Ultrathin soaking plate super-hydrophilic micro-nano-structure liquid absorbing core and preparation method

Abstract

The invention discloses an ultrathin soaking plate super-hydrophilic micro-nano-structure liquid absorbing core. The ultrathin soaking plate super-hydrophilic micro-nano-structure liquid absorbing core comprises a liquid absorbing core body and a soaking plate cover plate. The liquid absorbing core body is directly prepared on the soaking plate cover plate. The liquid absorbing core body is formedby periodically-distributed micro-arrays and passageways around the micro-arrays. Nano-scale sub-structures are densely distributed on the surfaces of the micro-arrays and the surfaces of the passageways around the micro-arrays, and a micro-nano full-coverage structure containing rich micro-cavities is formed by the micro-arrays, the passageways and the nano-scale sub-structures. A high-surface-energy oxide coating is arranged on the surface of the micro-nano full-coverage structure. Compared with powder spraying sintering of an existing liquid absorbing core and a traditional preparation method of a red copper silk screen liquid absorbing core, the steps of the process of preparing the liquid absorbing core with a laser method are fewer, the flow path is short, the efficiency is high, the structural consistency is good, the stability is high, the comprehensive performance is good, and a lowest heat pipe thickness and an optimal heat dissipation effect can be achieved.

Description

technical field [0001] The invention relates to a liquid-absorbing core for various ultra-thin heat pipes and vapor chambers, especially a high-performance liquid-absorbing core based on a super-hydrophilic micro-nano structure, belonging to the technical field of heat pipes. Background technique [0002] With the rapid development of microelectronics technology and electronic information industry, various electronic devices and devices, especially ultra-thin mobile devices represented by smart phones and tablet computers, are constantly moving towards high performance, integration, miniaturization and lightness. The direction of development, higher chip heat flux density, smaller heat dissipation space, more difficult heat dissipation conditions, put forward higher requirements for the heat dissipation capacity and further miniaturization of heat sinks, and the heat dissipation problem for high heat flux density has become a constraint One of the key limiting factors for th...

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Problems solved by technology

The thickness of the liquid-absorbing core required by ultra-thin heat pipes is also decreasing, resulting in an increase in interfacial shear force and a decrease in heat transfer capacity caused by high-speed gas-liquid convection inside the heat pipe.

At present, there are two main development directions: one is to optimize the traditional liquid-absorbent core to meet the requirements of ultra-thin heat pipes, such as sintered copper mesh core prepared by chemical deposition and sintering, or sintering wire mesh, grooves and powder into one Composite liquid-absorbing core structure, this method increases the complexity and cost of the ultra-thin heat pipe manufacturing process, and it is difficult to further reduce the thickness

The second type of method is to prepare a liquid-absorbing structure on the inner wall of an ultra-thin heat pipe by etching methods such as reactive ion etching, electric discharge machining, electrolytic machining, and surface coating. These methods are more complicated in process, more expensive in cost, and not environmentally friendly.

[0004] The liquid-absorbing core prepared by the above-mentioned various methods can be used for heat pipes of general thickness. When the thickness of the heat pipe is lower than 0.4mm, its capillary performance will decrease significantly, water resistance and air resistance will increase significantly, and heat transfer efficiency will drop rapidly. The core is difficult to meet the demand

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