Single-component high/low-temperature-resistant epoxy resin composition

An epoxy resin, high and low temperature resistance technology, applied in epoxy resin glue, polymer adhesive additives, non-polymer adhesive additives, etc. Heat and high and low temperature alternation can not meet the application needs and other problems, to achieve the effects of excellent comprehensive performance, excellent storage stability, and improved packaging reliability and durability

Active Publication Date: 2012-12-19
GUANGDONG TGPM AUTOMOTIVE IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, affected by the properties of the rubber particles, the rubber cross-linked modified epoxy resin cannot meet the application requirements in various harsh environments in terms of heat resistance, high and low temperature alternating resistance, etc., which greatly limits its application in various Application of potting compound for electronic and electrical components such as electronic components and electrical equipment

Method used

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  • Single-component high/low-temperature-resistant epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] The one-component high and low temperature resistant epoxy resin composition includes the following formula by weight:

[0061] Rubber cross-linking modified epoxy resin (ADEKA EPR-21) 100 parts,

[0062] Cardanol Glycidyl Ether (India Atul K-513) 10 parts,

[0063] Polyacrylate core-shell composite particles (Japan Zhongyuan MX-125) 20 parts,

[0064] 100 parts of hydrogenated methyl nadic acid anhydride (New Nippon Physical and Chemical Co., Ltd. HNA-100),

[0065] Latent curing accelerator (Fujicure FXR-1030) 6 parts,

[0066] Thixotropic agent: 10 parts of nanometer calcium carbonate 322,

[0067] Thixotropic agent: 1 part of modified nano-silica (Wacker Chemie H-18),

[0068] Filler: 80 parts of 800 mesh fused silica powder,

[0069] Pigment: 2 parts of pigment carbon black C66;

[0070] According to the proportioning, all the latent curing accelerator (FXR-1030) in the above-mentioned embodiment 1 component is mixed with 10 parts of rubber cross-linking modi...

Embodiment 2

[0073] The one-component high and low temperature resistant epoxy resin composition includes the following formula by weight:

[0074] Carboxyl-terminated liquid nitrile modified epoxy resin (ADK-EPR-4023) 100 parts,

[0075] 15 parts of cardanol glycidyl ether (Araldite DY-CNO / US of American Huntsman Company),

[0076] Polyacrylate core-shell composite particles (Japan Zhongyuan MX-125) 30 parts,

[0077] 90 parts of methyl hexahydrophthalic anhydride (New Japan Physical and Chemical Co., Ltd. MH-700),

[0078] 6 parts of latent curing accelerator (NOVACURE HX-3741),

[0079] Thixotropic agent: 20 parts of nanometer calcium carbonate 322,

[0080] Filler: 800 mesh spherical fused silica powder 100 parts,

[0081] Pigment: 3 parts of titanium dioxide;

[0082] All latent curing accelerator (NOVACURE HX-3741), 10 parts of carboxyl-terminated liquid nitrile-modified epoxy resin (ADK-EPR-4023) and 5 parts of cardanol shrinkage in the above-mentioned embodiment 2 components a...

Embodiment 3

[0085] The one-component high and low temperature resistant epoxy resin composition includes the following formula by weight:

[0086] Carboxyl-terminated liquid nitrile modified epoxy resin (ADK EPR-4023) 100 parts,

[0087] Cardanol Glycidyl Ether (India Atul K-513) 8 parts,

[0088] Polyacrylate core-shell composite particles (Japan Zeon F-351) 40 parts,

[0089] 95 parts of methyl hexahydrophthalic anhydride (New Japan Physical and Chemical Co., Ltd. MH-700),

[0090] Latent curing accelerator (Fujicure FXR-1081) 8 parts,

[0091] Thixotropic agent: 3 parts of modified nano-silica (Wacker Chemical H-18),

[0092] Filler: 60 parts of 800 mesh spherical fused silica powder,

[0093] Pigment: 2 parts of pigment carbon black C66;

[0094] According to the proportioning, all the latent curing accelerator (Fujicure FXR-1081) in the above-mentioned embodiment 3 components and 10 parts of carboxyl-terminated liquid nitrile modified epoxy resin (ADK EPR-4023) and 5 parts of ca...

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Abstract

The invention provides a single-component high / low-temperature-resistant epoxy resin composition which comprises the following ingredients in parts by weight: 100 parts of rubber cross-linked modified epoxy resin, 0-20 parts of cardanol-type glycidol ether, 80-120 parts of alicyclic acid anhydride curing agent, 0.5-10 parts of latent curing accelerator, 10-40 parts of polyacrylate core-shell compound particle toughener, 2-20 parts of thixotropic agent and 50-100 parts of filler. The epoxy resin composition has the advantages of high toughness, high / low-temperature alternation resistance, simple preparation technique, low viscosity and favorable flowability, and can greatly enhance the packaging reliability and durability of electronic devices.

Description

technical field [0001] The invention relates to an adhesive material, in particular to a single-component high and low temperature resistant epoxy resin composition used for sealing, potting and impregnating electronic components, transformers, current transformers, motors and the like and a preparation method thereof. Background technique [0002] Cured epoxy resin has many advantages, such as excellent mechanical properties, electrical insulation properties, heat resistance, corrosion resistance, and good bonding properties with various materials, so it is widely used in dry-type transformers, transformers, etc. , Reactors, motors, generators and other electrical equipment for the overall perfusion or impregnation seal. One-component epoxy potting adhesive is widely used in electronics manufacturing industry due to its low viscosity, convenient use and high production efficiency. [0003] Rubber cross-linked modified epoxy resin is a new type of modified epoxy resin syste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/08C09J11/04
Inventor 郭亚昆王永明高之香李建武朱兴明吴子刚
Owner GUANGDONG TGPM AUTOMOTIVE IND GRP
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