Additive for manufacturing ultrathin electrolytic copper foil
An electrolytic copper foil and additive technology, applied in the electrolysis process, electroforming and other directions, can solve the problems of coarse and loose crystal structure, low tensile strength, large internal resistance of the battery, etc. , the effect of improving the volume-to-capacity ratio
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Embodiment 1
[0009] The additives used in the manufacture of ultra-thin electrolytic copper foil are prepared by adding 300 mg of amide, 20 mg of casein, 5 mg of tetrahydrothiazole copper sulfur, 5 mg of polyethylene glycol, and 40 mg of gelatin into 10,000 liters of deionized water and mixing evenly.
Embodiment 2
[0011] The additives for manufacturing ultra-thin electrolytic copper foil are prepared by adding 800 mg of amide, 40 mg of casein, 10 mg of copper tetrahydrothiazole, 10 mg of polyethylene glycol, and 50 mg of gelatin into 10,000 liters of deionized water and mixing evenly.
Embodiment 3
[0013] Additives for making ultra-thin electrolytic copper foil can also be 300 mg of amide, 20 mg of casein, 5 mg of copper tetrahydrothiazole, 5 mg of polyethylene glycol, 40 mg of gelatin, 100 mg of poly Sodium dithiodipropane sulfonate and 20 mg of superior pure sodium chloride are evenly mixed.
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