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609results about How to "Maintain reliability" patented technology

Smart video monitoring system based on cloud platform

The invention relates to a smart video monitoring system based on a cloud platform, and belongs to the technical field of remote smart monitoring. The system is characterized in that a video monitoring cloud platform is developed on a server cluster established on the basis of a Hadoop cloud computing platform, and video data acquired by front-end equipment are transmitted to a server in a stream way; through adoption of a massive distributed cloud computing technology, real-time tracking, processing, analysis and outputting of video streams are realized; and a service is provided externally, so that a terminal user can perform checking and calling conveniently. In the system, the characteristics of distributed high-concurrence access storage, high availability, rapid response, easiness in management and maintenance and the like are integrated. Video acquisition, video encoding and transcoding, video data storage, a streaming media distributed server and a client are all distributed on a physical host node in an access network. Compared with a conventional video monitoring system, the smart video monitoring system has the advantages that video real-time processing and transcoding efficiency and video data storage capacity are increased greatly; the requirement of people on the video monitoring system in a big data era is met; and a relatively large commercial value is achieved.
Owner:CHONGQING UNIV OF POSTS & TELECOMM

Communication apparatus, relay apparatus, communication system, communication method, and communication program

A communication apparatus has a plurality of interfaces serving a plurality of networks. The communication apparatus selects an interface according to electric wave reception intensity to reduce power consumption and contribute to the maintenance of reliability in communication. The communication apparatus (communication terminal apparatus, the other party's communication terminal apparatus) is used for communication in such a way that the communication apparatuses are connected to the plurality of networks wirelessly to carry out communication through each network. The communication apparatus has the plurality of interfaces (cellular interface CI, WLAN interface WI) responding to the networks. The communication apparatus also has controlling unit (power supply controlling unit) that connects any one of the interfaces to the power supply to actuate the connected interface, and that connects an interface on rest to the power supply in response to a communication state of an interface on communication to change communication connection from the interface on communication to the other interface on rest. The communication apparatus changes the interfaces while maintaining communication with the other party's communication apparatus.
Owner:FUJITSU LTD

Conductive Material For Connecting Part And Method For Manufacturing The Conductive Material

There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 μm, and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%. The surface of the conductive material is subjected to a reflow process and preferably, an arithmetic mean roughness Ra of the surface of the material in at least one direction, is not less than 0.15 μm while the arithmetic mean roughness Ra thereof, in all directions, is not more than 3.0 μm and the average thickness of the Cu—Sn alloy covering layer is preferably not less than 0.2 μm. The conductive material is fabricated by a method whereby the surface of the base material is subjected to roughening treatment, an Ni plating layer, a Cu plating layer and an Sn plating layer are formed, as necessary, over the surface of the base material, and subsequently, a reflow process is applied.
Owner:KOBE STEEL LTD
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