steam pocket (3) is in sealed connection with the condensation section (6) of the loop heat pipe (1). The solar medium-high-temperature loop heat pipe steam generator is suitable for groove-type solar DSG technology, high-efficiency phase change of the heat pipe is utilized for heat transfer to heat water in the steam generator so as to directly generate high-temperature steam, system cost is lowered, and system running reliability is improved.
Owner:NANJING UNIV OF TECH

Evaporation chamber for a loop heat pipe

The invention relates to heat engineering, in particular to heat pipes, and may be used for heat removal from miniature heat-tensioned objects, in particular elements of radioelectronic devices and computers requiring effective heat removal within minimum dimensions of a cooling system. The invention is aimed at increasing a heat load of the evaporating chamber at a given operating temperature and reducing its dimensions. For this purpose, in the evaporating chamber of a loop heat pipe comprising a body that includes side and end-face walls and a capillary porous packing accommodated in said body and having vapor-removal channels tied together by a vapor collector, and disposed on a portion of the packing perimeter at the heat-supply side, and having an asymmetrical longitudinal opening shifted in the direction opposite to the heat supply, the end-faces of the vapor-removal channels being blind at one side, the asymmetrical longitudinal opening is also being blind at the side opposite to the blind end-faces of the vapor-removal channels, and the vapor collector is formed by one of the end-face walls of the body and the packing end-face. Besides, on the inner side surface of the body, additional vapor-removal grooves are provided. Cross-section of the asymmetrical longitudinal opening may have the form of a rectangle elongated in the direction of the heat supply and limited at the opposite side by a body wall, or the form of a wedge, whose apex faces the heat supply and whose base is a body wall, or the form of a segment, whose chord is directed towards the heat supply and the arc is a body wall, or the form of a circle limited by a capillary porous packing and whose center is shifted in the direction opposite to the heat supply. Cross-section of the evaporating chamber may be made rectangular, the asymmetrical longitudinal opening, which has the form of a slot gap being shifted in the direction opposite to the heat supply. The capillary porous packing may consist of two interconnected parts. The outlet of the condensate line is positioned in the asymmetrical longitudinal opening of the capillary porous packing.
Owner:MICROWAY

Loop heat pipe

The invention provides a loop heat pipe which comprises an evaporation collecting pipe body, a condensation collecting pipe body, ascension pipe bodies and returning pipe bodies. The ascension pipe bodies communicate with the evaporation collecting pipe body and the condensation collecting pipe body; the evaporation collecting pipe body is located on the lower portion, and the condensation collecting pipe body is located on the upper portion; a fluid absorbs heat and is evaporated in the evaporation collecting pipe body, enters the condensation collecting pipe body through the ascension pipe bodies and is condensed after being subjected to heat exchange in the condensation collecting pipe body, and the condensed fluid is returned to the evaporation collecting pipe body through the returning pipe bodies; dividing devices are arranged in the ascension pipe bodies; the dividing devices comprises core bodies and shells; the core bodies are arranged in the shells; the shells are fixedly connected with the inner walls of the ascension pipe bodies; the core bodies comprises a plurality of concentric pipes and rib pieces; and the rib pieces are connected with the adjacent concentric pipes. The loop heat pipe is of a novel structure, when vapor-liquid two-phase flow occurs in the ascension pipe bodies, heat transfer is strengthened, meanwhile, vibration of the ascension pipe bodies is weakened, and the noise level is reduced.
Owner:SHANDONG UNIV

Heat radiation device for loop heat pipe with enhanced evaporation section used in LED lamp

The invention discloses a heat radiation device for a loop heat pipe with an enhanced evaporation section used in an LED lamp. The heat radiation device comprises: a heat pipe, a radiating fin and a working liquid. The heat pipe is a loop pipe with a sealed cavity, comprising: an enhanced evaporation section, a reflux section, a steam section, a compensation chamber and a condensing section; the enhanced evaporation section is arranged at the back of a heat source of the LED lamp; the loop pipe is vacuumed properly, internally provided with a wick structure and filled with a proper amount of working liquid; and the radiating fin is arranged on the condensing section. The heat radiation device has the advantages of reasonable and compact structure, easy production, high heat conduction efficiency and high heat radiation speed. The enhanced evaporation section is contacted with the heat source surface directly and sufficiently, therefore, the heat radiation device can effectively reduce the temperature of the LED modules, solve the heat radiation problem of large-power LEDs, improve the light emitting efficiency of LEDs, reduce the light degradation speed of LEDs and prolong the service life of LEDs. Simultaneously, the heat radiation device can reduce the volume and the weight of LED lamps and improve the adaptability and the use range of the LED lamps.
Owner:史杰

