Vapor chamber based on flat-plate loop heat pipe

Abstract

The invention discloses a vapor chamber based on a flat-plate loop heat pipe. The heat transfer capability, the limiting heat flow density heat dissipation capability, the anti-overloading and inverse gravity capability of the vapor chamber are improved. The size of the vapor chamber is increased. The thickness of the vapor chamber is reduced. The conflicting requirements of performance improvement of the vapor chamber for both large pore size of capillary wick and small pore size of the capillary wick are met. The flat-plate loop heat pipe composed of an evaporator, a liquid accumulator and a gas/liquid pipe is pre-embedded in an aluminum alloy plate to form the vapor chamber based on the flat-plate loop heat pipe. The evaporator of the flat-plate loop heat pipe is arranged in the region, which is attached to a biggest heat source of a chip to be cooled, of the vapor chamber. The side, provided with a vapor channel, of the evaporator is attached to the biggest heat source. The vapor chamber is provided with a heat sink attached region and a heat source attached region. The gas/liquid pipe is led out of an outlet of the evaporator and is arranged in the heat sink attached region and the heat source attached region in a reciprocating mode, finally passes the heat sink attached region and returns to the liquid accumulator of the flat-plate loop heat pipe.

Description

technical field [0001] The invention relates to a soaking plate, in particular to a soaking plate based on a flat loop heat pipe, which belongs to the technical field of heat dissipation of electronic equipment. Background technique [0002] The loop heat pipe is a high-efficiency two-phase heat transfer device, which has the characteristics of high heat transfer performance, long-distance heat transfer, excellent temperature control characteristics, arbitrary bending of the pipeline, and convenient installation. With comparable advantages, the loop heat pipe has very broad application prospects in many fields such as aviation, aerospace, and ground electronic equipment heat dissipation. [0003] Such as figure 1 As shown, the loop heat pipe mainly includes: an evaporator 1, a condenser 2, a liquid receiver 3, a vapor pipeline 4 and a liquid pipeline 5. Evaporation, absorbing the heat outside the evaporator 1, the generated steam flows from the steam pipeline 4 to the cond...

AI Technical Summary

Problems solved by technology

[0008] However, the application of vapor chambers has the following problems: there are contradictions in the requirements for product performance improvement on the capillary core. Heat transfer capacity, increase limit heat flux density, increase anti-overload and anti-gravity working ability, increase vapor chamber size; on the other hand, in order to improve some p

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