43results about How to "Improve package reliability" patented technology

The utility model relates to the field of semiconductor processing equipment, and discloses a dispensing device for semiconductor packaging, which comprises a working table, and is characterized in that the front end and the rear end of the upper surface of the working table are respectively provided with a first sliding chute, and a sliding rod is fixedly connected in the first sliding chute at the front end of the upper surface of the working table; according to the dispensing device for semiconductor packaging, compared with most traditional dispensing devices for semiconductor packaging, the first protective shell is arranged on the connecting block, and the supporting block is arranged in the first sliding groove; a user can control the movement of a steel wire rope through a third electric telescopic rod so as to control the angle of a second protective shell relative to a first protective shell, so that the angle of a liquid outlet head arranged in the second protective shell is adjusted, and the trouble that some special positions cannot be aligned during vertical dispensing is reduced; and the device can accurately inject the glue solution to a required position, so that the dispensing efficiency of the device is improved.

The invention relates to a packaging electrode, a manufacturing method thereof and a semiconductor packaging device. The manufacturing method comprises the steps that a diamond composite metal base layer is prepared, a first alloy layer and a second alloy layer are formed on the upper side surface and the lower side surface of the diamond composite metal base layer respectively, and a conductive flange is formed on the side wall of the diamond composite metal base layer; the diamond composite metal base layer, the first alloy layer, the second alloy layer and the conductive flange are of an integrated structure. The surfaces, deviating from the diamond composite metal base layer, of the first alloy layer and the second alloy layer are machining surfaces and are used for being in direct contact with a chip; the flange welding surface of the conductive flange is free of diamond composition. According to the invention, the forming quality and performance of the large-size packaging electrode can be improved, so that the packaging reliability of the semiconductor packaging device can be effectively improved.

The invention provides a display panel and a preparation method thereof and a display device, the display panel comprises a substrate, at least one light emitting unit, a first packaging layer and a protection layer, and the light emitting unit is located on one side of the substrate in the thickness direction; the first packaging layers are located on the sides, away from the substrate, of the light-emitting units, the protection layer is located on the side, away from the substrate, of at least one first packaging layer, the protection layer covers at least part of the first packaging layer, and materials of the first packaging layers and materials of the protection layer both comprise inorganic materials. According to the display panel provided by the invention, the use performance of the display device can be improved.

The invention provides a chip packaging structure and a preparation method thereof, a terminal device and a chip packaging substrate, and the chip packaging structure comprises a substrate which is provided with a first side and a second side which are oppositely disposed in a first direction; the substrate comprises at least one first groove and a plurality of through holes, an opening of the first groove is located in the first side, and the through holes penetrate through the bottom wall of the first groove in the first direction; the at least one first chip is located in the first groove, and the surface, provided with pins, of the first chip faces the second side; the at least one second chip is located on the second side of the substrate, and the surface, provided with pins, of the second chip faces the first side; the first wiring layer is located on the first side of the substrate, and the first wiring layer is electrically connected with the pins of the first chip; the second wiring layer is located on the second side of the substrate, and the second wiring layer is electrically connected with the pins of the second chip; and a connection line in the through hole and electrically connected with the first wiring layer and the second wiring layer. Stacking of a plurality of chips is achieved, and holing in the chips can be avoided.

The invention relates to a stretchable display panel and a display device. The stretchable display panel includes: a substrate; the plurality of pixel islands are arranged on the substrate at intervals; each pixel island is provided with a light-emitting area and a non-light-emitting area adjacent to the light-emitting area; the pixel island comprises a driving layer group which is arranged on the substrate; the pixel limiting structure is arranged on the driving layer group; the pixel limiting structure defines a pixel opening located in the light-emitting area; at least one groove located in the non-light-emitting area is further formed in the side, away from the driving layer set, of the pixel limiting structure, and the groove penetrates through the pixel limiting structure and part of the driving layer set in the thickness direction of the substrate. The light-emitting units are arranged in the pixel openings; and the packaging layer covers one side, deviating from the substrate, of the light-emitting unit and the groove wall of the groove. The packaging reliability of the packaging layer can be improved, and the service life of the stretchable display panel can be prolonged.