Cylindrical capillary pump assembly of loop heat pipe

A cylindrical capillary pump assembly of a loop heat pipe comprises an evaporator shell (3), a liquid accumulator shell (4) and a capillary core (2). The liquid accumulator shell (3) is connected with the evaporator shell (4). One section of the capillary core (2) is located inside the evaporator shell (3). The other section of the capillary core (2) stretches into the liquid accumulator shell (4). The capillary core (2) is formed by sintering porous silicon nitride, and good porosity, good chemical stability, a low heat conductivity coefficient and a good machining property are achieved. A local part of the junction of the liquid accumulator shell (3) and the evaporator shell (4) is designed to be of an S-shaped structure; and the heat conduction path is long, the heat conductivity coefficient is relatively low, and the probability of leakage of heat from an evaporator to a liquid accumulator can be lowered. According to the cylindrical capillary pump assembly of the loop heat pipe, it can be guaranteed that the loop heat pipe has good starting performance, a good heat transfer property and a long service life, and can well adapt to a spatial microgravity environment and a mechanical environment on a spacecraft launching section at the same time.
Owner:BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH

Flat type loop heat pipe

The invention discloses a flat type loop heat pipe, relates to the radiation of components and is used for solving the problem of dead start resulted from liquid working medium phase change in a liquid compensation cavity of an evaporimeter of the existing loop heat pipe. The flat type loop heat pipe comprises the evaporimeter and a condenser, the working medium outlet of the evaporimeter is communicated with the working medium inlet of the condenser through a steam line, and the working medium outlet of the condenser is communicated with the working medium inlet of the evaporimeter. The evaporimeter comprises a flat type heated wall surface and a shell, wherein the heated wall surface is provided with porous wicks; the shell covers the porous wicks and is provided with the liquid compensation cavity above the porous wicks; the liquid compensation cavity is used for containing working medium and is connected with the liquid line through the working medium inlet; and the wall of the shell is internally provided with a phase-change material layer. Through the phase-change material layer arranged inside the wall of the shell, the invention absorbs back leakage heat and heat conducted by a lateral wall of the evaporimeter through the phase-change heat absorption of the phase change material, thereby effectively inhibiting the generation of bubbles in the liquid compensation cavity and ensuring the smoothly starting of the loop heat pipe.
Owner:WISDRI ENG & RES INC LTD

Evaporator and liquid reservoir used for loop heat pipe and application thereof

The invention discloses an evaporator and a liquid reservoir used for a loop heat pipe and belongs to the technical field of evaporators. A capillary core structure is adopted for spacing inner spaces of the evaporator and the liquid reservoir, liquid in the liquid reservoir can enter the evaporator through the capillary core, meanwhile the liquid is heated and evaporated to generate steam in the evaporator, and the steam flows out of a steam outlet in an end cover of the evaporator. Due to the fact that the capillary core can generate capillary pressure, the steam in the center of the evaporator can be effectively prevented from entering the liquid reservoir, distribution and flowing of the gas liquid are controlled, and then heat leakage from the evaporator to the liquid reservoir is effectively reduced. The distribution and a flowing route of the gas liquid in the evaporator are adjusted initiatively, therefore the radial heat leakage from the evaporator to the liquid reservoir can be completely eliminated, and the purpose that the heat leakage from the evaporator to the liquid reservoir is effectively reduced is achieved so that starting performance and running stability and reliability of the loop heat pipe can be improved.
Owner:BEIHANG UNIV

Temperature control gas phase working medium perfusion method for micron heat pipe

The invention discloses a temperature control gas phase working medium perfusion method for a micron heat pipe, which is applied to heat dissipation of high heating flux devices. The method is characterized in that the temperature of the micron heat pipe and the temperature of a working medium container are respectively controlled; the micron heat pipe and the working medium container are respectively vacuumized; then the working medium container is connected with a working medium source, so that working medium steam can get into the working medium container; the micron heat pipe and the working medium container are communicated, so that perfusion of the gas phase working medium can be realized by utilizing the temperature difference between the micron heat pipe and the working medium container; the perfusion amount of the working medium can be controlled as per time, and after a perfusion port of the micron heat pipe is sealed, working medium perfusion for the micron heat pipe is accomplished. The working medium exists in a perfusion system in gas phase, so the perfusion rate, the repeatability and the controllability are good; the temperature of the micron heat pipe and the temperature of the working medium are respectively controlled, so that the perfusion efficiency of the working medium is improved; the method can improve the performance of the micron heat pipe.
Owner:DALIAN UNIV OF TECH

Loop heat pipe-type cylindrical solar seawater desalination device

The invention discloses a loop heat pipe-type cylindrical solar seawater desalination device. The device comprises a cylindrical multiple-effect distiller, a light collection groove and a loop heat pipe. An evaporating pipe of the loop heat pipe is used as a solar heat collecting pipe and a condenser pipe of the loop heat pipe is used as a distiller heating pipe so that characteristics of good heat transfer performance and high integral efficiency are obtained. A heating pipe, a heat-transfer pipe, a semi-circular groove and a nozzle unit are tightly arranged in a heat-insulation cylinder inner-cavity so that a pre-heating chamber, a distillation chamber, a seawater tank and a fresh water tank are formed and thus the distiller structure is very compact, can be processed easily and is suitable for standard production. The distiller has the characteristics of repeated use of vaporization latent heat, reinforcement of inner heat and mass transfer processes and improvement of an operation temperature. The heat transfer areas of the distillation chamber are increased from inside to outside so that a small heat transfer temperature difference is kept, the whole distiller effective number is improved and a concentration ratio and a water yield are further improved. The loop heat pipe-type cylindrical solar seawater desalination device is suitable for low-cost modularization production and can be widely used in the field of solar energy seawater desalination.
Owner:JIMEI UNIV

