PCB electrogilding technology

Abstract

The invention discloses the PCB manufacturing technology. The PCB electrogilding technology comprises steps of, line manufacturing, a line is manufactured on a line board after copper plating; nickel plating, nickel plating is carried out in a nickel plating region of the line board; drying, the line board after nickel plating is dried; silkscreen, silkscreen for the line board is carried out by utilizing photosensitive printing ink; pre-baking, the line board after silkscreen is pre-baked; film contraposition, film contraposition for the line board is carried out; exposure development, exposure development for the film after contraposition is carried out; post-baking, post-baking for the line board after exposure development is carried out; acid pickling, acid pickling for the line board after post-baking is carried out; qualified-city-water washing, qualified-city-water washing for the line board after acid pickling is carried out; deionized water washing, deionized water washing for the line board after qualified-city-water washing is carried out; electrogilding, electrogilding for the nickel plating region of the line board is carried out; film removing, film removing for the line board after electrogilding is carried out; and etching, etching for the line board after film removing is carried out. The PCB electrogilding technology saves gold and greatly reduces production cost of enterprises.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a PCB electro-gold process. Background technique [0002] Printed circuit boards (PCBs) are used in almost all electronic devices we can see, ranging from electronic watches, calculators, general-purpose computers, to computers, electronic communication equipment, military weapon systems, etc., as long as there are electronic components such as integrated circuits Components, the electrical interconnection between them all use PCB. Printed circuit boards are formed by setting conductive patterns for electrical connections between electronic components on an insulating substrate, and its manufacturing process is relatively complicated. In order to improve the conductivity, solderability and oxidation resistance of printed circuit boards, the copper foil surface of the conductive pattern must be plated with nickel and gold on the printed circuit boards with higher r...

AI Technical Summary

Problems solved by technology

[0003] In the traditional electro-gold process of printed circuit boards, all conductive patterns need to be plated with gold, so a large amount of gold is consumed, and electro-gold in parts that do not need electro-gold leads to waste of precious metals and greatly increases the cost of the enterprise. Cost of production

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