12results about How to "Improve package reliability" patented technology

The utility model discloses a kind of high-precision RGB edge-emitting laser lamp group module, it is related to optoelectronic packaging technical field, including copper substrate, the top of copper substrate is fixedly connected with chip bracket, the top of chip bracket is fixedly connected with several T table type silicon prism, the top of chip bracket is fixedly connected with edge-emitting laser chip assembly, the top of copper substrate is installed with glass optical window, the bottom of glass optical window is coated with metal plating, the device is through structural integration design, optical integration optimization and all inorganic packaging process, effectively improve the light path precision of edge-emitting laser chip assembly, structural stability, packaging reliability and thermal management performance, while significantly improve the automation assembly efficiency and reduce manufacturing cost, especially suitable for high-resolution display, complex environment lighting and laser system in the scene with higher precision and reliability requirement.

The utility model discloses an L-shaped tab and a soft package battery structure, which belong to the technical field of batteries, the L-shaped tab comprises a battery cell main body and an L-shaped tab, the battery cell main body comprises a side edge sealing area, a top edge sealing area and a naked battery cell, the side edge sealing area and the top edge sealing area are sealed to form a closed space, the naked battery cell is arranged in the closed space, and the L-shaped tab is arranged in the closed space. The side edge sealing area comprises a side seal inner unsealed area and a side seal sealing area, the top edge sealing area comprises a top seal inner unsealed area, a top seal sealing area and a top seal outer unsealed area, and a heat seal sealing area is formed at the joint of the side seal inner unsealed area and the top seal inner unsealed area through heat seal; a notch is cut at the intersection of the top sealing area and the side sealing area, PP glue covers the long tab handle, the PP glue comprises exposed PP glue, the exposed PP glue is arranged outside the outer unsealed area, and the long tab handle, the exposed PP glue and the top edge sealing area are bent to form a top edge L-shaped or top edge side U-shaped edge folding structure. Through the battery structure, the battery length is reduced, and the space utilization rate of the battery structure is improved.

The application relates to a chip packaging structure, which comprises a first carrier substrate, a second carrier substrate and a chip assembly. The first carrier substrate is provided with a first mounting area and a second mounting area which are arranged at intervals along a first direction, and the second carrier substrate is provided with a third mounting area which is arranged at intervals with the first mounting area along a second direction. The chip assembly comprises a driving chip arranged on the second mounting area, a first power chip arranged on the first mounting area and a second power chip arranged on the third mounting area. The first direction is the extension direction of the center line of the first power chip and the driving chip, the second direction is the extension direction of the center line of the first power chip and the second power chip, and the angle between the two directions is less than 90 DEG. The relative position and the angle of the mounting areas on the carrier substrate are optimized, so that a more compact chip layout is realized, the packaging volume is effectively reduced, and the heat dissipation performance and the packaging reliability are improved.

The invention provides a 2.5 D interposer packaging structure and a packaging method, and relates to the technical field of semiconductor packaging. The 2.5 D interposer packaging structure comprises an interposer, a conductive column, an insulating layer, a first dielectric layer, a second dielectric layer, a first metal layer and a solder ball. The interposer is provided with a first surface and a second surface which are oppositely arranged; the conductive column is arranged in the interposer, and one end face of the conductive column protrudes out of the first surface; the insulating layer is arranged on the first surface and covers the side wall of the conductive column, so that a first groove is formed in the periphery of the conductive column; the first dielectric layer is arranged in the first groove; the second dielectric layer is arranged on the first dielectric layer and is provided with a first opening for exposing the conductive column; the section of the first opening is larger than that of the conductive column; the first metal layer is arranged in the first opening; the first metal layer is electrically connected with the conductive column; the solder ball is electrically connected with the first metal layer. Fracture or subfissure of the conductive columns in the manufacturing process can be prevented, and the conductivity and the packaging reliability are improved.

This invention provides a packaging method, apparatus, and storage medium suitable for baseband modulation and encryption circuits. It relates to data processing technology, which involves feature processing of a substrate image corresponding to a circuit board to identify abnormal components located on the circuit board and determine the type of abnormality for each component. Based on the substrate image, it identifies an identification region with an abnormality identification relationship to each abnormal component and forms a pointing identifier based on the identification region. Furthermore, during the identification process, it analyzes the data in a circuit component database for any component, solder joint, pin interconnection relationship, pin surface features, and structural features. This invention, based on image recognition and big data technologies, offers advantages such as high packaging efficiency, high accuracy, and high yield rate during the packaging process, meeting the packaging characteristics of baseband modulation and encryption circuits and ensuring high bandwidth and good encryption during later use.

The application provides a display panel and a display device, wherein the display panel comprises a display area and a non-display area, the non-display area is arranged around the periphery of the display area; the non-display area of the display panel comprises a substrate, a buffer layer arranged on one side of the substrate, a planar layer arranged on the side of the buffer layer away from the substrate, an inorganic encapsulation layer arranged on the side of the planar layer away from the buffer layer, and a touch insulation layer arranged on the side of the inorganic encapsulation layer away from the planar layer; wherein the buffer layer is provided with a convex area along a first direction, the convex area is located in the orthographic projection of the planar layer on the buffer layer; the first direction is the direction from the display area to the non-display area; the side of the buffer layer away from the convex area along the first direction is provided with an opening structure; the opening structure penetrates to the substrate along the thickness direction to deposit the inorganic encapsulation layer and the touch insulation layer.