The utility model discloses a kind of high-precision RGB edge-emitting laser lamp group module, it is related to optoelectronic packaging technical field, including copper substrate, the top of copper substrate is fixedly connected with chip bracket, the top of chip bracket is fixedly connected with several T table type silicon prism, the top of chip bracket is fixedly connected with edge-emitting laser chip assembly, the top of copper substrate is installed with glass optical window, the bottom of glass optical window is coated with metal plating, the device is through structural integration design, optical integration optimization and all inorganic packaging process, effectively improve the light path precision of edge-emitting laser chip assembly, structural stability, packaging reliability and thermal management performance, while significantly improve the automation assembly efficiency and reduce manufacturing cost, especially suitable for high-resolution display, complex environment lighting and laser system in the scene with higher precision and reliability requirement.

The utility model discloses an L-shaped tab and a soft package battery structure, which belong to the technical field of batteries, the L-shaped tab comprises a battery cell main body and an L-shaped tab, the battery cell main body comprises a side edge sealing area, a top edge sealing area and a naked battery cell, the side edge sealing area and the top edge sealing area are sealed to form a closed space, the naked battery cell is arranged in the closed space, and the L-shaped tab is arranged in the closed space. The side edge sealing area comprises a side seal inner unsealed area and a side seal sealing area, the top edge sealing area comprises a top seal inner unsealed area, a top seal sealing area and a top seal outer unsealed area, and a heat seal sealing area is formed at the joint of the side seal inner unsealed area and the top seal inner unsealed area through heat seal; a notch is cut at the intersection of the top sealing area and the side sealing area, PP glue covers the long tab handle, the PP glue comprises exposed PP glue, the exposed PP glue is arranged outside the outer unsealed area, and the long tab handle, the exposed PP glue and the top edge sealing area are bent to form a top edge L-shaped or top edge side U-shaped edge folding structure. Through the battery structure, the battery length is reduced, and the space utilization rate of the battery structure is improved.

The invention relates to a packaging structure and a manufacturing method thereof, the packaging structure comprises a circuit board, an adapter plate, a rewiring layer and a chip layer which are stacked, and the chip layer comprises a plurality of first chips; the rewiring layer comprises a dielectric layer and a metal interconnection line arranged in the dielectric layer; the circuit board is electrically connected with the first chips through the adapter plate and the metal interconnection lines; a groove is formed in the side, close to the rewiring layer, of the adapter plate, and part of the dielectric layer is located in the groove. The first chip and the circuit board can be electrically interconnected through the adapter plate and the metal interconnection line, so that chip interconnection and fan-out packaging are realized, the process steps are saved, and the manufacturing cost is reduced. Besides, one side, close to the rewiring layer, of the adapter plate is provided with a groove, and a part of the dielectric layer is located in the groove, so that the binding force between the dielectric layer and the adapter plate is effectively improved, the dielectric layer is prevented from being separated from the adapter plate, meanwhile, the size of the adapter plate is reduced due to the arrangement of the groove, the warping of the adapter plate is reduced, and the packaging reliability is improved.

The invention relates to a double-side plastic package structure and a manufacturing method thereof, the double-side plastic package structure comprises a first laminated board, an anisotropic conductive adhesive layer and a second laminated board which are laminated, the first laminated board comprises a first element, a first circuit layer, a first base layer and a first plastic package body, the first circuit layer is arranged at one side, facing the anisotropic conductive adhesive layer, of the first base layer, and the second circuit layer is arranged at the other side, facing the anisotropic conductive adhesive layer, of the second plastic package body; the first element is embedded in the first plastic package body and is electrically connected with the first circuit layer; the second laminated board comprises a second element, a second circuit layer, a second base layer and a second plastic package body, the second circuit layer, the second base layer and the second plastic package body are stacked in sequence, the second circuit layer is arranged on the side, facing the anisotropic conductive adhesive layer, of the second base layer, the second element is embedded in the second plastic package body and electrically connected with the second circuit layer, and the anisotropic conductive adhesive layer is bonded between the first circuit layer and the second circuit layer. The first circuit layer and the second circuit layer are electrically connected through the anisotropic conductive adhesive layer. The double-face plastic package structure is high in manufacturing yield and packaging reliability and low in manufacturing cost.

