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521 results about "Effective surface" patented technology

Device and method for piercing a patient's skin with an injector whilst reducing pain caused by the piercing

This invention generally relates to an injector for painlessly piercing a region of a patient's skin. The injector comprises (a) piercing mechanism, comprises: (i) at least one reciprocating needle; said at least one needle is characterized by diameter K; said needle penetrates to depth D in said skin; said depth D is characterized by an initial temperature T; (ii) at least one container having a medicament to be delivered to said patient. The injector further comprises (b) cooling mechanism, comprises at least one attachable cooling means, especially a Peltier Cooled Cold Plate (PCCP), in connection with a radiator and sufficient DC power supply; said PCCP is characterized by an effective surface area S; said effective surface S is optimized such that said pain caused by said piercing is eliminated; said PCCP is characterized by temperature TiPCCP; said PCCP adapted for cooling a portion of said skin prior to and/or during and/or after piercing thereof by said piercing mechanism such that the cooling is obtained at said depth D; said depth D is cooled from said initial temperature T to a final temperature TD(ΔT) in a period of time t (dt) by said PCCP; said final temperature TD Of said depth D is higher than about 0 and lower than about 13 degrees C.; said ΔT/dt is optimized such that said pain caused to said patient is eliminated. The injector further comprises (c) at least one aperture through which said needle is reversibly piercing said skin.
Owner:SINDOLOR MEDICAL

Prediction model for color separation, calibration and control of printers

The present invention facilitates the calibration of printers and the color separation of input images into a set of inks by disclosing methods and systems for populating device-calibration lookup tables. The disclosed methods and systems rely on a comprehensive spectral prediction model which is capable of predicting at a high accuracy the reflectance spectra of halftone ink patches. The comprehensive spectral prediction model is composed of a first part predicting the reflection spectra as a function of physical (mechanical) surface coverages and of a second part comprising functions mapping nominal surface coverages to effective surface coverages. These mapping functions are calibrated by halftone patch wedges printed alone and by half-tone patch wedges printed in superposition with one or several solid inks. The part of the comprehensive spectral prediction model predicting the reflection spectra relies on a weighted average between one component behaving according to the Clapper-Yule model and another component behaving as the spectral Neugebauer model, extended to include multiple internal reflections at the paper-air boundary. The disclosed methods and systems can perform the color separation as well as the calibration of printers printing with standard cyan, magenta, and yellow inks as well as with inks comprising standard and non-standard inks such as Pantone inks (custom inks). They are also used for performing precise undercolour removal in order to carry out the color separation of images into cyan, magenta, yellow and black inks. They can further be used to carry out the color separation of images into cyan, magenta, yellow, black, light cyan and light magenta inks. In addition, the disclosed methods and systems can be used for printer control, i.e. to control printer actuation parameters in different types of printers e.g. liquid ink professional printers (offset, gravure, letterpress), electrophotographic printers, ink-jet printers, thermal transfer printers and in dye-sublimation printers.
Owner:ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)

Catalyst for selective catalytic reduction of nitric oxide and preparation method of catalyst

The invention belongs to the technical field of environmental protection and catalysts, and particularly relates to a catalyst for selective catalytic reduction of nitric oxide and a preparation method of the catalyst. The catalyst comprises a molecular sieve and transition metal supported on the molecular sieve and is prepared from the molecular sieve and a transition metal precursor, and the molecular sieve is dried to remove adsorbed water; then the metal precursor is mixed with water, stirring is carried out for dissolving, and a solution is prepared; the prepared solution and the prepared molecular sieve are stirred and mixed, standing, drying and calcining are carried out, the product is cooled to normal temperature, and the catalyst for selective catalytic reduction of nitric oxide is obtained. The molecular sieve is used as a carrier, an effective surface is provided for adsorption and reacting of nitric oxide, high dispersion of active components can be kept, and the use amount of the active components can be reduced. By means of the characteristics of the carrier and the synergetic effect among different kinds of metals, the low temperature activity of the catalyst is improved, and the active window temperature range of the catalyst is widened. The preparation method of the catalyst is simple, easy to carry out and free of pollution.
Owner:碗海鹰

Stackable semiconductor device and fabrication method thereof

The invention provides a stackable semiconductor device and a fabrication method thereof, including providing a wafer having a plurality of dies mounted thereon, both the die and the wafer having an active surface and a non-active surface opposing one another respectively, wherein each die has a plurality of solder pads formed on the active surface thereof and a groove formed between adjacent solder pads to form a first metal layer therein that is electrically connected to the solder pads; subsequently thinning the non-active surface of the wafer to where the grooves are located to expose the first metal layer therefrom, and forming a second metal layer on the non-active surface of the wafer for electrically connecting with the first metal layer; and separating the dies to form a plurality of stackable semiconductor devices. Thereby, the first and second metal layers formed on the active surface and the non-active surface of the semiconductor device can be stacked and connected to constitute a multi-die stack structure, thereby increasing integration without increasing the area of the stacked dies. Further, the problems known in the prior art of poor electrical connection, complicated manufacturing process and increased cost as a result of using wire bonding and TSV can be avoided.
Owner:SILICONWARE PRECISION IND CO LTD
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