Loop heat pipe

Abstract

The invention discloses a loop heat pipe. The loop heat pipe comprises an evaporation part, a condensation part, a vapor pipeline and a liquid pipeline, wherein the vapor pipeline and the liquid pipeline are arranged between the evaporation part and the condensation part and connect the evaporation part and the condensation part into a loop; a working medium is filled in the loop; a capillary structure is arranged in the evaporation part, and comprises a flat plate part pasted on the bottom surface of the evaporation part, a supporting wall extending from the flat plate part to the top surface of the evaporation part, and a plurality of bar-shaped parts extending from the side surface of the supporting wall to one side of the vapor pipeline; the supporting wall and the bar-shaped parts separate the space in the evaporation part into a liquid storage chamber communicated with the liquid pipeline, and a vapor chamber communicated with the vapor pipeline; and a vapor groove communicated with the vapor chamber is formed between two adjacent bar-shaped parts.

Description

technical field [0001] The invention relates to a heat transfer element, in particular to a loop heat pipe. Background technique [0002] With the continuous improvement of the power of electronic components such as central processing units, the problem of heat dissipation has been paid more and more attention by people. A loop heat pipe (LHP) is used as an effective heat transfer element in the field of heat dissipation due to its efficient heat conduction performance. [0003] Generally, the loop heat pipe includes an evaporator, a condenser, and a vapor line and a liquid line disposed between the evaporator and the condenser. The vapor pipeline and the liquid pipeline connect the evaporating part and the condensing part to form a circuit, and the circuit is filled with working medium. The inner surface of the evaporating part is pasted with a capillary structure, and a cavity capable of storing working medium is arranged inside. When the evaporation part of the loop he...

AI Technical Summary

Problems solved by technology

If the capillary structure is too thin, the liquid working medium that the capillary structure can absorb is less, so it is easy to dry up or even burn out, which will affect the working performance of the heat pipe; if the capillary structure is too thick, the reaction time for the working medium in it to evaporate will be long, which will affect the heat transfer. Thermal efficiency

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