The application relates to a chip packaging structure, which comprises a first carrier substrate, a second carrier substrate and a chip assembly. The first carrier substrate is provided with a first mounting area and a second mounting area which are arranged at intervals along a first direction, and the second carrier substrate is provided with a third mounting area which is arranged at intervals with the first mounting area along a second direction. The chip assembly comprises a driving chip arranged on the second mounting area, a first power chip arranged on the first mounting area and a second power chip arranged on the third mounting area. The first direction is the extension direction of the center line of the first power chip and the driving chip, the second direction is the extension direction of the center line of the first power chip and the second power chip, and the angle between the two directions is less than 90 DEG. The relative position and the angle of the mounting areas on the carrier substrate are optimized, so that a more compact chip layout is realized, the packaging volume is effectively reduced, and the heat dissipation performance and the packaging reliability are improved.

The invention provides a 2.5 D interposer packaging structure and a packaging method, and relates to the technical field of semiconductor packaging. The 2.5 D interposer packaging structure comprises an interposer, a conductive column, an insulating layer, a first dielectric layer, a second dielectric layer, a first metal layer and a solder ball. The interposer is provided with a first surface and a second surface which are oppositely arranged; the conductive column is arranged in the interposer, and one end face of the conductive column protrudes out of the first surface; the insulating layer is arranged on the first surface and covers the side wall of the conductive column, so that a first groove is formed in the periphery of the conductive column; the first dielectric layer is arranged in the first groove; the second dielectric layer is arranged on the first dielectric layer and is provided with a first opening for exposing the conductive column; the section of the first opening is larger than that of the conductive column; the first metal layer is arranged in the first opening; the first metal layer is electrically connected with the conductive column; the solder ball is electrically connected with the first metal layer. Fracture or subfissure of the conductive columns in the manufacturing process can be prevented, and the conductivity and the packaging reliability are improved.

The invention provides a display panel, a preparation method thereof and a display device.The display panel comprises a display area and a non-display area and further comprises a substrate and an inorganic layer located on one side of the substrate; the dam is located in the non-display area and arranged on the side, away from the substrate, of the inorganic layer; the first groove is located in the non-display area and arranged on the side, close to the display area, of the dam, and at least part of the first groove is located in the inorganic layer; the second groove is located in the non-display area and arranged on the side, away from the display area, of the dam, and at least part of the second groove is located in the inorganic layer; the packaging layer is located in the display area and the non-display area, and at least part of the packaging layer covers the inorganic layer, the dam, the first groove and the second groove. According to the display panel, the overflow risk of the organic material in the packaging layer can be reduced, and the packaging reliability is improved.

The invention provides a stretching display screen, a preparation method and a display device. The stretching display screen comprises a substrate; a plurality of island regions are formed on the substrate; the island area comprises an anode, a pixel definition layer, a light-emitting unit, a cathode and a first inorganic packaging layer which are sequentially arranged on the substrate, the pixel definition layer comprises an inorganic material layer, and the inorganic material layer is in lap joint with the first inorganic packaging layer; the island region further comprises an auxiliary cathode arranged on the same layer as the anode, and the auxiliary cathode is electrically connected with the cathode. According to the stretching display screen provided by the invention, the pixel definition layer is made of the inorganic material, the adhesion between the pixel definition layer made of the inorganic material and the packaging layer made of the inorganic material is better, the packaging reliability is improved, structures such as isolation columns do not need to be additionally arranged at the edge of the island region, the packaging distance of the edge of the island region can be effectively shortened, and the packaging efficiency is improved. And the PPI of the device can be improved.

