Method for cleaning a pipeline of a single-
wafer processing wafer cleaning device (100), wherein the device comprises: a rotatable platform (11) on which a
wafer is arranged, Feed nozzles (12, 12a, 12b) for chemical solutions, through which a
chemical solution is fed to the wafer (W) arranged on the platform (11) from one or both of the wafer front and wafer back, Pure
water supply nozzles (13, 13a, 13b) through which pure water is supplied to the wafer (W) arranged on the platform (11) from one or both of the wafer front and wafer back, a supply line (14) for chemical solutions, through which the
chemical solution is supplied to the supply nozzles (12, 12a, 12b) for chemical solutions, a
clean water supply line (15) through which the
clean water is supplied to the
clean water supply nozzles (13, 13a, 13b), and a waste
liquid line (17) through which the supplied
chemical solution and the supplied
purified water are collected and discharged, the method comprising: a pipeline cleaning step of introducing
purified water containing micro-nano bubbles into the
purified water supply line (15) to clean a pipeline of the purified
water supply line (15), wherein in the pipeline cleaning step the purified water containing micro-nano bubbles is delivered elsewhere than to the wafer (W) to prevent the purified water containing micro-nano bubbles from contacting the surfaces of the wafer (W).