Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor

A technology of surface mounting and manufacturing method, which is applied to volume/mass flow generated by mechanical effects, fluid pressure measurement by changing ohmic resistance, and detection of fluid flow by measuring differential pressure. The integration of mounting and packaging methods, uneven thickness of the pressure-sensitive film, and increased cost, achieve the effect of simple structure, low production cost, and convenient packaging

Active Publication Date: 2013-07-03
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a single-chip micro-flow sensor suitable for surface mount packaging and its manufacturing method, which is used to solve the problem of introducing a bonding process into the existing micro-flow sensor. Adverse effects of residual stress and non-uniform thickness of the pressure-sensitive film, as well as the problem of increased cost due to the fact that the micro-flow sensor die in the prior art is not easy to integrate with the micro-fluidic system in a surface-mount package

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  • Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor
  • Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor
  • Single-silicon chip microflow sensor suitable to be packaged in surface mounting way and manufacturing method for single-silicon chip microflow sensor

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Embodiment Construction

[0054] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0055] see Figure 1 to Figure 7 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides a single-silicon chip microflow sensor suitable to be packaged in a surface mounting way and a manufacturing method for the single-silicon chip microflow sensor. The single-silicon chip microflow sensor comprises a monocrystalline silicon substrate, two pressure sensors and a microfluidic channel with an inlet / outlet. A single-silicon chip single-sided bulk silicon micromachining method is adopted, so that the microfluidic channel and reference pressure cavities of the pressure sensors are formed in the monocrystalline silicon substrate, and the two pressure sensors and the inlet / outlet of the microfluidic channel are ingeniously integrated on the same surface of the same monocrystalline silicon substrate, so that the single-silicon chip microflow sensor is simple in structure. The problems of residual stress caused by heat mismatch between different bonding materials and the thickness non-uniformity of pressure sensitive thin films of the pressure sensors are avoided, a surface mounting packaging technology is suitable for the integration of a bare chip of the single-silicon chip microflow sensor and a microfluidic system, the single-silicon chip microflow sensor and the manufacturing method have the characteristics of low production cost, convenience in packaging, high sensitivity, high stability and the like, and the single-silicon chip microflow sensor is suitable for mass production.

Description

technical field [0001] The invention relates to a micro-flow sensor and a manufacturing method thereof, in particular to a single-silicon chip micro-flow sensor suitable for surface mount packaging and a manufacturing method thereof, which can be used for micro-flow detection of gas or liquid, and belongs to silicon micromechanical The field of sensor technology. Background technique [0002] Since the 1980s, the rapid development of microelectronics technology and MEMS processing technology has provided favorable conditions for the development of silicon-based flow sensors. Since Vanputten and Middelhoek first used the standard silicon process to produce silicon micro-flow sensors in 1974, silicon flow sensor manufacturing technology has made great progress, and its application fields have gradually penetrated into various fields of human work and life, such as : Water quality testing, atmospheric monitoring, life sciences, aerospace, biology and pharmaceuticals and other ...

Claims

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Application Information

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IPC IPC(8): G01F1/34G01L9/02
Inventor 李昕欣王家畴刘洁丹
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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