The invention provides a display module and a preparation method thereof, and an electronic device, the display module comprises a metal wire layer, an organic layer and an inorganic layer, the boundary of the organic layer and the boundary of the inorganic layer at an outer dam part close to a position with a large carving amount on the side of the metal wire layer are interchanged, and the inorganic layer is separated between the organic layer and the metal wire layer; therefore, residual organic glue at the side-carved position of the metal wire layer cannot be in contact with the organic layer to form a continuous organic channel, a channel for water vapor to invade into a display area of the display module is cut off, and meanwhile, an insulating edge-covering structure is arranged at the side-carved position of the metal wire layer in a range from the outer side of the outer dam to the bending area, so that good side edge packaging is formed, and the service life of the display module is prolonged. The plurality of insulating edge covering structures arranged at intervals can form a plurality of effective packaging areas, so that the effective packaging distance of the packaging layer is prolonged, and the packaging reliability of the display module is improved.

The invention provides a display panel and a display device, and relates to the technical field of display, the display panel comprises a substrate, a plurality of light emitting units, an isolation structure and a first packaging layer, the isolation structure is arranged on one side of the substrate in the thickness direction, a plurality of isolation openings are defined by the isolation structure, and the light emitting units are arranged in the corresponding isolation openings. The first packaging layer is arranged on the side, away from the substrate, of the light-emitting units, the first packaging layer comprises a plurality of packaging parts, and the packaging parts cover the corresponding light-emitting units. The packaging part comprises a first extension part, the first extension part is located on the side, away from the substrate, of the isolation structure, at least part of the orthographic projection of the first extension part on the substrate is located in the orthographic projection of the isolation structure on the substrate, and the face, facing the substrate, of the first extension part is provided with at least one first protruding part. According to the display panel provided by the invention, the packaging reliability can be improved, so that the use performance of the display device can be improved.

This invention provides a packaging method, apparatus, and storage medium suitable for baseband modulation and encryption circuits. It relates to data processing technology, which involves feature processing of a substrate image corresponding to a circuit board to identify abnormal components located on the circuit board and determine the type of abnormality for each component. Based on the substrate image, it identifies an identification region with an abnormality identification relationship to each abnormal component and forms a pointing identifier based on the identification region. Furthermore, during the identification process, it analyzes the data in a circuit component database for any component, solder joint, pin interconnection relationship, pin surface features, and structural features. This invention, based on image recognition and big data technologies, offers advantages such as high packaging efficiency, high accuracy, and high yield rate during the packaging process, meeting the packaging characteristics of baseband modulation and encryption circuits and ensuring high bandwidth and good encryption during later use.

The application provides a display panel and a display device, wherein the display panel comprises a display area and a non-display area, the non-display area is arranged around the periphery of the display area; the non-display area of the display panel comprises a substrate, a buffer layer arranged on one side of the substrate, a planar layer arranged on the side of the buffer layer away from the substrate, an inorganic encapsulation layer arranged on the side of the planar layer away from the buffer layer, and a touch insulation layer arranged on the side of the inorganic encapsulation layer away from the planar layer; wherein the buffer layer is provided with a convex area along a first direction, the convex area is located in the orthographic projection of the planar layer on the buffer layer; the first direction is the direction from the display area to the non-display area; the side of the buffer layer away from the convex area along the first direction is provided with an opening structure; the opening structure penetrates to the substrate along the thickness direction to deposit the inorganic encapsulation layer and the touch insulation layer.

