Composite material, high frequency circuit board prepared from same and preparation method thereof

Abstract

The invention relates to a composite material, a high frequency circuit board prepared from same and a preparation method thereof. The composite material comprises the following components: 20-70 parts of thermosetting mixture containing a hydrocarbon resin with the molecular weight of less than 11000 and more than 60% of ethylene group and a solid styryl resin with unsaturated double bond and medium or low molecular weight; glass fiber cloth; filler powder; and fire retardant and curing initiator. The prepared high frequency circuit board comprises a plurality of prepreg layers which are superimposed and prepared from the composite material, and copper coils which are pressed and coated on both sides of prepreg layers. The preparation of the prepregs prepared by the composite material ofthe invention is simple and the high frequency circuit board prepared from the prepregs has low dielectric constant and dielectric loss angle tangent, good heat resistance and convenient technologicaloperation so that the composite material of the invention is suitable to prepare circuit boards of high frequency electronic equipments.

Description

Technical field [0001] The invention relates to a composite material, a high-frequency circuit substrate made of the composite material, and a manufacturing method thereof, in particular to a thermosetting dielectric composite material, a high-frequency circuit substrate made of the composite material, and a manufacturing method thereof. Background technique [0002] In recent years, with the development of high-performance, high-functionality, and networking of computers and information communication equipment, in order to transmit and process large-capacity information at a high speed, the operating signals tend to be high-frequency, and therefore, the material of the circuit board is required. [0003] In high frequency circuits, the transmission loss of electrical signals is expressed by the sum of dielectric loss, conductor loss, and radiation loss. The higher the frequency of the electrical signal, the greater the relationship between dielectric loss, conductor loss, and radia...

AI Technical Summary

Problems solved by technology

[0006] The European patent (Application No. WO97 / 38564) uses non-polar styrene, butadiene and divinylbenzene tetramers to add magnesium aluminosilicate fillers, and uses glass fiber cloth as a circuit substrate made of reinforcing materials. Although the dielectric properties are excellent, the heat resistance of the substrate is poor, the glass transition temperature is only about 100°C, and the thermal expansion coefficient is large, which makes it difficult to meet the high temperature (above 240°C) requirements of the lead-free process in the PCB manufacturing process.

[0007] U.S. Patent (US5571609) adopts 1,2-polybutadiene resin or polyisobutadiene with a molecular weight of less than 5000 and a copolymer of high molecular weight butadiene and styrene, and adds a large amount of silicon Micropowder is used as a filler, and the circuit substrate made of glass fiber cloth as a reinforcing material has excellent dielectric properties, but in this patent, components with high molecular weight (Mn greater than 50,000) are used to improve the stickiness of the prepreg. The technological performance of the process becomes poor; and because the proportion of rigid structural benzene rings in the resin molecules of the entire resin system is very small, and most of the chain segments after crosslinking are composed of methylene groups with low rigidity, the rigidity of the board produced Not good, very low bending strength

In addition, this patent uses a large amount of silicon micropowder as a filler to improve the stickiness of the prepreg, because the hardness of the silicon micropowder is very high, which will increase the wear of the drill during PCB processing

[0008] U.S. Patent (US6569943) uses the liquid polybutadiene resin of the amine-modified liquid polybutadiene resin that has vinyl group at molecular end, adds the monomer of middle and low molecular weight as solidifying agent and diluent, impregnates the circuit substrate that glass fiber cloth is made, although The dielectric properties are very good, but because the resin system is liquid at room temperature, it cannot be made into a non-stick prepreg. Therefore, it is difficult to use the general prepreg stacking process when the board is pressed and formed, and the process operation is more difficult.

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