Ultra-thin flat heat pipe and manufacturing process thereof

Abstract

The invention relates to the technical field of heat dissipating devices, in particular to an ultra-thin flat heat pipe and a manufacturing process thereof. A bottom plate and a cover plate which arebuckled and packaged are included, the bottom plate is provided with a cavity internally provided with a plurality of capillary structures arranged in parallel, gas flow channels for a heat pipe working medium to flow therein is formed between the adjacent capillary structures, and each capillary structure includes a plurality of liquid flow channels arranged in parallel. A gas working medium flows in the gas flow channels, and a liquid working medium flows in the capillary structures, so that gas-liquid separation of the working media is achieved, the flow resistance is reduced, and the heattransfer limit of the heat pipe is increased; and the ultra-thin flat heat pipe is simple in structure and easy to manufacture, can realize industrial production line production, has strong heat transfer capacity, is small in thickness of heat pipe, can meet the requirement for heat dissipation of electronic devices in a narrow space, meets the needs of integration and miniaturization of electronic components, and has good practicability and applicability .

Description

technical field [0001] The present invention relates to the technical field of heat dissipation devices, and more particularly relates to an ultra-thin flat heat pipe and a manufacturing process thereof. Background technique [0002] Since entering the 21st century, electronic technology and information industry have developed rapidly. The miniaturization and integration of electronic devices has become the development trend of electronic technology. The high integration, high packaging density and high operating frequency of electronic chips make the temperature of the chip rise rapidly. . Studies have shown that the damage rate of electronic components is positively correlated with the operating temperature. When electronic components are under high-temperature operating conditions for a long time, their reliability will decrease significantly. According to statistics, about 55% of the failures of electronic devices are caused by overheating. The normal operating tempera...

AI Technical Summary

Problems solved by technology

However, cylindrical heat pipes, pulsating heat pipes, and loop heat pipes occupy a large volume, which cannot meet the needs of electronic device integration and miniaturization; flat-plate heat pipes are generally divided into two forms: cylindrical heat pipe flattening and upper and lower plate welding in the actual production process. The application of the former is limited due to the flattening width. Although the latter can be flexibly designed and manufactured according to actual application conditions, its relative thickness is relatively large, and the structure with small thickness is difficult to realize industrialization.

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