Electroplating layer stress measurement device
A stress measurement and electroplating technology, applied in the direction of force measurement by measuring the change of magnetic properties of materials caused by applied stress, can solve the dispersion, sometimes zero, sometimes fluctuation, can not effectively eliminate the pointer drive wheel static friction, coating stress minor issues
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[0059] refer to figure 1 , The electroplating layer stress measuring device of the present invention is composed of an AC excitation power supply, a first electroplating power supply, a second electroplating power supply, a measuring sensor, a calibration sensor, a cathode sheet 2 and a computer. Among them, the frequency of the AC excitation power supply is 400 Hz, and the current is 200 mA, which remain unchanged during the measurement. The first electroplating power supply and the second electroplating power supply are pulse power supplies that can be modulated, and can also be converted into DC power supplies. Wherein the first electroplating power supply provides the electroplating current Id1 for the cathode sheet 2 and the corresponding anode plate 3, and the second electroplating power supply provides the electroplating current Id2 for the first magnetic sensitive sheet C of the measuring sensor and the corresponding anode plate 10, and Id1 and Id2 are measured deter...
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