710results about How to "Meet demand" patented technology

A semiconductor device includes a first gate structure including a gate dielectric layer directly contacting the substrate, a bottom electrode on the gate dielectric layer and a top electrode on the bottom electrode, and a second gate structure including a gate dielectric layer directly contacting the substrate and a gate electrode on the gate dielectric layer.

A wiring holding unit for holding a tubular receiving member receiving wiring therein includes a gripping member including a pair of gripping portions for gripping the receiving member, and a movable portion interconnecting the pair of gripping portions such that the pair of gripping portions are movable, and a fitting / fixing member which is separate from the gripping member, and is moved toward the gripping member in a direction generally perpendicular to a direction of fixing of the receiving member gripped by the gripping member, and is fitted on the gripping member to be fixed thereto, thereby preventing the pair of gripping portions from moving respectively in directions opposite respectively to gripping directions of the pair of gripping portions.

The present disclosure provides a hand-held three-dimensional panoramic pan-tilt kit, comprising a hand-held portion, a first motor, a second motor and a third motor that are perpendicular to each other in spatial positions, the first motor is located at a top end of the hand held portion, a first connecting arm is connected to the first motor, the other end of the first connecting arm is connected to the second motor, a second connecting arm is connected to the second motor, the other end of the second connecting arm is connected to the third motor, the third motor is fixedly connected with a connecting member, a front end of the connecting member is connected with a holding member, a first slip ring is arranged between a rotating shaft of the first motor and the first connecting arm, a second slip ring is arranged between a rotating shaft of the second motor and the second connecting arm, a third slip ring is arranged between a rotating shaft of the third motor and the connecting member. By using the slip rings, the present invention ensures 360-degree rotation of the first connecting arm, the second connecting arm and the connecting member during use of the pan-tilt kit, enables the pan-tilt kit to be suitable for a variety of shooting conditions and scenes, thus utilization ratio of the pan-tilt kit is significantly increased and consumers' demand for use is satisfied.

A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.