The invention provides a reinforcing plate, a support, a display module and a packaging method of the display module, and belongs to the technical field of semiconductor preparation. One surface of the reinforcing plate is provided with a step; the step comprises a top surface, a bottom surface and a first side surface connected with the top surface and the bottom surface; the top face of the step comprises a welding face, the bottom face of the step comprises a limiting groove, the limiting groove comprises a second side face, and a distance exists between the first side face and the second side face. According to the invention, the packaging reliability can be effectively improved.

The utility model relates to the technical field of semiconductors, in particular to a ceramic packaging base and a crystal oscillator, and the ceramic packaging base comprises a single-layer ceramic base and a kovar ring. The kovar ring is arranged on the surface of the single-layer ceramic base, and an accommodating cavity is defined by the kovar ring and the single-layer ceramic base; an electrode bonding pad and a first through hole are arranged on the surface of the single-layer ceramic base in the accommodating cavity; a conductive structure of which the extending direction is vertical to the single-layer ceramic base is arranged in the first through hole; a metal wire is further arranged on the surface of the single-layer ceramic base, one end of the metal wire is connected with the electrode bonding pad, and the other end of the metal wire is connected with the conductive structure; the width of the metal wire is smaller than or equal to the diameter of the first through hole. According to the embodiment of the invention, the production process can be simplified, the packaging reliability and long-term stability are improved, in addition, the consumption of precious metal can be reduced, and the production cost is effectively reduced.

The utility model relates to a terminal type temperature sensor, which comprises a sensor body and an OT terminal, the OT terminal comprises an installation head part and a packaging tail part, the installation head part is provided with an installation hole used for being fixedly connected with a component to be measured, the packaging tail part comprises a base part and a shell crimping part, the base part is in a U-shaped groove shape, and the shell crimping part is provided with a sealing groove. The sensor body is accommodated in the groove cavity of the base part, and the shell crimping part is movably connected to the notch of the base part and is pressed against the sensor body. According to the temperature sensor, external packaging and installation of the sensor body are realized by adopting the OT terminal, and the sensor body is packaged in the OT terminal in a crimping manner through the housing crimping part, so that the operation is convenient, the assembly efficiency is high, the packaging reliability is high, the sensor body can be effectively prevented from falling off, the structural stability of the temperature sensor is ensured, and the detection precision of the temperature sensor is further improved.

A membrane electrode sealing system, belonging to the field of proton exchange membrane electrolysis for hydrogen production, includes a first and a second raw material processing zone and a continuous bonding and curing zone. Two first paths are provided between the first raw material processing zone and the continuous bonding and curing zone. A first moving lifting component and a second moving lifting component on the two first paths reciprocate according to a first preset time sequence to transfer the edge membrane finished product to the continuous bonding and curing zone, and the two components stop at different positions. A second path is provided between the second raw material processing zone and the continuous bonding and curing zone. A third moving lifting component on the second path works in conjunction with the first moving lifting component according to a second preset time sequence to transfer the proton exchange membrane to the same stopping position in the continuous bonding and curing zone. A conveying mechanism in the continuous bonding and curing zone sequentially receives the edge membrane from the first moving lifting component, the proton exchange membrane from the third moving lifting component, and the edge membrane from the second moving lifting component according to a third preset time sequence, forming a stacked structure, and then sends it to the curing mechanism.

The invention relates to a linear adjustable pressure-slippage combined sensing liquid alloy flexible electronic skin for closed-loop grabbing of a robot, and relates to the technical field of liquid alloy microfluidic devices. Comprising an upper-layer elastic base body, a lower-layer elastic base body, a first liquid alloy micro-channel conduit array, a second liquid alloy micro-channel conduit array, a continuous insulation isolating layer and an end connecting structure, the first liquid alloy micro-channel conduit array is arranged in the upper-layer elastic matrix, and the second liquid alloy micro-channel conduit array is arranged in the lower-layer elastic matrix; the continuous insulation isolation layer is arranged between the first liquid alloy micro-channel conduit array and the second liquid alloy micro-channel conduit array; the end connecting structure is connected with the first liquid alloy microchannel catheter array and the second liquid alloy microchannel catheter array. A mutual capacitance sensing array is formed through upper and lower layering, orthogonal crossing and continuous insulation isolation layers, and flexible touch sense and slippage sensing of parts such as fingertips, palms and joints of a robot are achieved.

This application provides a display panel and a display device, relating to the field of display technology. The display panel includes a substrate, an isolation structure, a light-emitting unit, and a first encapsulation layer. The isolation structure is disposed on one side of the substrate along its thickness direction and defines an isolation opening. The light-emitting unit is disposed on one side of the substrate along its thickness direction, and is located on the side where the isolation structure is located. The light-emitting unit is disposed within at least a portion of the isolation opening. The first encapsulation layer is located on the side of the light-emitting unit facing away from the substrate. The first encapsulation layer includes a plurality of encapsulation portions. The orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of at least a portion of the encapsulation portions on the substrate. The apex corner of the orthographic projection of at least one encapsulation portion on the substrate is located within the orthographic projection of an adjacent encapsulation portion on the substrate. The display panel provided by this application can improve the performance of the display device.