Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board

A technology of soft and hard combination and production method, which is applied in the direction of assembling printed circuits with electrical components, and can solve problems such as difficulty in removal

Active Publication Date: 2012-06-06
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the stickiness of the peelable film, and the thickness of the conductive circuit provided on the flexible circuit board such as the welding pad is relatively large, when the peelable film is removed from the surface of the conductive c

Method used

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  • Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board
  • Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board
  • Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board

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Experimental program
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Embodiment Construction

[0053] The fabrication method of the rigid-flex circuit board provided by the technical solution will be further described below in conjunction with the accompanying drawings and embodiments.

[0054] The manufacturing method of the soft-rigid circuit board provided by the technical solution includes the following steps:

[0055] For a first step, see figure 1 , providing a flexible circuit board 110 .

[0056] The flexible circuit board 110 is a circuit board fabricated with conductive circuits. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In this embodiment, the flexible printed circuit board 110 is taken as an example for illustration. The flexible circuit board 110 includes a first insulating layer 111 , a first conductive circuit 112 , a second conductive circuit 113 , a first covering film 116 and a second covering film 117 . The first insulating layer 111 includes an opposite first surface 1111 and a second surf...

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PUM

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Abstract

The invention relates to a manufacturing method of a circuit board with combination of a flexible circuit board and a hard circuit board. The method comprises the following steps that: a flexible circuit board including a bending area is provided, wherein the flexible circuit board has a conductive line that is covered by a covering film; besides, a through hole is arranged on the covering film and a portion of the conductive line is exposed from the through hole, wherein the portion of the conductive line is in the bending area; a strippable film is provided, wherein the shape of the strippable film is corresponded to that of the bending area, and a groove that penetrates a mucilage layer and is corresponded to the through hole is formed in the strippable film; the strippable film is attached to the bending area, the mucilage layer is contacted with the covering film in the bending area, and the through hole is correspondedly communicated with the groove; a film and a copper foil are provided, wherein an opening that is corresponded to the bending area is formed in the film; a copper coil substrate, the film and the flexible circuit board are successively stacked and stitched, wherein the opening is corresponded to the bending area; the copper coil is manufactured to form an external layer conductive line and the material of the corresponded copper coil in the bending area is removed, so that the strippable film is exposed. And the strippable film is removed.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for producing a circuit board with a groove structure. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A.Oo ki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. [0003] Rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of flexible circuit boards, but also include the hardness of rigid circuit boards. In the production process of the flexible and rigid circuit board, it is usually formed by pressing the copper foil on the flexible circuit board t...

Claims

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Application Information

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IPC IPC(8): H05K3/36
Inventor 王明德黄莉
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
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