Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing

Abstract

A method for fabricating a metal micro heat pipe with a polygonal cross-section including at least two concave sides to allow working fluid to flow by capillary force generated at the edges of the micro heat pipe. The concave sides are each formed of a single metal layer via a single drawing process. The polygonal cross-section is triangular, and the micro heat pipe is formed of a single metal plate.

Description

[0001] The application is a Continuation of U.S. patent application Ser. No. 10,654,686 filed on Sep. 3, 2003 which claims the priority of Korean Patent Application No. 2002-80869, filed on Dec. 17, 2002, in the Korean Intellectual Property Office.BACKGROUND [0002] 1. Field of the Invention [0003] The present invention relates to a heat pipe, and more particularly, to a micro heat pipe for small, thin-film type electronic devices. [0004] 2. Description of the Related Art [0005] With the advances of semiconductor manufacturing related technologies, chips packaged in electronic devices and systems have become smaller and have become more highly integrated. However, such chips and systems generate a larger amount of heat per unit area, so that effective cooling techniques are required. Specially, the latest small, thin-film type electronic devices require much smaller cooling devices. [0006] Conventionally, heat sinks, fans, small circular heat pipes having a diameter of 3 mm or greate...

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Benefits of technology

[0014] As described above, a micro heat pipe according to the present invention can be manufactured easily via simple drawing or extrusion. The micro heat pipe according to the present invention can induce strong capillary force through simple structural modifications, without need to install a separate wick for flowing working fluid.

Problems solved by technology

However, such chips and systems generate a larger amount of heat per unit area, so that effective cooling techniques are required.

However, as the size of heat sinks is reduced more and more, the heat dissipating area becomes smaller and the heat dissipating rate becomes lower.

Meanwhile, fans have a limitation in that their size cannot be reduced unlimitedly.

In addition, the fans are less reliable than other cooling devices.

However, when such a heat pipe is compressed, a wick thereof undergoes structural changes, and the heat transferring performance is greatly deteriorated.

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