352results about How to "Improve package reliability" patented technology

A MEMS microphone module having an application specific IC and a microphone chip is disclosed. The application specific IC has a plurality of first vias and a plurality of first pads, and the first vias are connected to the first pads. The microphone chip has a resonant cavity, a plurality of second vias and a plurality of second pads, and the second vias are connected to the second pads. The microphone chip is disposed on a first surface of the application specific IC with an opening of the resonant cavity facing toward a first surface of the application specific IC. The second conductive vias of the microphone chip are also electrically connected to the first vias of the application specific IC. By placing the microphone chip on the first surface of the application specific IC, the present invention could reduce the package size and increase the reliability of the package.

A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on the active surface, and a plurality of pads disposed on the active surface and electrically connected to the optical component; the pad extension traces are electrically connected to the pads; the via holes are formed through the chip and electrically connected to the pad extension traces; the lid is attached on the active surface of the chip; and the plurality of metal traces are disposed on the back surface of the chip, electrically connected to the plurality of via holes, and defines a plurality of solder pads thereon.

A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component and a plurality of pads disposed on its active surface; pad extension traces are electrically connected to the pads; the via holes penetrate the chip and are electrically connected to the pad extension traces and exposed out of side surfaces of the semiconductor package structure; the lid is adhered onto the active surface of the chip; and the plurality of metal traces is disposed on the back surface of the chip, electrically connected to the plurality of via holes, and used to define a plurality of solder pads thereon. The present invention also provides a method for manufacturing the semiconductor package structure.

Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.

The invention discloses a copper-free flat packaging piece of an AAQFN frame product and a manufacturing process thereof. The packaging piece is mainly formed by a lead frame, electrosilvering circuits, a chip, bonding wires, a plastic package body and a green oil coating layer. The electrosilvering circuits are silver layers formed on the lead frame through electroplating, the chip is connected with the lead frame through adhesive tape, the bonding wires are connected with the electrosilvering circuits on the lead frame directly from the chip, the plastic package body surrounds the lead frame, the electrosilvering circuits, the chip and the bonding wires, the green oil coating layer coats the etched back face of the lead frame, and the chip, the bonding wires and the electrosilvering circuits form a power supply and signal channel. The manufacturing process comprises the steps of wafer thinning, scribing, formation of the electrosilvering circuits on the lead frame, chip installing (chip adhering), bonding, plastic package, post curing, etching of back face of the frame, green oil coating, printing, cutting, detecting, packaging and storing. According to the copper-free flat packaging piece and the manufacturing process, packaging reliability of products is directly improved, and cost is reduced to a certain degree.