The utility model provides a battery, which comprises a battery cell, a battery cover and a battery cover, the packaging body is used for packaging the battery cell and comprises a first side part and a second side part, a first main body part of the first side part and a second main body part of the second side part are respectively positioned on two opposite sides of the battery cell, a first connecting part of the first side part is connected with a second connecting part of the second side part, and the electric conductor extends out from a connecting part of the first connecting part and the second connecting part; the distance between the first connecting part and the first main body part in the first direction is greater than the distance between the second connecting part and the second main body part in the first direction; the first insulating glue comprises a first glue layer connected with the electric conductor and a third glue layer connected with the first connecting part; the second insulating glue comprises a fourth glue layer connected with the electric conductor and a sixth glue layer connected with the second connecting part; the melting point of the third adhesive layer is greater than that of at least one of the first adhesive layer, the fourth adhesive layer and the sixth adhesive layer. According to the utility model, the packaging reliability, high-temperature safety and other performances of the battery can be improved.

The invention provides a reinforcing plate, a support, a display module and a packaging method of the display module, and belongs to the technical field of semiconductor preparation. One surface of the reinforcing plate is provided with a step; the step comprises a top surface, a bottom surface and a first side surface connected with the top surface and the bottom surface; the top face of the step comprises a welding face, the bottom face of the step comprises a limiting groove, the limiting groove comprises a second side face, and a distance exists between the first side face and the second side face. According to the invention, the packaging reliability can be effectively improved.

The invention discloses a non-contact pressure sensor chip leadless packaging structure and a preparation method, and belongs to the technical field of MEMS sensors. The packaging body comprises a pressure sensor chip needing to be protected, a silicon carbide sealing plate and a transition plate, the silicon carbide sealing plate and the transition plate play a role in sealing, surface circuit protection and connection, mechanical support is provided by sintering a Kovar alloy contact pin through conductive paste, and suspended connection and electrical connection are ensured. And distances are reserved between the upper part of the packaging main body and the silicon carbide top plate and between the lower part and the silicon carbide bottom plate. The non-contact leadless packaging improves the high temperature resistance of the silicon carbide pressure sensor, facilitates the release of thermal stress in the measurement process, and has the advantages of high material thermal adaptability, high measurement precision, good measurement stability and the like.

The invention provides a frame type product packaging structure and method, and the structure comprises a lead frame which is provided with a slide holder and conductive pins; a chip and N resistor assemblies are arranged on the slide holder, the first end of the ith resistor assembly is connected to the conductive pin of the lead frame through the ith bonding wire, the second end of the ith resistor assembly is connected to the ith power supply pin of the chip through the (N + i) th bonding wire, and i is greater than or equal to 1 and less than or equal to N; the voltage drop corresponding to the ith power supply circuit is the ith target voltage drop, and the ith power supply circuit comprises the ith bonding wire, the ith resistor assembly and the (N + i) th bonding wire. External power supply is converted through power supply lines with different target voltage drops, single external power supply is converted into diversified different internal power supply, and the requirements of multiple power supplies are met on the premise that compatibility is not affected.

The invention discloses a packaging structure and a packaging method, and the packaging method comprises the steps: providing a bearing substrate which comprises a bearing surface; forming a plurality of grooves in the bearing surface, wherein the grooves comprise a first groove and a second groove which are adjacent to each other; providing a first chip; placing and attaching a first chip in the first groove; providing a chip set; a chip set is placed in the second groove and attached to the second groove; providing an interconnection chip, wherein the interconnection chip comprises a bonding surface; and an interconnection chip is bonded on the first chip and the chip set, the bonding surface is arranged opposite to the first chip and the chip set, and the interconnection chip is electrically connected with the first chip and the chip set. According to the embodiment of the invention, the performance of the packaging structure is improved.

The utility model relates to the technical field of semiconductors, in particular to a ceramic packaging base and a crystal oscillator, and the ceramic packaging base comprises a single-layer ceramic base and a kovar ring. The kovar ring is arranged on the surface of the single-layer ceramic base, and an accommodating cavity is defined by the kovar ring and the single-layer ceramic base; an electrode bonding pad and a first through hole are arranged on the surface of the single-layer ceramic base in the accommodating cavity; a conductive structure of which the extending direction is vertical to the single-layer ceramic base is arranged in the first through hole; a metal wire is further arranged on the surface of the single-layer ceramic base, one end of the metal wire is connected with the electrode bonding pad, and the other end of the metal wire is connected with the conductive structure; the width of the metal wire is smaller than or equal to the diameter of the first through hole. According to the embodiment of the invention, the production process can be simplified, the packaging reliability and long-term stability are improved, in addition, the consumption of precious metal can be reduced, and the production cost is effectively reduced.

