The invention discloses a vapor chamber based on a flat-plate
loop heat pipe. The
heat transfer capability, the limiting
heat flow density heat dissipation capability, the anti-overloading and inverse gravity capability of the vapor chamber are improved. The size of the vapor chamber is increased. The thickness of the vapor chamber is reduced. The conflicting requirements of
performance improvement of the vapor chamber for both
large pore size of capillary wick and small pore size of the capillary wick are met. The flat-plate
loop heat pipe composed of an
evaporator, a liquid accumulator and a gas / liquid
pipe is pre-embedded in an aluminum
alloy plate to form the vapor chamber based on the flat-plate
loop heat pipe. The
evaporator of the flat-plate loop
heat pipe is arranged in the region, which is attached to a biggest heat source of a
chip to be cooled, of the vapor chamber. The side, provided with a vapor channel, of the
evaporator is attached to the biggest heat source. The vapor chamber is provided with a
heat sink attached region and a heat source attached region. The gas / liquid
pipe is led out of an outlet of the evaporator and is arranged in the
heat sink attached region and the heat source attached region in a reciprocating mode, finally passes the
heat sink attached region and returns to the liquid accumulator of the flat-plate loop
heat pipe.