Heat radiation device for loop heat pipe with enhanced evaporation section used in LED lamp

A technology of LED lamps and cooling devices, which is applied in cooling/heating devices of lighting devices, lighting devices, semiconductor devices of light-emitting elements, etc., to achieve the effects of improving adaptability and application range, easy manufacturing, and reducing thermal resistance

Inactive Publication Date: 2009-12-23
史杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the existing heat pipe cooling methods, and provide a loop heat pipe cooling device with an enhanced evaporation section for LED lamps

Method used

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  • Heat radiation device for loop heat pipe with enhanced evaporation section used in LED lamp
  • Heat radiation device for loop heat pipe with enhanced evaporation section used in LED lamp

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Embodiment Construction

[0016] Such as figure 1 , figure 2 As shown, the LED lamp adopts the loop heat pipe cooling device of the enhanced evaporating section, which is composed of a heat pipe, a heat sink 5, a working liquid 6, and the like. The heat pipe is a circuit pipe with a sealed cavity, which has an enhanced evaporation section 2, a return section 3a, a steam section 3b, a compensation chamber 3c, and a condensation section 1. The enhanced evaporating section 2 is arranged on the back of the heat source of the LED lamp composed of the LED circuit substrate 7 and the LED light source 8. The cross-sectional shape of the enhanced evaporating section 2 is square or rectangular, and the material is a metal material with high thermal conductivity. The enhanced evaporating section 2 are respectively welded with the compensation chamber 3c and the steam section 3b. The inside of the loop tube is evacuated to a proper vacuum, the capillary structure 4 is set, and an appropriate amount of working l...

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Abstract

The invention discloses a heat radiation device for a loop heat pipe with an enhanced evaporation section used in an LED lamp. The heat radiation device comprises: a heat pipe, a radiating fin and a working liquid. The heat pipe is a loop pipe with a sealed cavity, comprising: an enhanced evaporation section, a reflux section, a steam section, a compensation chamber and a condensing section; the enhanced evaporation section is arranged at the back of a heat source of the LED lamp; the loop pipe is vacuumed properly, internally provided with a wick structure and filled with a proper amount of working liquid; and the radiating fin is arranged on the condensing section. The heat radiation device has the advantages of reasonable and compact structure, easy production, high heat conduction efficiency and high heat radiation speed. The enhanced evaporation section is contacted with the heat source surface directly and sufficiently, therefore, the heat radiation device can effectively reduce the temperature of the LED modules, solve the heat radiation problem of large-power LEDs, improve the light emitting efficiency of LEDs, reduce the light degradation speed of LEDs and prolong the service life of LEDs. Simultaneously, the heat radiation device can reduce the volume and the weight of LED lamps and improve the adaptability and the use range of the LED lamps.

Description

technical field [0001] The invention relates to a heat transfer device, in particular to a loop heat pipe cooling device using an enhanced evaporating section, which can be applied to the field of LED high-power lighting or the application field of electronic components requiring heat dissipation. Background technique [0002] High-power LEDs are being used more and more in lighting. At present, the heat dissipation problem of high-power LEDs is still a problem that hinders the rapid popularization of high-power LED lighting applications. Most of the electrical energy of high-power LEDs is converted into conduction heat. In addition, placing several or a large number of LEDs in a module to achieve the required brightness will cause difficulty in heat dissipation, and the temperature of the LED module will rise, resulting in LEDs. The lifespan is reduced, and the light decay of the LED is accelerated, and the efficiency and reliability of the LED driver and other components a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00H01L23/427F21Y101/02F21V29/508F21V29/71F21Y115/10
Inventor 史杰
Owner 史杰
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