Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof
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A flat packaging and product technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., to achieve the effect of broad market application prospects
Inactive Publication Date: 2013-12-25
HUATIAN TECH XIAN
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[0006]However, due to limitations such as technical difficulties, it is currently difficult to promote AAQFN products in the market, especially in terms of reliability, which directly affects the use and life of products. Become the technical difficulty of AAQFN package
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[0019] As shown in the figure, an AAQFN frame product copper-free flat package is mainly composed of a lead frame 1, an electroplated silver circuit 2, a chip 3, a bonding wire 4, a plastic package 5 and a green oil coating layer 6. The electroplated silver circuit 2 is a silver layer formed by electroplating on the lead frame 1, the chip 3 is connected to the lead frame 1 by adhesive, the bonding wire 4 is directly connected from the chip 3 to the electroplated silver circuit 2 on the lead frame, and the plastic package The body 5 surrounds the lead frame 1, the electroplated silver circuit 2, the chip 3 and the bonding wire 4, and the green oil coating layer 6 is coated on the etched back side of the lead frame 1, and the chip 3, the bonding wire 4 and the electroplated silver circuit 2 It constitutes the power supply and signal channel of the circuit.
[0020] The plastic package 5 supports and protects the chip 3 and the bonding wire 4, and the lead frame 1 is only used as...
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Abstract
The invention discloses a copper-free flat packaging piece of an AAQFN frame product and a manufacturing process thereof. The packaging piece is mainly formed by a lead frame, electrosilvering circuits, a chip, bonding wires, a plastic package body and a green oil coating layer. The electrosilvering circuits are silver layers formed on the lead frame through electroplating, the chip is connected with the lead frame through adhesive tape, the bonding wires are connected with the electrosilvering circuits on the lead frame directly from the chip, the plastic package body surrounds the lead frame, the electrosilvering circuits, the chip and the bonding wires, the green oil coating layer coats the etched back face of the lead frame, and the chip, the bonding wires and the electrosilvering circuits form a power supply and signal channel. The manufacturing process comprises the steps of wafer thinning, scribing, formation of the electrosilvering circuits on the lead frame, chip installing (chip adhering), bonding, plastic package, post curing, etching of back face of the frame, green oil coating, printing, cutting, detecting, packaging and storing. According to the copper-free flat packaging piece and the manufacturing process, packaging reliability of products is directly improved, and cost is reduced to a certain degree.
Description
[0001] technical field [0002] The invention belongs to the technical field of integrated circuit packaging, and is a new type of NCAAQFN (Non-Copper AAQFN) package in which electroplated silver is used instead of copper as a circuit on the basis of the design of ordinary AAQFN packages, specifically a copper-free flat AAQFN frame product. Packages and their manufacturing processes. Background technique [0003] Integrated circuits are the core of the information industry and high-tech, and the foundation of economic development. Integrated circuit packaging is the main component of the integrated circuit industry, and its development has been accompanied by the increase in its functions and device count. Since the 1990s, it has entered the development track of multi-pin count, narrow pitch, and miniaturization. Carrierless grid array package (AAQFN) is a new packaging form born to adapt to the rapid development of electronic products, and it is an indispensable product ...
Claims
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