The utility model relates to a terminal type temperature sensor, which comprises a sensor body and an OT terminal, the OT terminal comprises an installation head part and a packaging tail part, the installation head part is provided with an installation hole used for being fixedly connected with a component to be measured, the packaging tail part comprises a base part and a shell crimping part, the base part is in a U-shaped groove shape, and the shell crimping part is provided with a sealing groove. The sensor body is accommodated in the groove cavity of the base part, and the shell crimping part is movably connected to the notch of the base part and is pressed against the sensor body. According to the temperature sensor, external packaging and installation of the sensor body are realized by adopting the OT terminal, and the sensor body is packaged in the OT terminal in a crimping manner through the housing crimping part, so that the operation is convenient, the assembly efficiency is high, the packaging reliability is high, the sensor body can be effectively prevented from falling off, the structural stability of the temperature sensor is ensured, and the detection precision of the temperature sensor is further improved.

A membrane electrode sealing system, belonging to the field of proton exchange membrane electrolysis for hydrogen production, includes a first and a second raw material processing zone and a continuous bonding and curing zone. Two first paths are provided between the first raw material processing zone and the continuous bonding and curing zone. A first moving lifting component and a second moving lifting component on the two first paths reciprocate according to a first preset time sequence to transfer the edge membrane finished product to the continuous bonding and curing zone, and the two components stop at different positions. A second path is provided between the second raw material processing zone and the continuous bonding and curing zone. A third moving lifting component on the second path works in conjunction with the first moving lifting component according to a second preset time sequence to transfer the proton exchange membrane to the same stopping position in the continuous bonding and curing zone. A conveying mechanism in the continuous bonding and curing zone sequentially receives the edge membrane from the first moving lifting component, the proton exchange membrane from the third moving lifting component, and the edge membrane from the second moving lifting component according to a third preset time sequence, forming a stacked structure, and then sends it to the curing mechanism.

The present invention discloses an electrochromic glass, which relates to the field of electrochromism, and includes a substrate, wherein the substrate includes a first substrate and a second substrate, wherein an electrochromic device is provided between the first substrate and the second substrate, wherein the electrochromic device is provided with a first conductive layer, an electrochromic layer, an ion conduction layer, an ion storage layer, and a second conductive layer in sequence starting from the first substrate; an electrode, wherein the electrode is provided to supply power to the electrochromic device; and the inner surface of the substrate includes a groove, wherein the groove is opposite to the electrode, the depth of the groove is less than the thickness of the substrate, and the periphery of the groove and the periphery of the substrate are sealed by edge sealing materials. The technical effect of the present invention is that the product is highly integrated, and a series of control or communication units can be additionally integrated, thereby increasing the product life after glass encapsulation.

This application provides a display panel, its fabrication method, and an electronic device. The display panel includes a display area and a non-display area, the non-display area including a first sub-area. The display panel includes: a substrate; a first metal layer, at least partially located in the first sub-area; a first electrode located on the side of the first metal layer away from the substrate, a first portion of the first electrode overlapping the first metal layer; a protective portion disposed on the side of the first electrode away from the substrate; and a second electrode, a portion of which overlaps with the protective portion. The protective portion of this application can serve as an intermediate electrical connection layer, bridging the first metal layer, the first electrode, and the second electrode, while also providing shielding and protection for the first electrode, preventing damage or corrosion to the first electrode in subsequent processes. This improves packaging reliability; shortens the distance from the inner boundary of the FRIT to the electrode structure, which is beneficial for narrow bezel design; and achieves a narrower bezel while maintaining high reliability, meeting the high screen-to-body ratio requirements of modern display products.