Gravity-assisted loop heat pipe with ultrasonic vibration atomizing device

Abstract

The invention discloses a gravity-assisted loop heat pipe with an ultrasonic vibration atomizing device, which comprises an evaporating cavity, a condensing section, a gas-phase pipe and a liquid-phase pipe. The evaporating cavity and the condensing section are communicated closely to form a circulating loop by the gas-phase pipe and the liquid-phase pipe, the condensing section is arranged above the evaporating cavity, the ultrasonic vibration atomizing device is arranged at the bottom of an inner cavity of the evaporating cavity, and a plurality of slots communicated with the outside are arranged on the top surface of the evaporating cavity. A substrate is arranged above the evaporating cavity, a plurality of cooled chips are fixed on the bottom surface of the substrate, bottom surfaces of the cooled chips penetrate through the corresponding slots on the evaporating cavity, and four sides of each of the cooled chips are respectively connected with each of the slots hermetically. The gravity-assisted loop heat pipe with the ultrasonic vibration atomizing device adopts the mature technology, and the structure of the evaporating cavity can be changed flexibly according to the shapes of the cooled chips and the arrangement position of the substrate, so that the gravity-assisted loop heat pipe can be adaptable to cooling of chip arrays better, particularly has wider application prospect to cooling and heat control of ground high-heat-flux power-consumption electronic chip arrays, such as high-end CPUs (central processing units), high-power LED lamps, communication equipment and the like, and is high in practicability.

Description

technical field [0001] The invention belongs to the field of heat transfer element preparation, in particular to a gravity-assisted loop heat pipe with an ultrasonic vibration atomization device. Background technique [0002] On the one hand, for forty years, people have continuously improved the performance of electronic devices and reduced the cost of electronic devices by scaling down the size of MOSFETs (metal-oxide-semiconductor-field-effect transistors). At present, silicon integrated circuit technology driven by the proportional reduction of CMOS devices has entered the nanometer scale, and will continue to pursue the pursuit of Moore's Law, and further reduce the size of devices to meet the needs of chip miniaturization, high density, high speed and system Integration requirements. For example, Intel basically changes its process every two years and launched its first 45nm Penryn processor in 2007. The Penryn dual-core version has 410 million transistors built-in, ...

AI Technical Summary

Problems solved by technology

[0005] (1) The traditional gravity-assisted circuit heat pipe directly sticks the chip on the outer surface of the evaporation chamber, so there is inevitably a contact thermal resistance between the tube wall of the evaporation section and the chip, and the diffusion heat of the heat from the contact part to the entire evaporation chamber resistance;

[0006] (2) The evaporation cavity of the traditional gravity-assisted circuit heat pipe is similar to the state of pool boiling. The chip heat is transferred to the liquid working medium in the evaporation cavity through the evaporation cavity wall. The degree of superheat required for heat transfer increases with the increase of heat flux, and the critical heat flux is relatively low

Its main disadvantage is that the superheated gas will gather at the top of the cavity due to the buoyancy, and wrap the heat source on the back of the

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