System and method of a heat transfer system and a condensor

The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic / anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (μLHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w / cm2). The operation is dependent upon a unique micropatterened CPS wick which contains up to millions per square centimeter of stacked uniform micro-through-capillaries in semiconductor-grade silicon, which serve as the capillary “engine,” as opposed to the stochastic distribution of pores in the typical heat pipe wick. As with all heat pipes, cooling occurs by virtue of the extraction of heat by the latent heat of phase change of the operating fluid into vapor.In the cooling of a laptop computer processor the device could be attached to the processor during laptop assembly. Consistent with efforts to miniaturize electronics components, the current invention can be directly integrated with a unpackaged chip. For applications requiring larger cooling surface areas, the planar evaporators can be spread out in a matrix and integrally connected through properly sized manifold systems.
Owner:UNIVERSITY OF CINCINNATI

Composite capillary core with differential thermal coefficients for loop heat pipe and preparation method of composite capillary core

The invention relates to a composite capillary core with differential thermal coefficients for a loop heat pipe and a preparation method of the composite capillary core. A thermal coefficient of the composite capillary core close to an evaporator side of the loop heat pipe is higher than that of the composite capillary core close to a compensator liquid side of the loop heat pipe. The preparation method of the composite capillary core with differential thermal coefficients comprises the following steps of: selecting sintering material matrix metal powders with an infinite mutual solubility and preparing a powder mixture with different mass proportions; filling the mixed powder mixture with different mass proportions in a mould layer by layer; carrying out cold press moulding on the powder mixture after the powder mixture is filled in the mould to form the shape and size required by a capillary core; and at last, sintering the powder mixture to prepare the composite capillary core with differential thermal coefficients. Since the composite capillary core has differential thermal coefficients, the heat transfer performance of the loop heat pipe can be favorably improved and heat control requirements of the loop heat pipe with performances of large heat transfer power and long-distance transmission can be met; and the composite capillary core with differential thermal coefficients can be used for developing efficient loop heat pipes and can be applied to the fields such as aviation heat control and ground electronic equipment cooling and the like.
Owner:SHANDONG UNIV

Miniaturized loop heat pipe

The invention discloses a miniaturized loop heat pipe which comprises an evaporator, a liquid pool and a condenser, wherein the liquid pool and the condenser are connected with the evaporator into anintegral, and the evaporator, the liquid pool and the condenser are connected together through a fine thin wall pipe made of stainless steel to form a loop. When the miniaturized loop heat pipe is applied to the environment lower than 200K, an air reservoir which is connected to a steam pipeline is used for reducing the storage pressure of the miniaturized loop heat pipe in the normal temperatureenvironment. The invention is mainly characterized in that a liquid absorbing core in the evaporator is redesigned; a metal mesh is used as a secondary liquid absorbing core; and a circumferential thread channel is carved on the surface of the main liquid absorbing core to enable the liquid to be distributed uniformly, and an axial rectangular channel is carved to be used as a flow passage of steam. A new condenser is designed, and thread fins, rectangular fins or saw teeth are additionally arranged on the flow passage of working substances to be used as a condensation strengthening measure, thereby improving the condensation efficiency and reducing the size and the weight of the condenser.
Owner:SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI

Gravity-assisted loop heat pipe with ultrasonic vibration atomizing device

The invention discloses a gravity-assisted loop heat pipe with an ultrasonic vibration atomizing device, which comprises an evaporating cavity, a condensing section, a gas-phase pipe and a liquid-phase pipe. The evaporating cavity and the condensing section are communicated closely to form a circulating loop by the gas-phase pipe and the liquid-phase pipe, the condensing section is arranged above the evaporating cavity, the ultrasonic vibration atomizing device is arranged at the bottom of an inner cavity of the evaporating cavity, and a plurality of slots communicated with the outside are arranged on the top surface of the evaporating cavity. A substrate is arranged above the evaporating cavity, a plurality of cooled chips are fixed on the bottom surface of the substrate, bottom surfaces of the cooled chips penetrate through the corresponding slots on the evaporating cavity, and four sides of each of the cooled chips are respectively connected with each of the slots hermetically. The gravity-assisted loop heat pipe with the ultrasonic vibration atomizing device adopts the mature technology, and the structure of the evaporating cavity can be changed flexibly according to the shapes of the cooled chips and the arrangement position of the substrate, so that the gravity-assisted loop heat pipe can be adaptable to cooling of chip arrays better, particularly has wider application prospect to cooling and heat control of ground high-heat-flux power-consumption electronic chip arrays, such as high-end CPUs (central processing units), high-power LED lamps, communication equipment and the like, and is high in practicability.
Owner:ZHEJIANG COLLEGE OF CONSTR
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