Thermal management system using micro heat pipe for thermal management of electronic components

Abstract

A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]Benefit is claimed under 35 U.S.C. §119(e) of U.S. Provisional Application No. 61 / 109,004, filed Oct. 28, 2008, the disclosure of which is incorporated by reference herein.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT[0002]This invention was made under Air Force Contract FA8650-09-M-5013. The Government may have certain rights to this invention.BACKGROUND OF THE INVENTION[0003]As electronic components become more miniaturized and the number of interconnects per chip increases, heat removal becomes a limiting barrier to enhanced performance. A principal pathway for heat removal is via conductance from the chip base to a heat spreader and from the heat spreader to the printed wire board or possibly to a heat sink device. Adherent substances, commonly epoxy resins, filled with thermally conductive particulates such as carbon or aluminum are used as an attachment layer between the electronic components.[0004]An evaporative c...

AI Technical Summary

Benefits of technology

The present invention provides a thermal management system that separates physical bonding and compliancy issues from efficient thermal conductivity. The system includes a heat transfer zone and an adherent zone. The heat transfer zone is formed of a heat pipe with a circulatory flow path and a working fluid, while the adherent zone is formed of an annular seal element surrounding the heat pipe. The method for manufacturing the system involves forming a well in the base element, placing an adherent element around the well, and assembling the heat producing element and the base element with the adherent element between their surfaces to form an assembly with the working fluid disposed in the well. The system has improved thermal conductivity and can efficiently manage heat transfer.

Problems solved by technology

As electronic components become more miniaturized and the number of interconnects per chip increases, heat removal becomes a limiting barrier to enhanced performance.

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