Composite material, high frequency circuit board prepared from same and preparation method thereof

A composite material and mixture technology, applied in circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of difficult to meet high temperature, poor process performance, difficult process operation, etc., to achieve dielectric constant and dielectric loss tangent Low, improve the sticky hand problem, the effect of convenient process operation

A composite material and mixture technology, applied in circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of difficult to meet high temperature, poor process performance, difficult process operation, etc., to achieve dielectric constant and dielectric loss tangent Low, improve the sticky hand problem, the effect of convenient process operation

CN101643565AActive Publication Date: 2010-02-10GUANGDONG SHENGYI SCI TECH
5 Cites 34 Cited by

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Composite material, high frequency circuit board prepared from same and preparation method thereof
  • Composite material, high frequency circuit board prepared from same and preparation method thereof
  • Composite material, high frequency circuit board prepared from same and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] step 1:

[0069] Add p-hydroxystyrene / styrene copolymer, allyl chloride, benzyltriethylammonium chloride, and toluene into a four-necked flask, and press 1 for p-hydroxystyrene / styrene copolymer and allyl chloride. : 12 molar ratio, the amount of benzyl triethylammonium chloride is 1% (molar ratio) of the p-hydroxystyrene / styrene copolymer, and the p-hydroxystyrene / styrene copolymer is synthesized according to known methods (such as JP61-275307, DongJin Woo, Polymer47 (2006): 3287-3291, JungKi Kim, Polymer47 (2006): 5799-5809), Wn is 8,500. The above mixture was heated under the protection of nitrogen at a heating temperature of 100 degrees and reacted for 2 hours. After the reaction, it is filtered, washed with water to remove salt, and distilled under reduced pressure to remove excess allyl chloride, and finally a solid styrene-based resin with unsaturated double bonds is obtained. The solid styrene-based resin with unsaturated double bonds has a Wn of 9,380.

[0070] S...

Embodiment 2、3、4

[0073] The manufacturing process is the same as in Example 1, and the composition ratio of the composite material in step 2 is changed as shown in Table 3.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
base weightaaaaaaaaaa
molecular weightaaaaaaaaaa
Login to View More

Abstract

The invention relates to a composite material, a high frequency circuit board prepared from same and a preparation method thereof. The composite material comprises the following components: 20-70 parts of thermosetting mixture containing a hydrocarbon resin with the molecular weight of less than 11000 and more than 60% of ethylene group and a solid styryl resin with unsaturated double bond and medium or low molecular weight; glass fiber cloth; filler powder; and fire retardant and curing initiator. The prepared high frequency circuit board comprises a plurality of prepreg layers which are superimposed and prepared from the composite material, and copper coils which are pressed and coated on both sides of prepreg layers. The preparation of the prepregs prepared by the composite material ofthe invention is simple and the high frequency circuit board prepared from the prepregs has low dielectric constant and dielectric loss angle tangent, good heat resistance and convenient technologicaloperation so that the composite material of the invention is suitable to prepare circuit boards of high frequency electronic equipments.

Description

Technical field [0001] The invention relates to a composite material, a high-frequency circuit substrate made of the composite material, and a manufacturing method thereof, in particular to a thermosetting dielectric composite material, a high-frequency circuit substrate made of the composite material, and a manufacturing method thereof. Background technique [0002] In recent years, with the development of high-performance, high-functionality, and networking of computers and information communication equipment, in order to transmit and process large-capacity information at a high speed, the operating signals tend to be high-frequency, and therefore, the material of the circuit board is required. [0003] In high frequency circuits, the transmission loss of electrical signals is expressed by the sum of dielectric loss, conductor loss, and radiation loss. The higher the frequency of the electrical signal, the greater the relationship between dielectric loss, conductor loss, and radia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
10 Feb 2010
Publication
CN101643565A
IPC
C08L25/08; C08L25/18; C08K7/14; C08J5/24; B32B15/082; B32B15/20; H05K1/03
CPC
C08J2353/02; C08F212/08; C08K3/40; C08J2309/00; C08K7/14; C08J2309/06; C08K3/0033; C08J2325/18
Inventors
苏民社